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| Application No. | Application Title | Issue Date |
| 20120028548 | RETAINING RING WITH SHAPED PROFILE Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter a... | 02/02/2012 |
| 20110207385 | Controlling Powder Delivery Rate in Air Abrasive Instruments A micro-abrasive blasting device and method for perturbation control may use a plurality of delivery conduits of various lengths and/or apertures, or a single moveable delivery conduit. The user is able to individually open and close bypass conduit pinch valve(s) extern... | 08/25/2011 |
| 20110183580 | APPARATUS AND METHOD FOR INTRICATE CUTS Certain embodiments disclosed herein relate to apparatuses and methods for intricate cuts. In particular, in one embodiment, a cutting apparatus is provided. The cutting apparatus includes a base member and an elongate member extending from the base member. The elongate... | 07/28/2011 |
| 20110143636 | OPTICAL DISK RESTORATION METHOD AND APPARATUS An optical disk restoration apparatus and optical disk restoration method are provided, which are capable of achieving a high level of capability of restoring a scratched optical disk, without consuming the time and labor of an operator, while reducing the production co... | 06/16/2011 |
| 20110104994 | SEMICONDUCTOR WAFER RE-USE USING CHEMICAL MECHANICAL POLISHING Methods and apparatus for reducing damage of a semiconductor donor wafer include the steps of: (a) rotating a polishing pad, rotating the semiconductor donor wafer, applying a polishing slurry to the polishing pad, and pressing the semiconductor donor wafer and the poli... | 05/05/2011 |
| 20110081840 | METHOD FOR POLISHING SEMICONDUCTOR WAFERS A method for polishing a plurality of semiconductor wafers includes providing a polishing pad containing an abrasive substance bonded in the polishing pad; providing an alkaline polishing agent at a volumetric flowrate greater than or equal to 5 liters/min.; polishing t... | 04/07/2011 |
| 20110070811 | POINT OF USE RECYCLING SYSTEM FOR CMP SLURRY The present invention generally relates to apparatus and method for recycling both polishing slurry and rinse water from CMP processes. The present invention also relates to rheology measurements and agglomeration prevention using centrifugal pumps.... | 03/24/2011 |
| 20110048935 | Sputtering Target with Low Generation of Particles Provided is a sputtering target with low generation of particles having a target surface in which intermetallic compounds, oxides, carbides, carbonitrides and other substances without ductility exist in a highly ductile matrix phase at a volume ratio of 1 to 50%, wherei... | 03/03/2011 |
| 20100314078 | COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated... | 12/16/2010 |
| 20100297920 | PRODUCING STRESS ON SURFACES An apparatus for producing stress on a surface, comprising one or more service assembly and one or more cleaning assembly. The service assembly comprises one or more means for applying dirt to said surface, or one or more means for scuffing said surface, or one or more ... | 11/25/2010 |
| 20100285723 | POLISHING APPARATUS A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad o... | 11/11/2010 |
| 20100270403 | RECYCLING METHOD AND RECYCLING APPARATUS OF SLURRY FOR USE IN WAFER POLISHING A recycling method of slurry for use in wafer polishing for reusing slurry used in a polishing process of semiconductor wafer, comprises the steps of: adding a dispersant to a recovered used-slurry to inhibit aggregation of the slurry; breaking up aggregates in such a m... | 10/28/2010 |
| 20100255762 | Tribological surface and lapping method and system therefor A conditioning process including the steps of: (a) providing a system including: (i) a workpiece having a metal working surface; (ii) a contact surface, disposed generally opposite the working surface, the contact surface including an organic, polymeric material and (ii... | 10/07/2010 |
| 20100227535 | System and Method for Polishing Glass A system for polishing a glass includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a... | 09/09/2010 |
| 20100221986 | Electron-Beam-Assisted EEM Method To provide an electron beam assisted EEM method that can realize ultraprecision machining of workpieces, including glass ceramic materials, in which at least two component materials different from each other in machining speed in a machining process are present in a ref... | 09/02/2010 |
| 20100216373 | METHOD FOR CMP UNIFORMITY CONTROL A method for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of leading edge of the polishing head with... | 08/26/2010 |
| 20100210189 | SLURRY DISPENSER FOR CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispense... | 08/19/2010 |
| 20100163010 | SLICING METHOD AND A WIRE SAW APPARATUS The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the ... | 07/01/2010 |
| 20100144246 | PLATEN AND ADAPTER ASSEMBLIES FOR FACILITATING SILICON ELECTRODE POLISHING A process is provided for polishing a silicon electrode utilizing a polishing turntable and a dual function electrode platen. The dual function electrode platen is secured to the polishing turntable and comprises a plurality of electrode mounts arranged to project from ... | 06/10/2010 |
