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| Application No. | Application Title | Issue Date |
| 20130127071 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a ... | 05/23/2013 |
| 20130090413 | WATER-DISPERSIBLE EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF An object of the present invention is to provide a water-soluble epoxy resin that has high water-solubility, maintains emulsion stability for epoxy resin, and is capable of forming a cured product that has excellent coating film strength corrosion resistance and water r... | 04/11/2013 |
| 20120094135 | WATER REDUCIBLE COATING COMPOSITIONS INCLUDING CARBOXY ESTER KETALS, METHODS OF MANUFACTURE, AND USES THEREOF A water-reducible coating composition includes a water-reducible polymer binder; water; and a ketal adduct of formula (1) as well as coated substrates and films formed from the compositions. The films are use... | 04/19/2012 |
| 20110195195 | WATER-BORNE PAINTS BASED ON EPOXY RESINS An aqueous epoxy resin system AB is described comprising an aqueously dispersed epoxy resin A having, on the average, at least one epoxy group per molecule, and a water-soluble or water-dispersible curing agent B which comprises the reaction product of an amine B1 havin... | 08/11/2011 |
| 20050004309 | Thermally curable binding agents A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), an... | 01/06/2005 |
