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| Application No. | Application Title | Issue Date |
| 20120079773 | METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION REGION FOR EDDY CURRENT END-POINT DETECTION Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.... | 04/05/2012 |
| 20120083192 | HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.... | 04/05/2012 |
| 20120048625 | Functionally Leached PCD Cutter A cutting table includes a cutting surface, an opposing surface, a cutting table outer wall, and one or more slots. The cutting table outer wall extends from the circumference of the opposing surface to the circumference of the cutting surface. The slots extend from a p... | 03/01/2012 |
| 20120047813 | CUTTING FLUID FOR WAFER PROCESSING A cutting fluid for processing is revealed. The cutting fluid for wafer processing includes a cutting solvent, a plurality of cutting particles and a surfactant that induces hydrogen bonding. The surfactant that induces hydrogen bonding contains amine functional groups ... | 03/01/2012 |
| 20120036790 | Abrasive Material Comprising Reactive Inorganic Endothermic Compound The invention provides a nonwoven fabric abrasive material, which comprises a reactive inorganic endothermic compound.... | 02/16/2012 |
| 20110289855 | Superabrasive Cutting Element and Manufacturing Method with High Degree of Control of Distribution and Crystallographic Orientation of the Micro Cutting Edges An abrasive element comprises a body of crystalline abrasive material. The body has an array of cutting elements formed of crystalline abrasive material which projects from a surface of the body. The shape, size and form of the projections is controlled in the productio... | 12/01/2011 |
| 20110252710 | Abrasive tools made with a self-avoiding abrasive grain array Abrasive tools contain abrasive grains oriented in an array according to a non-uniform pattern having an exclusionary zone around each abrasive grain, and the exclusionary zone has a minimum dimension that exceeds the maximum diameter of the desired grit size range for ... | 10/20/2011 |
| 20110159793 | METHOD OF MANUFACTURING POLISHING PAD HAVING DETECTION WINDOW AND POLISHING PAD HAVING DETECTION WINDOW A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishi... | 06/30/2011 |
| 20110147638 | AZEOTROPIC AND AZEOTROPE-LIKE COMPOSITIONS OF Z-1,1,1,4,4,4-HEXAFLUORO-2-BUTENE, TRANS-1,2-DICHLOROETHYLENE, AND CYCLOPENTANE Azeotropic or azeotrope-like compositions are disclosed. The azeotropic or azeotrope-like compositions are mixtures of Z-1,1,1,4,4,4-hexafluoro-2-butene, trans-1,2-dichloroethylene and a third component. Also disclosed are compositions where the third component is cyclo... | 06/23/2011 |
| 20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality... | 03/31/2011 |
| 20110036640 | DIAMOND IMPREGNATED BIT WITH AGGRESSIVE FACE PROFILE A drill bit includes a crown defining a central axis. The crown includes at least one segment. The segment includes a planar portion and a plurality of surface features continuous with and extending away from the planar portion. The surface features are discontinuous wi... | 02/17/2011 |
| 20100251623 | METHOD OF ASSEMBLING INNER DIAMETER GRINDING TOOL A tool for grinding an inner diameter even when holders having grindstones are axially connected. A gap enclosed by the inner peripheral surface of a divided tool holder, a draw bar and O-rings is formed in a state in which the draw bar is inserted into a tool holder in... | 10/07/2010 |
| 20100227533 | Chemical Mechanical Polishing Pad Having Window With Integral Identification Feature Chemical mechanical polishing pads having a window with an integral identification feature, wherein the window has a polishing face and a nonpolishing face, wherein the integral identification feature is observable through the window, and wherein the integral identifica... | 09/09/2010 |
| 20100159813 | Abrasive Disc Construction An improved abrasive disc for use with an angle grinder is disclosed. The grinder is of the type having a threaded spindle. The disc is of the type having: a central portion defining a threaded bore for receiving said spindle; and abrasive material surrounding the centr... | 06/24/2010 |
| 20100119460 | Azeotrope-Like Compositions Of 2,3,3,3-Tetrafluoropropene And 3,3,3-Trifluoropropene Provided are azeotropic or azeotrope-like mixtures of 2,3,3,3-tetrafluoropropene (1234yf) and 3,3,3-trifluoropropene (1243zf), as well as methods for producing and using the same.... | 05/13/2010 |
| 20100056032 | Method of manufacturing revolving whetstone and revolving whetstone manufactured by the same In a method of manufacturing a revolving whetstone comprising a central portion in which a whetstone center hole into which a whetstone driving shaft of a grinder is inserted is arranged and a disk-shaped whetstone body that has an effective whetstone circular portion a... | 03/04/2010 |
| 20100009601 | POLISHING PAD, POLISHING METHOD AND METHOD OF FORMING POLISHING PAD A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least... | 01/14/2010 |
| 20100003904 | High speed flat lapping platen, raised islands and abrasive beads A rotatable abrasive lapper machine platen assembly is attached to a lapper machine frame. The assembly has at least:
| 01/07/2010 |
| 20090280725 | Interpenetrating network for chemical mechanical polishing Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are me... | 11/12/2009 |
