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| Application No. | Application Title | Issue Date |
| 20120052604 | CHEMICAL MECHANICAL POLISHING METHOD AND SYSTEM A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishin... | 03/01/2012 |
| 20120021671 | REAL-TIME MONITORING OF RETAINING RING THICKNESS AND LIFETIME A method and apparatus for monitoring the condition of a surface of a retaining ring disposed on a carrier head in a polishing module is described. In one embodiment, a method for monitoring at least one surface of a retaining ring coupled to a carrier head is provided.... | 01/26/2012 |
| 20110318992 | Adaptively Tracking Spectrum Features For Endpoint Detection A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of th... | 12/29/2011 |
| 20110300775 | Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system f... | 12/08/2011 |
| 20110294403 | WAFER PROCESSING METHOD, WAFER POLISHING APPARATUS, AND INGOT SLICING APPARATUS In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the ... | 12/01/2011 |
| 20110214801 | TIRE TREAD BUFFING APPARATUS AND METHOD A system and method for removing an outer layer of resilient material from an object to achieve a target outer dimension includes performing an initial cut at a cutting depth to remove an outer layer of the material. A parameter indicative of a work input to a cutter th... | 09/08/2011 |
| 20110136408 | METHOD FOR DETECTING AND/OR PREVENTING GRIND BURN The present invention provides a method of detecting and preventing grind burn from developing on a gear. The method includes performing acoustic emission testing while the gear is being ground during a grinding operation. The grinding wheel is evaluated during an eddy ... | 06/09/2011 |
| 20110097972 | METHOD FOR SHOT PEENING AND A MACHINE THEREFOR (AS AMENDED) A method for shot peening wherein the work is processed by being hit by shot materials that are shot by compressed air, and a machine for carrying out the method are provided. By the present invention the status of a work can be measured while the work is being processe... | 04/28/2011 |
| 20110097971 | GRINDING MACHINE AND GRINDING METHOD In a grinding machine, a retraction grinding is performed after a first advance grinding. Within a rotational range for a cylindrical workpiece to rotate from a present rotational phase to a target rotational phase in the retraction grinding, target grinding resistances... | 04/28/2011 |
| 20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality... | 03/31/2011 |
| 20110076923 | EYEGLASS LENS PROCESSING APPARATUS An eyeglass lens processing apparatus for processing a peripheral edge of an eyeglass lens, includes: a processing unit including a plurality of processing tools that process the peripheral edge of the eyeglass lens held by a lens chuck shaft; a calibrating lens; a mode... | 03/31/2011 |
| 20110076924 | METHOD OF DETERMINING THE LUBRICATION MECHANISM IN CMP The present invention is a method for obtaining data easily, accurately and effectively that may be used in determination of Sommerfeld Numbers and COF for CMP polishing. Using the Sommerfeld Numbers and COF values thus obtained the lubrication mechanism of CMP polishin... | 03/31/2011 |
| 20110021114 | ABRASIVE ARTICLE WITH PRECONDITIONING AND PERSISTENT INDICATORS An abrasive article with a backing having a first major surface and a second major surface opposed to the first major surface. A three-dimensional abrasive layer attached to the first major surface, the three-dimensional abrasive layer comprising a plurality of shaped a... | 01/27/2011 |
| 20100321814 | ELECTRICAL LAP GUIDES AND METHODS OF USING THE SAME An electrical lap guide having a first layer, the first layer including a material having a first resistivity, the first layer having first and second contact regions for electrically connecting the electrical lap guide to electrical leads; a second layer, the second la... | 12/23/2010 |
| 20100255757 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a p... | 10/07/2010 |
| 20100197197 | POLISHING PAD THICKNESS MEASURING METHOD AND POLISHING PAD THICKNESS MEASURING DEVICE A polishing pad thickness measuring method measures the thickness of a polishing pad attached to an upper surface of a surface plate. The polishing pad thickness measuring method measures a first distance between an upper surface of the polishing pad and a reference pos... | 08/05/2010 |
| 20100184356 | DEVICE FOR MACHINING AN OPHTHALMIC LENS The shaper device for shaping an ophthalmic lens comprises a blocking support on a blocking axis, a shaper tool, an electronic or computer unit for controlling the position of said shaper tool, and a man/machine interface connected to said electronic or computer unit, a... | 07/22/2010 |
| 20100178848 | PROTECTING DEVICE FOR PROCESSING TOOL OF MACHINE TOOL AND HONING MACHINE This is to present a protecting device for processing tool of machine tool used in a machine tool of a type of machining such as grinding and cutting a work by rotating a processing tool mounted on a rotary spindle, for protecting the processing tool by preventing from ... | 07/15/2010 |
| 20100159804 | METHOD OF OBSERVING PATTERN EVOLUTION USING VARIANCE AND FOURIER TRANSFORM SPECTRA OF FRICTION FORCES IN CMP A method of determining pattern evolution of a semiconductor wafer during chemical mechanical polishing prior to polishing end point by determining the periodic change in the variance and FT or FFT frequency spectra of shear force and change in variance and FT or FFT fr... | 06/24/2010 |
