Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Application No. | Application Title | Issue Date |
| 20120083189 | CHEMICAL MECHANICAL POLISHING APPARATUS HAVING PAD CONDITIONING DISK AND PRE-CONDITIONER UNIT A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the ba... | 04/05/2012 |
| 20120071069 | SURFACE TREATMENT DEVICE A surface treatment device includes an enclosure which has an opening through which the leading edge of an aerofoil passes. A sealing element is provided on the enclosure to seal the device to the surfaces of the aerofoil. An abrasive is located within the enclosure and... | 03/22/2012 |
| 20120040595 | Silicon Carbide, Sapphire, Germanium, Silicon and Pattern Wafer Polishing Templates Holder A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semi... | 02/16/2012 |
| 20120015593 | Apparatus for Supplying Constant Amount of Abrasive An apparatus for supplying a constant amount of abrasive which can supply even dry ice particles, ice particles, or the like as abrasive in a constant amount is provided. In order to take out abrasive contained in measuring holes 21 of a rotating disc 20, ... | 01/19/2012 |
| 20110275282 | HAND-POWERED POLISHING APPARATUS AND KIT WITH DIAMOND ABRASIVE AND METHOD A manual method and apparatus for removing scratches from automotive paint finishes by using a diamond abrasive compound applied to a handheld polishing disk/pad which effectively “scrubs” away the scratches. First, a first soft polishing pad is attached to a handgr... | 11/10/2011 |
| 20110263183 | POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS HAVING THE SAME The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus ha... | 10/27/2011 |
| 20110247554 | SYSTEM AND APPARATUS FOR PREPPING A SURFACE USING A COATING PARTICLE ENTRAINED IN A CONTINUOUS OR PULSED WATERJET OR AIRJET Prepping a surface entails entraining a coating particle into a fluid stream, directing the fluid stream containing the coating particle at the surface to be prepped to thereby prep the surface using the coating particle. The prepped surface can then be coated using the... | 10/13/2011 |
| 20110237163 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 09/29/2011 |
| 20110143636 | OPTICAL DISK RESTORATION METHOD AND APPARATUS An optical disk restoration apparatus and optical disk restoration method are provided, which are capable of achieving a high level of capability of restoring a scratched optical disk, without consuming the time and labor of an operator, while reducing the production co... | 06/16/2011 |
| 20110045749 | Multi-Layer Surface Treatment Pad For Motorized Device A multi-layer surface treating pad is disclosed. It has an upper layer suitable to serve as one part of a hook/loop type fastener system, a bottom layer which comprises an abrasive or polishing material, and a cleaning or other surface treating formulation positioned be... | 02/24/2011 |
| 20110045743 | SCRATCH REMOVAL AND DEVICE AND METHOD A scratch removal tool that includes a motor, a housing, a rotatable shaft operably coupled to the motor and movable in an axial direction along a length of the shaft, and a head assembly. The head assembly includes a shroud member having an open end, a pad member, a sl... | 02/24/2011 |
| 20100227535 | System and Method for Polishing Glass A system for polishing a glass includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a... | 09/09/2010 |
| 20100227537 | Glass Polishing System A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horiz... | 09/09/2010 |
| 20100227536 | Glass Polishing System A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit contacting with the glass and capable of being passively rotated due to the rotation of the glass, a moving unit for moving the upper unit in a horizonta... | 09/09/2010 |
| 20100221989 | FAN NOZZLE A fan nozzle for cleaning a surface with an abrasive blast media is constructed of a longitudinal body having an axial pathway through which the media is passed under pressure for release from a substantially rectangular cross-sectional outlet to release the media in a ... | 09/02/2010 |
| 20100210189 | SLURRY DISPENSER FOR CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispense... | 08/19/2010 |
| 20100206285 | WIRE SAW APPARATUS A wire saw apparatus having: a wire wound around grooved rollers and axially travels in a reciprocating direction; a nozzle for supplying a slurry; and a work-feeding mechanism feeding a work toward the wire, and slicing into wafers by pressing and feeding the work agai... | 08/19/2010 |
| 20100203815 | POLISHING PAD A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable i... | 08/12/2010 |
| 20100163010 | SLICING METHOD AND A WIRE SAW APPARATUS The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the ... | 07/01/2010 |
| 20100159809 | Polishing device with potary joint A polishing device for polishing optical lenses having a tiltable base part for directly or indirectly receiving a polishing plate, which base part is connected to a polishing spindle having an axis of rotation D in order to be rotationally driven, wherein a rotary join... | 06/24/2010 |
