Bizarre Patents
User-operated amusement apparatus for kicking the user's buttocks
An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.
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| Application No. | Application Title | Issue Date |
| 20120003904 | METHOD AND APPARATUS FOR GRINDING A WORKPIECE SURFACE OF ROTATION A workpiece having a planar face the workpiece is rotated about a workpiece axis substantially perpendicular to the planar workpiece face, and a grinding disk centered on a disk axis is rotated about the disk axis. The disk has an annular planar disk face perpendicular ... | 01/05/2012 |
| 20110053470 | WORKPIECE DOUBLE-DISC GRINDING APPARATUS AND WORKPIECE DOUBLE-DISC GRINDING METHOD A workpiece double-disc grinding apparatus including a holder that supports a thin-plate-like workpiece from an outer periphery along a radial direction and is rotatable; a pair of static pressure support members that support the holder from both sides along an axial di... | 03/03/2011 |
| 20100247978 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MAGNETIC DISK A magnetic disk substrate manufacturing method of this invention includes a main surface polishing process that polishes disk-shaped glass substrates by the use of a polishing machine having a carrier pressed between a pair of polishing surface plates and adapted to mak... | 09/30/2010 |
| 20100216375 | CYLINDRICAL GRINDER AND CYLINDRICAL GRINDING METHOD OF INGOT A cylindrical grinder is disclosed that includes a support unit including an upper support device and a lower support device, in which an ingot of silicon single crystal is interposed in a direction of axis line between the upper support device and the lower support dev... | 08/26/2010 |
| 20100009605 | Method of manufacturing semiconductor wafer A method of manufacturing a semiconductor wafer, including a step of differentiating the glossiness of a front surface from that of a rear surface of the wafer by holding the semiconductor wafer in a wafer holding hole formed in a carrier plate, and simultaneously polis... | 01/14/2010 |
| 20090191796 | WAFER PROCESSING METHOD FOR PROCESSING WAFER HAVING BUMPS FORMED THEREON A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump regi... | 07/30/2009 |
| 20090061742 | METHOD FOR MANUFACTURING STORAGE MEDIUM According to an aspect of an embodiment, a method for manufacturing a storage medium includes providing a medium plate member for forming the storage medium and a guide member; and aligning the medium plate member and the guide member so that the medium plate member and... | 03/05/2009 |
| 20090004952 | Polishing apparatus and polishing method A polishing apparatus according to the present invention is suitable for use in polishing a periphery of a substrate such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold the workpiece, a polishing head configured to bring ... | 01/01/2009 |
| 20080299877 | Compact Disk Buffer System This invention comprises methods, devices, and systems for buffing, to repair and restore all types of compact discs. The restoration is essentially accomplished by interaction of rotating buffers with a compact disc on a rotating platform. For added effectiveness certa... | 12/04/2008 |
| 20080207094 | Method and apparatus for ultra thin wafer backside processing A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the r... | 08/28/2008 |
| 20080119117 | BRAKE ROTOR DEGLAZING TOOL A deglazing tool for use on motorcycle and ATV disc brake rotors. The tool is handheld and has abrasive pads that engage the rotor braking surface. The abrasive pads cut through the glaze on the braking surface of the rotor. Grip pressure on the handles maintains pad en... | 05/22/2008 |
| 20070218814 | Variable Speed Wet Sharpener And Methods Relating To Same A variable speed wet sharpener having a support, at least one grinding stone rotatably mounted on the support and having a contacting surface, a container of coolant disposed in a vicinity of the grinding stone for cooling the contacting surface of the grinding stone, a... | 09/20/2007 |
| 20070190913 | Polishing apparatus and polishing method A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechan... | 08/16/2007 |
| 20070135018 | Apparatus and method for processing magnetic head slider An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium comprises a discoid recording medium used as an abrasive material, a holding unit configured to ho... | 06/14/2007 |
| 20070111645 | Sweeper burnish head arrangement and method for burnishing a surface of a disc A skewed burnishing head arrangement is provided for burnishing the surface of a disc. The skewing of the burnishing head relative to the diameter perpendicular to a sweeping direction provides improved wiping action that catches loose particles and surface contaminatio... | 05/17/2007 |
| 20070010167 | Method and apparatus for reconditioning digital discs An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstat... | 01/11/2007 |
| 20060148386 | Method and device for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large quantit... | 07/06/2006 |
| 20060128277 | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface t... | 06/15/2006 |
| 20060073765 | Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool and ... | 04/06/2006 |
| 20050266778 | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, ... | 12/01/2005 |
| 20050250426 | Method and an element for surface polishing A surface polishing method in which a workpiece having at least one surface for polishing is set into rotation and has said surface pressed against a polishing element that is driven with motion in rotation or in translation, wherein said surface of the workpiece presen... | 11/10/2005 |
| 20050142990 | Texturing of magnetic disk substrates A method for texturing a substrate for a magnetic disk comprises abrading the substrate using nano-sized diamond particles (e.g. having a diameter less than or equal to 20 nm). A magnetic layer is then deposited over the substrate. Even when the texture is extremely smo... | 06/30/2005 |