| 20100146774 | Method and Apparatus for Lapping Magnetic Head Slider, and Manufacturing Method of Thin-Film Magnetic Head A method of lapping a magnetic head slider includes a step of lapping a lapping surface of a row bar provided with a plurality of MR read head elements arranged along at least one line, a step of obtaining at least one output signal from at least one of the plurality of... | 06/17/2010 |
| 20100130101 | TWO-LINE MIXING OF CHEMICAL AND ABRASIVE PARTICLES WITH ENDPOINT CONTROL FOR CHEMICAL MECHANICAL POLISHING Embodiments described herein provide a method for polishing a substrate surface. The methods generally include storing processing components in multiple storage units during processing, and combining the processing components to create a slurry while flowing the process... | 05/27/2010 |
| 20100130099 | RETREAD TIRE BUFFING WITH MULTIPLE RESPONSE CURVES A method and apparatus for buffing tread from a tire carcass, the method comprising the steps of: receiving a signal from a sensor, the signal generated as a function of a distance between the sensor and a belt in the tire and a tire characteristic; selecting a signal r... | 05/27/2010 |
| 20100120331 | ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each ... | 05/13/2010 |
| 20100120333 | In-Line Wafer Thickness Sensing A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the sign... | 05/13/2010 |
| 20100120334 | AUTOMATED CHEMICAL POLISHING SYSTEM ADAPTED FOR SOFT SEMICONDUCTOR MATERIALS At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algo... | 05/13/2010 |
| 20100112902 | METHOD AND APPARATUS FOR PRECISION POLISHING OF OPTICAL COMPONENTS A method of polishing objects using an apparatus comprised of a rotary positioning device comprising a turret; a base mounted on the turret; a drive wheel connected to a rotatable shaft, the drive wheel having a perimeter, and the rotatable shaft disposed in a housing. ... | 05/06/2010 |
| 20100112903 | DISHING AND DEFECT CONTROL OF CHEMICAL MECHANICAL POLISHING USING REAL-TIME ADJUSTABLE ADDITIVE DELIVERY A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a ... | 05/06/2010 |
| 20100112899 | VISUAL FEEDBACK FOR AIRFOIL POLISHING A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system there is a model having a representation of a desired shape of the workpiece... | 05/06/2010 |
| 20100112900 | Predictive Method to Improve within Wafer CMP Uniformity through Optimized Pad Conditioning A method of conditioning a CMP polishing pad to attain a desired thickness profile in a polished layer on a wafer is disclosed. The incoming thickness profile of the layer to be polished, the thickness profile of the polishing pad, a polish rate of layer as a function o... | 05/06/2010 |
| 20100112901 | SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surfa... | 05/06/2010 |
| 20100105291 | METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger ... | 04/29/2010 |
| 20100105289 | GRINDING MACHINE AND GRINDING METHOD A grinding machine includes: a workhead (22) that rotatably supports a solid cylindrical or hollow cylindrical workpiece (W); a grinding wheel (43) that moves relative to the workhead (22) in a direction that intersects with a rotation axis of the w... | 04/29/2010 |
| 20100105292 | METHOD FOR MACHINING THAT COMBINES FINE BORING AND HONING AND MACHINING EQUIPMENT FOR THE EXECUTION OF THE METHOD According to a method for the fine machining of internal surfaces of bore holes in tools by fine boring and subsequent honing, the following steps are executed: Fine boring of at least one bore hole (131) in a tool (130) by means of a fine boring tool (... | 04/29/2010 |
| 20100099333 | METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER HEAD AND POLISHING PAD IN CHEMICAL MECHANICAL POLISHING A method for (a) determining the shear force between a wafer head and a polishing pad in a polishing tool using a CMP polishing tool with a plate above the wafer head which hangs or rests on the plate. The plate is connected to the CMP polishing tool by (b) low friction... | 04/22/2010 |
| 20100099334 | Eddy Current Gain Compensation In-situ monitoring during processing of a substrate includes processing a conductive film on a substrate in a semiconductor processing apparatus and generating a signal from an eddy current sensor during processing. The signal includes a first portion generated when the... | 04/22/2010 |
| 20100087123 | Method For Assessing Workpiece Nanotopology Using A Double Side Wafer Grinder A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and det... | 04/08/2010 |
| 20100081362 | APPARATUS AND METHODS FOR TESTING THE POLISHABILITY OF MATERIALS A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the s... | 04/01/2010 |
| 20100041314 | GEAR MATCHING DEVICE AND GEAR MACHINING APPARATUS Provided is a gear matching device capable of shortening time taken for the gear matching, and also to provide a gear machining apparatus using the gear matching device. For this purpose, provided is a gear matching device which performs gear matching to establish a rot... | 02/18/2010 |
| 20100035520 | Polishing Apparatus, Method of Manufacturing Semiconductor Device Employing this Polishing Apparatus, and Semiconductor Device Manufactured by this Method of Manufacturing Semiconductor Device While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on inp... | 02/11/2010 |
| 20100035517 | O.D. Centerless Grinding Machine In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wheel ... | 02/11/2010 |
