|Application No.||Application Title||Issue Date|
|20130127071||EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME|
The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (F): (A) an epoxy resin; (B) a phenol resin; (C) a curing accelerator; (D) an inorganic filler; (E) a hydrotalcite compound; and (F) a ...
|20130090413||WATER-DISPERSIBLE EPOXY RESIN, WATER-BASED EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF|
An object of the present invention is to provide a water-soluble epoxy resin that has high water-solubility, maintains emulsion stability for epoxy resin, and is capable of forming a cured product that has excellent coating film strength corrosion resistance and water r...
|20120094135||WATER REDUCIBLE COATING COMPOSITIONS INCLUDING CARBOXY ESTER KETALS, METHODS OF MANUFACTURE, AND USES THEREOF|
A water-reducible coating composition includes a water-reducible polymer binder; water; and a ketal adduct of formula (1)
as well as coated substrates and films formed from the compositions. The films are use...
|20110195195||WATER-BORNE PAINTS BASED ON EPOXY RESINS|
An aqueous epoxy resin system AB is described comprising an aqueously dispersed epoxy resin A having, on the average, at least one epoxy group per molecule, and a water-soluble or water-dispersible curing agent B which comprises the reaction product of an amine B1 havin...
|20050004309||Thermally curable binding agents|
A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), an...