| 20100144245 | METHODS AND APPARATUS FOR CHEMICAL-MECHANICAL POLISHING UTILIZING LOW SUSPENDED SOLIDS POLISHING COMPOSITIONS The present invention provides chemical-mechanical polishing (CMP) methods and apparatus suitable for polishing a substrate utilizing a low suspended solids slurry composition. The CMP methods of the invention comprise polishing a substrate with CMP slurry containing a ... | 06/10/2010 |
| 20100130101 | TWO-LINE MIXING OF CHEMICAL AND ABRASIVE PARTICLES WITH ENDPOINT CONTROL FOR CHEMICAL MECHANICAL POLISHING Embodiments described herein provide a method for polishing a substrate surface. The methods generally include storing processing components in multiple storage units during processing, and combining the processing components to create a slurry while flowing the process... | 05/27/2010 |
| 20100126488 | METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located sub... | 05/27/2010 |
| 20100120336 | Polishing method and polishing apparatus An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce s... | 05/13/2010 |
| 20100112912 | Retainer Ring A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a ... | 05/06/2010 |
| 20100112911 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the... | 05/06/2010 |
| 20100105296 | ULTRA SMOOTH FACE SPUTTER TARGETS AND METHODS OF PRODUCING SAME A method is provided to remove a thickness of a sputter target surface deformation layer to thereby achieve a reduced burn-in time during sputtering operations. The method comprises extrusion hone polishing of the target surface with a visco-elastic abrasive medium.... | 04/29/2010 |
| 20100062287 | METHOD OF POLISHING AMORPHOUS/CRYSTALLINE GLASS TO ACHIEVE A LOW RQ & WQ A method of polishing to reduce surface roughness of at least one surface of a glass ceramic substrate that includes an amorphous glass portion and a crystalline portion. The method comprises at least one step of polishing the surface using a polishing pad and an abrasi... | 03/11/2010 |
| 20100048106 | CHEMICAL MECHANICAL POLISHER HAVING MOVABLE SLURRY DISPENSERS AND METHOD A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an ar... | 02/25/2010 |
| 20090298393 | SLURRY SUPPLYING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER UTILIZING SAME A diluted slurry supplying apparatus utilized in a polishing apparatus for finishing a semiconductor wafer with a slurry containing colloidal silica and water-soluble polymer is provided. The polishing method comprises: a slurry supplier capable of supplying the slurry ... | 12/03/2009 |
| 20090298389 | SURFACE TREATING METHOD AND APPARATUS A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid is supplied to a polishing liquid passage that is provided in a central ... | 12/03/2009 |
| 20090258580 | AQUEOUS ABRASIVES DISPERSION MEDIUM COMPOSITION [Problems to be Solved by the Invention] An object of the present invention is to provide an aqueous abrasives dispersion medium composition which does not have a problem of inflammability and which is excellent in dispersion stability of a... | 10/15/2009 |
| 20090253355 | CMP ABRASIVE, METHOD FOR POLISHING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME, AND ADDITIVE FOR CMP ABRASIVE The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method fo... | 10/08/2009 |
| 20090242494 | Method and device for treating grinding water of lens grinding device A method and a device for treating grinding water of a lens grinding device are provided, in which grinding water is circulated via a grinding water tank, a filtering device, a lens grinding device main body by a pump, and an amount of grinding chips in a circulation cy... | 10/01/2009 |
| 20090247048 | Abrasive pump for an abrasive jet cutting machine An abrasive supply system may, for example, be used to supply abrasive particles such as garnet to a cutting nozzle of an abrasive jet cutter. According to an embodiment, the abrasive is propelled by a substantially constant flow rate gas source. According to an embodim... | 10/01/2009 |
| 20090247054 | METHOD TO PREVENT SLURRY CAKING ON CMP CONDITIONER A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member against the surface of the polishing member, and rinsing the surface of th... | 10/01/2009 |
| 20090233529 | METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC DISK, METHOD OF MANUFACTURING MAGNETIC DISK, AND POLISHING APPARATUS OF GLASS SUBSTRATE FOR MAGNETIC DISK A method of manufacturing a glass substrate for a magnetic disk is provided, by which polishing accuracy on an inner circumferential end face of a glass substrate is improved, and a thermal asperity trouble can be avoided. In a method of ma... | 09/17/2009 |
| 20090227186 | Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a centr... | 09/10/2009 |
| 20090191791 | Polishing method and polishing apparatus A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpi... | 07/30/2009 |
| 20090163114 | Systems and Methods for Dynamic Slurry Blending and Control Systems and methods for dynamic slurry blending and control are described. A method comprises applying a slurry to a wafer during a polishing process, detecting a wafer property during the polishing process, and changing a slurry property during the polishing process ba... | 06/25/2009 |
| 20090156102 | Pivoting hopper for particle blast apparatus A particle blast apparatus has a pivoting hopper, allowing the hopper exit to move from or between a first position at which the exit is aligned with the feeder entrance to a second position where the hopper exit is not aligned as such. The hopper may emptied or cleared... | 06/18/2009 |
