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| Application No. | Application Title | Issue Date |
| 20110312254 | METHOD AND APPARATUS FOR DRESSING POLISHING PAD The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has b... | 12/22/2011 |
| 20110143640 | PAD CONDITIONER AND METHOD A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad there... | 06/16/2011 |
| 20110081848 | GRINDING TOOL AND METHOD OF MANUFACTURING THE GRINDING TOOL A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The last step is provid... | 04/07/2011 |
| 20100285723 | POLISHING APPARATUS A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad o... | 11/11/2010 |
| 20100248597 | EQUIPMENT AND METHOD FOR CLEANING POLISHING CLOTH The equipment for cleaning polishing cloth is capable of increasing pressure of washing water received by the polishing cloth, securely removing deposits from the polishing cloth and improving polishing efficiency. The equipment is used in a polishing apparatus, in whic... | 09/30/2010 |
| 20100062696 | RETRACTABLE WATER DISPENSER ARM FOR GRINDER/POLISHER A retractable water dispenser arm system for a grinder/polisher includes a flexible hose formed, in part in a loop and affixed at at least one location to a base of the grinder polisher. A spout is mounted to an end of the flexible hose. A biased tension arm engages the... | 03/11/2010 |
| 20100035525 | IN-SITU PERFORMANCE PREDICTION OF PAD CONDITIONING DISK BY CLOSED LOOP TORQUE MONITORING Polishing pads used in CMP machines are consumable components that are typically replaced after a specific number of wafers have been processed. The life of a polishing pad is optimized by controlling the rate of material removal from the polishing pad by the conditioni... | 02/11/2010 |
| 20090275274 | Polishing Pad Conditioner The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing thermal de... | 11/05/2009 |
| 20090264054 | POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the p... | 10/22/2009 |
| 20090247054 | METHOD TO PREVENT SLURRY CAKING ON CMP CONDITIONER A method of planarizing a semiconductor structure comprises moving a conditioning element on a surface of a polishing member, rotating the semiconductor structure relative to the polishing member against the surface of the polishing member, and rinsing the surface of th... | 10/01/2009 |
| 20090239454 | CMP CONDITIONER AND PROCESS FOR PRODUCING THE SAME A CMP conditioner having excellent corrosion resistance around abrasive grains includes a grindstone base having, formed on one side, an abrasive grain layer including abrasive grains fixed in a metallic bonding phase treated to form a first protective layer comprising ... | 09/24/2009 |
| 20090093199 | CLEANING DEVICE FOR CHEMICAL MECHANICAL POLISHING EQUIPMENT A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable cen... | 04/09/2009 |
| 20090093195 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided... | 04/09/2009 |
| 20090068937 | CMP Pad Conditioners with Mosaic Abrasive Segments and Associated Methods A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided... | 03/12/2009 |
| 20090036041 | CMP PAD DRESSER AND CMP APPARATUS USING THE SAME A CMP pad dresser for dressing a polishing pad of a CMP apparatus is provided with a dressing pad having abrasive grains, a purified water supply unit provided to an external periphery of the dressing pad, and a drive mechanism for sliding the dressing pad in a radial d... | 02/05/2009 |
| 20080311834 | System and Method for Cleaning a Conditioning Device A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to disp... | 12/18/2008 |
| 20080280537 | SWEETENING AND CLEANING SYSTEM FOR LAPPING MACHINES A sweetening and cleaning system that is used with one or more lapping machines to sweeten a lapping compound in a sweetening mode, and to clean parts of the system itself and parts of the one or more lapping machines with a cleaning compound in a cleaning mode. The sys... | 11/13/2008 |
| 20080254722 | PAD CONDITIONER A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardne... | 10/16/2008 |
| 20080233842 | DRESSER AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF DRESSING POLISHING PAD A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of t... | 09/25/2008 |
| 20080202568 | Cleaning cup system for chemical mechanical planarization apparatus The present invention is related to an improved cleaning cup arrangement for CMP systems that efficiently and effectively removes most, if not all, of any slurry material present on the abrasive conditioning disk and conditioner head as they are resting in the cup betwe... | 08/28/2008 |
