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| Application No. | Application Title | Issue Date |
| 20120045974 | METHOD OF PRODUCING SUBSTRATE FOR MAGNETIC RECORDING MEDIA There is provided a method of producing a substrate for magnetic recording media which is capable of efficiently removing alumina abrasive grains in the latter polishing step that have been stuck in the former polishing step during polishing of the substrate for magneti... | 02/23/2012 |
| 20110312255 | METHOD FOR MULTIPLE CUTOFF MACHINING OF RARE EARTH MAGNET A rare earth magnet block is cutoff machined into pieces by rotating a plurality of cutoff abrasive blades. Improvements are made by starting the machining operation from the upper surface of the magnet block downward, interrupting the machining operation, turning the m... | 12/22/2011 |
| 20110305875 | ELECTRONIC DEVICE ASSEMBLY Apparatus and methods for assembling an electronic device and components thereof are provided. The electronic device may include a housing and a cover inserted into an opening in the housing. The electronic device may also include a first assembly that may be inserted i... | 12/15/2011 |
| 20110300775 | Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system f... | 12/08/2011 |
| 20110281506 | Method For Surface-Treating Mirror-Finish Stainless Steel Workpiece The present invention discloses a method for surface-treating a mirror-finish stainless steel workpiece, which comprises steps: dividing the surface of a mirror-finish stainless steel workpiece into different grinding areas according to the depths of the scratches; sele... | 11/17/2011 |
| 20110281137 | ZR-RICH BULK AMORPHOUS ALLOY ARTICLE AND METHOD OF SURFACE GRINDING THEREOF A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface grinder for finish surface grinding. During the rough surface grinding, the r... | 11/17/2011 |
| 20110237165 | SANDPAPER AND METHOD OF USE THEREOF Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a ... | 09/29/2011 |
| 20110183585 | METHOD FOR THE GRINDING OF A PROFILE OF A WORKPIECE The invention relates to a method for the grinding of a profile (1) of a workpiece (2) with a gear or profile grinding machine (3), wherein the profile (1) which has to be ground is successively at first ground during a roughing operation wit... | 07/28/2011 |
| 20110159788 | METHOD FOR PRODUCING PULLEY FOR BELT-TYPE CONTINUOUSLY VARIABLE TRANSMISSION A method includes a grinding step of forming the shape of a contact surface, a grooving step of roughening the shaped contact surface to form grooves therein, and a contact surface lapping step of lapping the contact surface having the grooves with a lapping film to for... | 06/30/2011 |
| 20110147230 | Film Removal A method of removing coating from a substrate may include contacting a portion of coating on a surface of a substrate to an acid.... | 06/23/2011 |
| 20110127088 | POLYCRYSTALLINE ULTRA-HARD COMPACT CONSTRUCTIONS Polycrystalline ultra-hard compact constructions comprise a polycrystalline ultra-hard compact having a polycrystalline ultra-hard body attached to a substrate. A support member is attached to the compact by a braze material. The support member can have a one-piece cons... | 06/02/2011 |
| 20110104994 | SEMICONDUCTOR WAFER RE-USE USING CHEMICAL MECHANICAL POLISHING Methods and apparatus for reducing damage of a semiconductor donor wafer include the steps of: (a) rotating a polishing pad, rotating the semiconductor donor wafer, applying a polishing slurry to the polishing pad, and pressing the semiconductor donor wafer and the poli... | 05/05/2011 |
| 20110097974 | METHOD FOR POLISHING A SEMICONDUCTOR WAFER A method of polishing a semiconductor wafer using a holding system including a lined cutout the size of the semiconductor wafer that is fixed to a carrier. The method includes holding the semiconductor wafer in the cutout through adhesion of a first side of the semicond... | 04/28/2011 |
| 20110097975 | METHOD FOR PRODUCING A SEMICONDUCTOR WAFER A method for producing a semiconductor wafer sliced from a single crystal includes rounding an edge using a grinding disk containing abrasives with an average grain size of 20.0-60.0 μm. A first simultaneous double-side material-removing process is performed wherein th... | 04/28/2011 |
