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| Application No. | Application Title | Issue Date |
| 20120015589 | CATHODICALLY-PROTECTED PAD CONDITIONER AND METHOD OF USE A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured... | 01/19/2012 |
| 20120003903 | Method of Regenerating a Polishing Pad Using a Polishing Pad Sub Plate A method for use of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the p... | 01/05/2012 |
| 20110318997 | APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD Apparatus and methods for conditioning a polishing pad include an arm adapted to support a conditioning disk; a drive mechanism coupled to the arm; and a flexible coupling between the drive mechanism and the conditioning disk adapted to allow the conditioning disk to ti... | 12/29/2011 |
| 20110319210 | CONTINUOUSLY VARIABLE TRANSMISSION METAL BELT, METHOD FOR MANUFACTURING METAL RING OF CONTINUOUSLY VARIABLE TRANSMISSION METAL BELT, AND METHOD FOR MEASURING SHAPE OF METAL RING OF CONTINUOUSLY VARIABLE TRANSMISSION METAL BELT A continuously variable transmission metal belt includes a metal ring assembly and metal elements. The metal ring assembly includes stacked endless metal rings. Each of the stacked endless metal rings includes a flat peripheral surface and a substantially semicircular e... | 12/29/2011 |
| 20110312254 | METHOD AND APPARATUS FOR DRESSING POLISHING PAD The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has b... | 12/22/2011 |
| 20110301691 | METHOD OF MANUFACTURING TUBULAR STRUCTURE, AND STENT A method of manufacturing a tubular structure is implemented by housing a tubular base, which has a side circumference surface formed in a bellows-like shape, in a polishing container, causing magnetic particles to flow along a circumferential direction of the tubular b... | 12/08/2011 |
| 20110300782 | APPARATUSES AND METHODS FOR CONDITIONING POLISHING PADS USED IN POLISHING MICRO-DEVICE WORKPIECES Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements proje... | 12/08/2011 |
| 20110294404 | Tunable Polish Rates By Varying Dissolved Oxygen Content A method and system for tunable removal rates and selectivity of materials during chemical-mechanical polishing using a chemical slurry or solution with increased dissolved oxygen content. The slurry can optionally include additives to improve removal rate and/or select... | 12/01/2011 |
| 20110275289 | CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a condition... | 11/10/2011 |
| 20110275288 | CMP PAD DRESSERS WITH HYBRIDIZED CONDITIONING AND RELATED METHODS The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, for example, a CMP pad conditioner is provided. Such a conditioner can include a support matrix, and a plurality of smooth superabrasive particles disposed ... | 11/10/2011 |
| 20110275290 | INTERNAL GEAR GRINDING MACHINE AND DRESSING METHOD FOR BARREL-SHAPED THREADED TOOL An object is to provide an internal gear grinding machine and a dressing method for a barrel-shaped threaded tool which make it possible to achieve space savings and reduce the size of a machine by simplifying dressing operation. To achieve the object, an internal gear ... | 11/10/2011 |
| 20110256812 | CLOSED-LOOP CONTROL FOR IMPROVED POLISHING PAD PROFILES Embodiments described herein use closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in-situ and in real... | 10/20/2011 |
| 20110244764 | CHEMICAL-MECHANICAL POLISHING PAD CONDITIONING SYSTEM Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable plat... | 10/06/2011 |
| 20110244763 | SIDE PAD DESIGN FOR EDGE PEDESTAL A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning de... | 10/06/2011 |
| 20110212670 | METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding ou... | 09/01/2011 |
| 20110201260 | Methods and Systems for Retaining Grinding Efficiency During Backgrinding of Through-Via Substrates Methods and systems for retaining grinding efficiency during a backgrinding process such as, for example, backgrinding of a through-via substrate such as an embedded through silicon via wafer. A grinding fluid may include a chemical agent that is configured to remove ac... | 08/18/2011 |
| 20110195640 | APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmiss... | 08/11/2011 |
| 20110183584 | METHOD AND APPARATUS FOR CONDITIONING A CMP PAD The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable we... | 07/28/2011 |
| 20110169233 | ICE SKATE BLADES AND SHARPENING MACHINES A sharpening machine generally includes a grinding wheel having a perimeter that is rotatable about a first axis. The sharpening machine includes an adjustment device adapted to be coupled to a structure of the sharpening machine. A shaft is mounted to the adjustment de... | 07/14/2011 |
| 20110171885 | METHOD FOR SHAPE MODIFICATION OF POLISHING PAD A polishing pad shape measured by a polishing pad shape measuring apparatus is modified into a target shape of a polishing pad by using a dressing tool so that a wafer has a desired surface shape. The invention is a method for shape modification of a polishing pad 14... | 07/14/2011 |