| 20090275272 | AUTOMATIC ROTATION KNIFE SHARPENER The present invention is directed to an automatic rotation knife sharpener where the crossed sharpening rods are automatically rotated each time a knife is passed down and through the sharpener. The rotation is derived through the means of a spring steel actuator mechan... | 11/05/2009 |
| 20090197413 | Polishing Composition and Polishing Method Using The Same The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains abrasive grains and an anionic surfactant having a monooxyethylene gr... | 08/06/2009 |
| 20090181608 | POLISHING PAD AND FABRICATING METHOD THEREOF A method of fabricating a polishing pad for polishing an article is described. The method includes providing a semi-finished polishing pad and then forming a moving track on the surface of the semi-finished polishing pad. The moving track substantially coincides with a ... | 07/16/2009 |
| 20090170410 | CHEMICAL-MECHANICAL PLANARIZATION PAD The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomer... | 07/02/2009 |
| 20090145045 | Methods for Orienting Superabrasive Particles on a Surface and Associated Tools Methods of making a superabrasive tool precursor are disclosed, along with such precursors and associated tools. Particularly, methods are disclosed for orienting superabrasive particles in a viscous binding material in order to provide tools based thereupon and having ... | 06/11/2009 |
| 20090139148 | SUPERABRASIVE GRAIN SETTING METHOD In a superabrasive grain setting method, a two-dimensionally developed coordinate preparation step is taken, wherein a non-cylindrical area of a mounting surface where a tangential line to the mounting surface in a plane including the axis of the manufacturing mold cros... | 06/04/2009 |
| 20090100764 | Composition for removing photoresist layer and method for using it A composition for removing a photoresist layer and a method for using it are disclosed. The composition comprises a chemical portion which includes water and chemical constituents dissolving or softening the photoresist layer and a mechanical portion which is abrasive p... | 04/23/2009 |
| 20090104856 | METHOD FOR PRODUCING CHEMICAL MECHANICAL POLISHING PAD There is provided a method for producing a chemical mechanical polishing pad, the method comprising the steps of (1) producing a sheet-shaped polymer molded article and (2) irradiating the sheet-shaped polymer molded article with an electron beam within an irradiation d... | 04/23/2009 |
| 20090075568 | POLISHING PAD, METHOD OF PRODUCING THE SAME AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a se... | 03/19/2009 |
| 20090053976 | Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not... | 02/26/2009 |
| 20090053983 | CHEMICAL MECHANICAL POLISHING PAD AND METHOD FOR MANUFACTURING SAME There is provided a chemical mechanical polishing pad which has a circular polishing surface and a non-polishing surface that is the back side of the polishing surface and incorporates an information recording medium that is readable or readable/writable by an electroma... | 02/26/2009 |
| 20090029628 | Abrasive products with splice marks and automated splice detection A coated abrasive product, comprising a first section and a second section, the first and the second sections being continuously joined together by a splice. The first section includes at least one first splice mark adjacent to the splice, wherein the first splice mark ... | 01/29/2009 |
| 20080287047 | POLISHING PAD, USE THEREOF AND METHOD FOR MAKING THE SAME The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive c... | 11/20/2008 |
| 20080271384 | CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or... | 11/06/2008 |
| 20080271382 | Method of fabricating abrasive having sliding and grinding effects An abrasive is fabricated to obtain sliding and grinding effects. In the abrasive, grinding particles are wrapped by a wrapping material. Various sizes and shapes of molds and micro components can be finely polished to obtain mirror-grade surfaces.... | 11/06/2008 |
| 20080248728 | Method for manufacturing polishing pad, polishing pad, and method for polishing wafer There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing pre... | 10/09/2008 |
| 20080220703 | ABRASIVE BACKING AND ABRASIVE CLOTH The present invention relates to an abrasive backing and abrasive cloth and more particularly, to an abrasive backing including an upper weave layer and a lower weave layer which are comprised with warps and wefts, and a binding yarn which connects the upper weave layer... | 09/11/2008 |
| 20080202036 | METHOD AND APPARATUS FOR TREATING THE SURFACE OF A MEDIA, SUCH AS A MAGNETIC HARD DISK, WHILE OPERATING, SUCH AS DURING DYNAMIC ELECTRICAL TESTING A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a... | 08/28/2008 |
| 20080190035 | Slurries, methods, and systems for polishing phase change materials A slurry for polishing a phase change material, such as Ge—Sb—Te, or germanium-antimony-tellurium (GST), includes abrasive particles of sizes that minimize at least one of damage to (e.g., scratching of) a polished surface of phase change material, an amount of forc... | 08/14/2008 |
| 20080182493 | Polishing pad with grooves to reduce slurry consumption A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrier, t... | 07/31/2008 |
| 20080163558 | Grinding Disc And Method For Production Thereof A grinding disc, comprising a particularly metal grinding disc base body and abrasive grains applied to a surface of the grinding disc base body, in particular, made from cubic boron nitride is disclosed. The abrasive grains are arranged on the surface of the grinding d... | 07/10/2008 |