| 20110095222 | Method for the production of valve seats, and valve Disclosed is a valve comprising a valve seat, the surface of which is provided with several concentric grooves (6) with profiled elevations (7) that are embodied there between. The roughness of the valve seat surface, which is defined by the grooves and th... | 04/28/2011 |
| 20110086580 | WAFER BACK SIDE GRINDING PROCESS A wafer back side grinding process. A workpiece comprising a first assembly having a first semiconductor wafer and a second assembly having a second semiconductor wafer is provided. A first back side of the first semiconductor wafer is grinded by using the second assemb... | 04/14/2011 |
| 20110086753 | Method and System for Polishing Float Glass A system for polishing a float glass used for liquid crystal displays includes a lower unit configured to rotate a float glass to be polished, a head assembly configured to be rotatable in contact with the float glass, and a moving unit configured to move the head assem... | 04/14/2011 |
| 20110081839 | METHOD AND APPARATUS FOR POLISHING A CURVED EDGE A method and an apparatus for polishing a curved edge of a molded part. A surface of the curved edge is abraded by contacting a polishing surface of a first polishing wheel to the curved edge repeatedly in a first direction concurrent with a rotational spinning directio... | 04/07/2011 |
| 20110081836 | METHOD FOR GRINDING A SEMICONDUCTOR WAFER A method for processing a semiconductor wafer includes bringing at least one grinding tool in contact with the semiconductor wafer; removing material from the semiconductor wafer using the grinding tool; disposing a liquid medium having a viscosity of at least 3×10 04/07/2011 | |
| 20110081828 | EDGE BREAK DETAILS AND PROCESSING A method and an apparatus for shaping an edge at a juncture of two adjoining surfaces of a part. A first surface and a second surface of the part are abraded by contacting a polishing surface of a polishing wheel to the first surface and to the second surface. The polis... | 04/07/2011 |
| 20110045654 | GERMANIUM LAYER POLISHING In order to polish a layer of germanium (121), a first step of chemical-mechanical polishing of the surface (121a) of the germanium layer (121) is carried out with a first polishing solution having an acidic pH. The first polishing step is fo... | 02/24/2011 |
| 20110045748 | DOUBLE SIDE POLISHING APPARATUS AND CARRIER THEREFOR A double side polishing apparatus comprises an upper polishing plate and a lower polishing plate for polishing both sides of a wafer; a plurality of carriers, each including a center plate and a circumferential plate, the center plate having a mounting hole where the wa... | 02/24/2011 |
| 20110028074 | POLISHING METHOD FOR A WORKPIECE AND POLISHING TOOL USED FOR THE POLISHING METHOD Provided is a polishing tool capable of forming a high-quality surface of a workpiece for a short period of time. A polishing tool includes: a rotation shaft arranged parallel to a sending direction of moving the polishing tool relative to a workpiece; and at least two ... | 02/03/2011 |
| 20110021116 | METHOD FOR PROCESSING AN EDGE OF A GLASS PLATE A method for beveling a thin glass plate by simultaneously grinding an edge of the glass using multiple abrasive cup wheels, wherein the edge of the glass plate is extended from the fixturing device. The extension of the glass plate allows the glass plate to bend in res... | 01/27/2011 |
| 20110008649 | GLASS SUBSTRATE FOR INFORMATION RECORDING MEDIUM AND METHOD FOR MANUFACTURING THE SAME, AND MAGNETIC RECORDING MEDIUM The present invention relates to a method for manufacturing a glass substrate for information recording medium, the method including: a lapping step of lapping a circular glass plate made of an alkali aluminosilicate glass; and a subsequent cerium oxide polishing step o... | 01/13/2011 |
| 20100321783 | METHOD OF MAKING ANTIREFLECTIVE ROUGHENED SURFACE AND LENS BARREL WITH ROUGHENED SURFACE MADE BY THE METHOD A method of turning the surface of a die, which is used to make a product, into an antireflective roughened one includes the steps of: a) producing a first roughness on the surface of the die; and b) producing a second roughness, which is smaller than the first roughnes... | 12/23/2010 |