| 20100136886 | POLISHING APPARATUS AND SUBSTRATE PROCESSING APPARATUS The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a polishin... | 06/03/2010 |
| 20100126488 | METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located sub... | 05/27/2010 |
| 20100120336 | Polishing method and polishing apparatus An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce s... | 05/13/2010 |
| 20100112903 | DISHING AND DEFECT CONTROL OF CHEMICAL MECHANICAL POLISHING USING REAL-TIME ADJUSTABLE ADDITIVE DELIVERY A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a ... | 05/06/2010 |
| 20100112917 | SELF CLEANING AND ADJUSTABLE SLURRY DELIVERY ARM Embodiments of the invention provide a slurry delivery and rinse system for a chemical mechanical polishing (CMP) apparatus which is capable of self-cleaning, and which can adjustably deliver the slurry agent and rinse agent over a polishing pad. In one embodiment, the ... | 05/06/2010 |
| 20100112911 | METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY The present invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising a solid crescent shaped injector the concave trailing edge of which is fitted to the size and shape of the... | 05/06/2010 |
| 20100099339 | POLISHING PAD EDGE EXTENSION A method and apparatus for providing a substantially uniform pressure to a polishing surface from a conditioning element is provided. The method includes urging a conditioning disk against a polishing surface of a rotating polishing pad, moving the conditioning disk acr... | 04/22/2010 |
| 20100048106 | CHEMICAL MECHANICAL POLISHER HAVING MOVABLE SLURRY DISPENSERS AND METHOD A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an ar... | 02/25/2010 |
| 20090305609 | CMP PAD IDENTIFICATION AND LAYER RATIO MODELING The present invention relates to methods and apparatus for improving productivity of chemical mechanical polishing (CMP) processes and lowering operating costs of CMP systems. Embodiments of the present invention provide a method for improving the ratio of the layer thi... | 12/10/2009 |
| 20090298393 | SLURRY SUPPLYING APPARATUS AND METHOD OF POLISHING SEMICONDUCTOR WAFER UTILIZING SAME A diluted slurry supplying apparatus utilized in a polishing apparatus for finishing a semiconductor wafer with a slurry containing colloidal silica and water-soluble polymer is provided. The polishing method comprises: a slurry supplier capable of supplying the slurry ... | 12/03/2009 |
| 20090298389 | SURFACE TREATING METHOD AND APPARATUS A surface treating apparatus treats a substrate surface by rotating a cylindrical polishing member in a state where the polishing member makes contact with the substrate surface. A polishing liquid is supplied to a polishing liquid passage that is provided in a central ... | 12/03/2009 |
| 20090264057 | DRESSER FEEDING DEVICE A dresser supply device of a grinding tool which supplies powdery dresser to a grinding tool having an abrasive grain layer on cutting blade tips, the dresser supply device comprising: an air supply source which supplies air; a dresser supply air pipe including a base e... | 10/22/2009 |
| 20090264054 | POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the p... | 10/22/2009 |
| 20090247048 | Abrasive pump for an abrasive jet cutting machine An abrasive supply system may, for example, be used to supply abrasive particles such as garnet to a cutting nozzle of an abrasive jet cutter. According to an embodiment, the abrasive is propelled by a substantially constant flow rate gas source. According to an embodim... | 10/01/2009 |
| 20090247054 | METHOD TO PREVENT SLURRY CAKING ON CMP CONDITIONER A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member against the surface of the polishing member, and rinsing the surface of th... | 10/01/2009 |
| 20090117828 | Polishing apparatus and substrate processing apparatus The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming... | 05/07/2009 |
| 20090117834 | HEATLESS SLURRY SYSTEM A heatless slurry system for use with a glass removal apparatus for restoring a glass surface. The system comprises a slurry container and a pump mounted externally relative to the container to prevent heating of the slurry as the system is operated. Vacuum pressure is ... | 05/07/2009 |
| 20090047881 | COMBINATORIAL PROCESSING INCLUDING ROTATION AND MOVEMENT WITHIN A REGION Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of the m... | 02/19/2009 |
| 20090042482 | ROUGH POLISHING METHOD OF SEMICONDUCTOR WAFER AND POLISHING APPARATUS OF SEMICONDUCTOR WAFER A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer using a polishing apparatus includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silica supplied by a slu... | 02/12/2009 |
| 20090032006 | Wire saw process This invention provides a method for increasing the cutting performance of a wire saw, in cutting a substrate, by increasing the association of the abrasive particles in the cutting slurry and the cutting wire, the enhancement being caused by the use of thickening agent... | 02/05/2009 |
