Class 451/532 - Comprising fibers

Subclass of Class 451 - Abrading
Definition: Flexible-member tool having abrasive material embedded in
No. of applications: 36
Last issue date: 09/15/2011

Application No.	Application Title	Issue Date
20110223844	POLISHING PAD AND METHOD FOR MAKING THE SAME The present invention relates to a polishing pad and method for making the same. The polishing pad comprises a plurality of fibers and a high polymeric elastomer compound. The fibers cross each other to form a fabric substrate. The high polymeric elastomer compound incl...	09/15/2011
20110195646	POLISHING PAD HAVING A TRICOT MESH FABERIC AS A BASE Disclosed herein is a polishing pad having a substrate woven in a network form, capable of adsorbing dust generated during polishing of an object into meshes formed in the substrate to discharge the adsorbed dust to an external dust suction system or receive the dust in...	08/11/2011
20110171831	FABRIC CONTAINING NON-CRIMPED FIBERS AND METHODS OF MANUFACTURE A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a l...	07/14/2011
20110159794	ABRASIVE ARTICLE WITH OPEN STRUCTURE An abrasive article includes a fabric comprising a front face and a back face. The front face is formed of first knitted yarns. Each yarn of the first knitted yarns includes a plurality of filaments. A plurality of threads intertwines with the first knitted yarns and ex...	06/30/2011
20110003536	Polishing Pad and Method of Producing the Same The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The elastomer is embedded...	01/06/2011
20100330882	Polishing Pad and Method For Polishing A Semiconductor Wafer A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 μm, while supplying a polishing agent free of solid materials having a pH of at leas...	12/30/2010
20100221983	MULTI-LAYERED CHEMICAL-MECHANICAL PLANARIZATION PAD The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water in...	09/02/2010
20100173573	POLISHING PAD AND METHOD OF MANUFACTURING THE SAME Disclosed are a polishing pad used in a CMP process of a planar material such as a silicon wafer, plate glass for a display, etc. and a method for manufacturing the same. The polishing pad comprises a non-woven fabric consisting of ultrafine fibers and elastomeric polym...	07/08/2010
20100151776	Polishing body and device for removing stain A polishing body for removing stains is provided. The polishing body includes a fiber material or a fabric and a concave is formed in the polishing body to achieve the effects of slowly releasing polishing agent and effort-saving....	06/17/2010
20100144257	Abrasive pad releasably attachable to cleaning devices An abrasive pad is adapted to be removably attachable to a device. The abrasive pad has one side being adapted for scrubbing and the other side has a water resistant adhesive attached thereto. A removable cover is releasably attached to the adhesive whereby the removabl...	06/10/2010
20100099343	POLISHING PAD HAVING ABRASIVE GRAINS AND METHOD FOR MAKING THE SAME The present invention relates to a polishing pad having abrasive grains and a method for making the same. The polishing pad having abrasive grains includes a plurality of fibers, a plurality of abrasive grains and a high polymer. The fibers intersect each other to form ...	04/22/2010
20100015895	Chemical mechanical polishing pad having electrospun polishing layer Chemical mechanical polishing pads having an electrospun polishing layer are provided, wherein the electrospun polishing layer has a polishing surface that is adapted for polishing a semiconductor substrate. Also provided are methods of making such chemical mechanical p...	01/21/2010
20090170410	CHEMICAL-MECHANICAL PLANARIZATION PAD The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomer...	07/02/2009
20090170409	POLISHING PAD AND POLISHING METHOD A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matr...	07/02/2009
20090142989	Chemical-Mechanical Planarization Pad Having End Point Detection Window A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded s...	06/04/2009
20090098814	Polymeric Fiber CMP Pad and Associated Methods Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is l...	04/16/2009
20090047877	LAYERED-FILAMENT LATTICE FOR CHEMICAL MECHANICAL POLISHING The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, ...	02/19/2009
20090047883	Interconnected-multi-element-lattice polishing pad The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502,...	02/19/2009
20080318504	Abrasive sander for sanding device An abrasive sander includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for ab...	12/25/2008
20080287047	POLISHING PAD, USE THEREOF AND METHOD FOR MAKING THE SAME The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive c...	11/20/2008
20080261498	Abrasive belt for sanding device An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abra...	10/23/2008
20080227375	Ultra Fine Fiber Polishing Pad A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing...	09/18/2008
20080188168	Polishing material having polishing particles and method for making the same The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a high polymer elastic body. The base ma...	08/07/2008
20080171493	Polishing pad and method of producing the same The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is m...	07/17/2008
20080127572	NONWOVEN ABRASIVE ARTICLES AND METHODS OF MAKING THE SAME Lofty open nonwoven abrasive articles, unitized abrasive wheels, and convolute abrasive wheels include a dipodal aminosilane. Methods of making the abrasive articles are also included....	06/05/2008
20080085661	Polishing Pad Having Micro-Grooves On The Pad Surface A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the sol...	04/10/2008
20080085662	Polishing tool and polishing method and apparatus using same A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm³or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing ...	04/10/2008
20080020678	Discontinuous Abrasive Particle Releasing Surfaces Discontinuous abrasive particle releasing surfaces are disclosed that may be employed in low speed wet grinding, sanding, and polishing operations. The discontinuous abrasive surfaces of the present invention may consist of abrasive containing protrusions attached to ri...	01/24/2008
20070028526	ABRASIVE ARTICLE AND METHODS OF MAKING SAME A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and an apertured attachment interface with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least...	02/08/2007
20070028525	ABRASIVE ARTICLE AND METHODS OF MAKING SAME A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a polymer netting with hooks. The screen abrasive has an abrasive layer comprising a plurality of abrasive particles and at least one binder. The...	02/08/2007
20070010175	Polishing pad and method of producing same The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate; (b) impregnating the surface of the base material ...	01/11/2007
20060211340	Method and tool for maintenance of hard surfaces, and a method for manufacturing such a tool A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive ...	09/21/2006
20060205331	Sanding apparatus with molded elastomeric pad A sander comprises a body member molded of polypropylene to which a soft pad member is integrally molded or directly bonded thereto. Preferably, the material comprising the pad member is of a thermoplastic elastomer material, such as Santoprene®. Significantly, when th...	09/14/2006
20060116059	Fiber embedded polishing pad A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fiber...	06/01/2006
20050130569	Nonwoven abrasive material An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wad of the material when in use but...	06/16/2005
20050124274	Abrasive product The invention relates to an abrasive product intended to be driven in a particular grinding direction over the object to be abraded. The abrasive product is composed of parallel threads placed at a distance from one another and running in the grinding direction and tran...	06/09/2005

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Class 451/532 - Comprising fibers