| 20100311313 | WORKING OBJECT GRINDING METHOD A working object grinding method capable of grinding a working object reliably is provided. A working object 1 is irradiated with a laser beam while locating a converging point therewithin, so as to form a reformed region 7 in the working object 1 a... | 12/09/2010 |
| 20100282276 | REMOVING DEFECTS FROM PHOTOVOLTAIC CELL METALLIC SUBSTRATES WITH FIXED-ABRASIVE FILAMENT ROLLER BRUSHES Provided are methods and apparatuses for processing photovoltaic cell metallic substrates to remove various surface defects. In certain embodiments, a thin stainless steel foil is polished using a proposed method leading to a substantial, e.g., twice or more, increase i... | 11/11/2010 |
| 20100210188 | Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers The invention relates to a carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers, comprising cutouts for receiving the semiconductor wafers and passage openings for a polishing agent supplied during the polishing. Some of th... | 08/19/2010 |
| 20100197203 | METHOD FOR CREATING A COMPLEX SURFACE ON A SUBSTRATE OF GLASS A method for creating a concave section of glass from a glass substrate having flat surfaces includes the use of a grinding wheel and a turntable. The method includes the steps of securing the glass substrates to the turntable. The turntable is then spun to create a tur... | 08/05/2010 |
| 20100178851 | POLISHING APPARATUS AND POLISHING METHOD A polishing apparatus for polishing a periphery of a substrate includes a substrate holder configured to rotate the substrate, a first polishing section configured to polish the periphery of the substrate by bringing a polishing layer of a first polishing tool into cont... | 07/15/2010 |
| 20100167629 | METHOD OF DETERMINING PRESSURE TO APPLY TO WAFERS DURING A CMP A method for uniformly planarizing a wafer that includes determining a first wafer warped value at a first zone on the wafer, determining a second wafer warped value at a second zone on the wafer, and calculating a pressure difference based on the first and second wafer... | 07/01/2010 |
| 20100167628 | Method of Grinding Bar-Shaped Workpieces, Grinding Machine for Carrying Out the Method, and Grinding Cell in Twin Arrangement In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of doubl... | 07/01/2010 |
| 20100160170 | METHOD FOR POLISHING TAPE-SHAPED SUBSTRATE FOR OXIDE SUPERCONDUCTOR, OXIDE SUPERCONDUCTOR, AND BASE MATERIAL FOR OXIDE SUPERCONDUCTOR A surface polishing method for enhancing crystal orientation on the surface of a tapelike metal substrate in order to enhance the critical current of a superconducting thin film. In an oxide superconductor comprising a tapelike substrate, an intermediate layer formed on... | 06/24/2010 |
| 20100151771 | POLISHING APPARATUS AND POLISHING METHOD A polishing apparatus polishing a surface of a substrate, such as a semiconductor substrate. The polishing apparatus including a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a t... | 06/17/2010 |
| 20100144248 | DOUBLE-SIDE GRINDING APPARATUS FOR WAFER AND DOUBLE-SIDE GRINDING METHOD A double-side grinding apparatus is designed to be capable of minimizing thermal expansion of hydrostatic pad members and reducing nanotopography in performing wafer grinding. The double-side grinding apparatus is a double-side grinding apparatus for wafers that can sim... | 06/10/2010 |
| 20100112816 | METHOD OF REDUCING NON-UNIFORMITIES DURING CHEMICAL MECHANICAL POLISHING OF MICROSTRUCTURE DEVICES BY USING CMP PADS IN A GLAZED MODE In sophisticated CMP recipes, the material removal may be accomplished on the basis of a chemically reactive slurry material and a reduced down force, wherein the surface topography of a finally obtained material layer may be enhanced by using, at least in a final phase... | 05/06/2010 |
| 20100104806 | METHOD FOR POLISHING BOTH SIDES OF A SEMICONDUCTOR WAFER Both sides of a large diameter semiconductor wafer are polished by the following ordered steps:
| 04/29/2010 |
| 20100105293 | SPECTACLE LENS EDGING METHOD A lens holder (16) is attached to a processing target lens (2) such that a holder center (O) coincides with a processing center position (21) of the lens. An axial deviation measuring mark (81a, 81b) is displayed on the p... | 04/29/2010 |
| 20100099337 | Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner a... | 04/22/2010 |