| 20110159787 | GEAR GRINDING MACHINE AND METHOD OF DRESSING A GRINDING TOOL A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and... | 06/30/2011 |
| 20110143640 | PAD CONDITIONER AND METHOD A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad there... | 06/16/2011 |
| 20110097977 | MULTIPLE-SIDED CMP PAD CONDITIONING DISK A conditioning tool for restoring a used CMP polishing pad to an operable condition. The tool includes a base that attaches to a driven machine and has a surface from which a shoulder protrudes that receives a peripheral edge of a disk. The disk has two opposing surface... | 04/28/2011 |
| 20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality... | 03/31/2011 |
| 20110065365 | GRINDING METHOD AND GRINDING APPARATUS FOR POLISHING PAD FOR USE IN DOUBLE-SIDE POLISHING DEVICE The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus. Specifically, the present invention provides a method of, in a doub... | 03/17/2011 |
| 20110045739 | Method and Apparatus for Roll Grinding In one aspect, a process for roll grinding employs a grinding wheel that is porous and permeable. In another aspect, a process for grinding mill rolls includes dressing the grinding wheel as the wheel traverses the surface of a mill roll. Other aspects relate to a syste... | 02/24/2011 |
| 20110039479 | DRESSING TOOL A dressing tool (100, 200, 300, 400, 500) for conditioning of grinding bodies, especially ceramically bonded grinding bodies, the dressing tool (100, 200, 300, 400, 500) comprising a base body which bears a self-supporting function coating (120, 220, 32... | 02/17/2011 |
| 20110034112 | POLISHING APPARATUS, POLISHING AUXILIARY APPARATUS AND POLISHING METHOD A polishing apparatus, a polishing method and a polishing auxiliary apparatus which are able to suppress clogging of the rotating grindstone and polish the work while suppressing the damage thereof are provided. A polishing apparatus 1 according to the present in... | 02/10/2011 |
| 20110003538 | Pad Conditioner Dresser Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad... | 01/06/2011 |
| 20100330886 | Corrosion-Resistant CMP Conditioning Tools and Methods for Making and Using Same An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation... | 12/30/2010 |
| 20100311309 | DRESSING APPARATUS, DRESSING METHOD, AND POLISHING APPARATUS A dressing apparatus for use in a polishing apparatus for polishing a substrate to planarize a surface of the substrate is disclosed. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to pr... | 12/09/2010 |
| 20100291841 | Methods and Systems for Water Jet Assisted CMP Processing Methods and systems for removing dirt and/or debris from a CMP pad surface during CMP pad processing are provided. In one aspect, a method for removing debris from a CMP pad surface during CMP processing can include rotating a CMP pad having a polishing surface, and pre... | 11/18/2010 |
| 20100291840 | SYSTEM AND METHOD FOR CONDITIONING CHEMICAL MECHANICAL POLISHING APPARATUS USING MULTIPLE CONDITIONING DISKS A chemical mechanical polishing (CMP) apparatus provides for polishing semiconductor wafers and for conditioning the polishing pad of the CMP apparatus using multiple conditioning disks at the same time. The conditioning disks may be moved together or independently alon... | 11/18/2010 |
| 20100285723 | POLISHING APPARATUS A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad o... | 11/11/2010 |
| 20100273401 | Polishing apparatus and polishing method A polishing apparatus includes a polishing table with a polishing pad at an upper surface, and a conditioning disc carrying out conditioning of the polishing pad, and a moving mechanism (constructed, for example, from a swing arm) capable of moving the conditioning disc... | 10/28/2010 |
| 20100273402 | CMP conditioner and method of manufacturing the same A chemical mechanical polishing (CMP) conditioner has diamond abrasive grits adhered to a conditioning surface which faces and makes contact with an abrasive pad of a CMP machine. The diamond abrasive grit is adhered to the CMP conditioner body by a metal plating layer,... | 10/28/2010 |
| 20100248596 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP ... | 09/30/2010 |
| 20100248595 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abra... | 09/30/2010 |
| 20100248597 | EQUIPMENT AND METHOD FOR CLEANING POLISHING CLOTH The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving polishing efficiency. The equipment is used in a polishing apparatus, in whic... | 09/30/2010 |
| 20100240285 | POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME A polishing apparatus includes: a wafer polishing unit including a polishing surface plate, an abrasive supply part supplying an abrasive to a polishing pad placed on the polishing surface plate, and a wafer holding part holding a semiconductor wafer; and a dressing uni... | 09/23/2010 |