| 20080194182 | Mechano-chemical polishing method for GaAs wafer A method of performing mechano-chemical polishing serving as a primary polishing operation for a GaAs wafer, by using a mechano-chemical polishing solution containing dichloroisocyanuric acid, sodium tripolyphosphate, sodium sulfate, sodium carbonate, and colloidal sili... | 08/14/2008 |
| 20080182490 | METHOD AND SYSTEM FOR PAD CONDITIONING IN AN ECMP PROCESS A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing p... | 07/31/2008 |
| 20080102737 | PAD CONDITIONING DEVICE WITH FLEXIBLE MEDIA MOUNT A method and apparatus for conditioning is provided. In one embodiment, a conditioning disk includes a plurality of conditioning elements each having an abrasive working surface, and a flexible foundation having the conditioning elements coupled thereto. The flexible fo... | 05/01/2008 |
| 20080090499 | PAD CONDITIONER, PAD CONDITIONING METHOD, AND POLISHING APPARATUS A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting... | 04/17/2008 |
| 20080070488 | Polishing method and polishing apparatus An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce s... | 03/20/2008 |
| 20080003931 | SYSTEM AND METHOD FOR IN-SITU HEAD RINSE A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfe... | 01/03/2008 |
| 20070232203 | Polishing method and polishing apparatus A polishing method can prevent scratches in a polished surface of a polishing object, caused by foreign matter adhering to a surface of a polishing member, thus preventing the attendant lowering of the yield even when the polishing object is large-sized. The polishing m... | 10/04/2007 |
| 20070066187 | Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishi... | 03/22/2007 |
| 20070042691 | Polishing pad cleaner and chemical mechanical polishing apparatus comprising the same A polishing pad cleaner of a chemical mechanical polishing apparatus throughly and efficiently cleans the polishing pad of the apparatus. The head of the polishing pad cleaner includes a nozzle support plate, a plurality of nozzles mounted to the nozzle support plate, a... | 02/22/2007 |
| 20070010182 | BELT SANDER ERASER ATTACHMENT A Belt Sander Eraser Attachment is disclosed. The attachment is configured to be attached to a conventional belt sander such that it provides the operator with the ability to remove built up sawdust and the like from the sanding belt. The device removably replaces the c... | 01/11/2007 |
| 20060234610 | Apparatus for conditioning chemical-mechanical polishing pads An apparatus for conditioning a polishing pad, or conditioner, includes a supporting substrate and abrasive elements. The abrasive elements of the conditioner are used to condition a polishing pad to be used in abrasive, or at least partially mechanical, semiconductor s... | 10/19/2006 |
| 20060211350 | Truing tool advancer jig A truing tool advancer jig is a unit comprising three parts: a jig body; a feed screw; and a clamping screw. The jig body is mounted on the universal support of a grinder and securely positioned thereon by adjustment of the clamping screw. A truing tool is mounted on th... | 09/21/2006 |
| 20060194521 | Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed betw... | 08/31/2006 |
| 20060160477 | CMP conditioner, method for arranging hard abrasive grains for use in CMP conditioner, and process for producing CMP conditioner Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a p... | 07/20/2006 |
| 20060141910 | Methods and systems for conditioning polishing pads Methods for conditioning polishing pads that are to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes, include abrading at least a portion of a polishing surface with a c... | 06/29/2006 |
| 20060128288 | Conditioner for chemical mechanical planarization pad The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abr... | 06/15/2006 |
| 20060079162 | CMP conditioner A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel wit... | 04/13/2006 |
| 20060079160 | POLISHING PAD CONDITIONER WITH SHAPED ABRASIVE PATTERNS AND CHANNELS A polishing pad conditioner comprises a base and a pad conditioning face on the base. The conditioning face comprises central and peripheral regions. Abrasive spokes having a substantially constant width of abrasive particles, extend from the central to the peripheral r... | 04/13/2006 |
| 20060073774 | CMP pad dresser with oriented particles and associated methods CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear... | 04/06/2006 |
| 20060057940 | Polishing apparatus and method for producing semiconductors using the apparatus The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on ... | 03/16/2006 |
