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| Application No. | Application Title | Issue Date |
| 20120108153 | ROTARY DRESSER A rotary dresser is provided with a roll having an outer circumferential surface which includes an arc portion or inclined portion differing in diameter in dependence on the axial position thereof, and a plurality of diamond abrasive grains embedded on the outer circumf... | 05/03/2012 |
| 20120083189 | CHEMICAL MECHANICAL POLISHING APPARATUS HAVING PAD CONDITIONING DISK AND PRE-CONDITIONER UNIT A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the ba... | 04/05/2012 |
| 20120071068 | POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS This disclosure relates to a polishing pad for chemical mechanical polishing, having a shape where 3 or more semi-oval or semicircular curves that connect 2 valleys neighboring on the plane are connected, and including 2 or more modified patterns that are formed to a de... | 03/22/2012 |
| 20120015589 | CATHODICALLY-PROTECTED PAD CONDITIONER AND METHOD OF USE A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured... | 01/19/2012 |
| 20110312254 | METHOD AND APPARATUS FOR DRESSING POLISHING PAD The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has b... | 12/22/2011 |
| 20110300782 | APPARATUSES AND METHODS FOR CONDITIONING POLISHING PADS USED IN POLISHING MICRO-DEVICE WORKPIECES Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements proje... | 12/08/2011 |
| 20110275288 | CMP PAD DRESSERS WITH HYBRIDIZED CONDITIONING AND RELATED METHODS The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, for example, a CMP pad conditioner is provided. Such a conditioner can include a support matrix, and a plurality of smooth superabrasive particles disposed ... | 11/10/2011 |
| 20110275289 | CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a condition... | 11/10/2011 |
| 20110250826 | PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a stru... | 10/13/2011 |
| 20110244764 | CHEMICAL-MECHANICAL POLISHING PAD CONDITIONING SYSTEM Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable plat... | 10/06/2011 |
| 20110244763 | SIDE PAD DESIGN FOR EDGE PEDESTAL A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning de... | 10/06/2011 |
| 20110237163 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 09/29/2011 |
| 20110217906 | POLISHING APPARATUS AND POLISHING METHOD A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having ab... | 09/08/2011 |
| 20110212670 | METHODS OF BONDING SUPERABRASIVE PARTICLES IN AN ORGANIC MATRIX Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding ou... | 09/01/2011 |
| 20110183584 | METHOD AND APPARATUS FOR CONDITIONING A CMP PAD The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member and the polishing pad. Specifically, a moveable we... | 07/28/2011 |
| 20110159787 | GEAR GRINDING MACHINE AND METHOD OF DRESSING A GRINDING TOOL A gear grinding machine, whose tool spindle (18) is supported on a first swivel-motion unit (17) seated on a first linear-motion unit (15), has a second linear-motion unit (19) which is arranged on the first linear-motion unit (15) and... | 06/30/2011 |
| 20110151756 | FULL PROFILE DRESSING ROLL FOR DRESSING MULTI-START CYLINDRICAL GRINDING WORMS Full profile dressing roll (1) for dressing multi-start grinding worms for the generation grinding of small-module gears, comprising a groove-shaped axial section profile of the outer envelope surface (2), covered with hard material grains, and profile-cut... | 06/23/2011 |
| 20110117822 | DRESSING JIG FOR GLASS SUBSTRATE POLISHING PAD Dressing treatment of a polishing pad, adjusting a polishing surface of the polishing pad to given flatness and surface roughness without deteriorating productivity, a method for polishing a glass substrate, including polishing a main surface of a glass substrate using ... | 05/19/2011 |
| 20110104989 | DRESSING BAR FOR EMBEDDING ABRASIVE PARTICLES INTO SUBSTRATES One or more individually gimballed dressing bars for embedding abrasive particles into a substrate at a substantially uniform height. A hydrostatic and/or hydrodynamic fluid bearing (air is the typical fluid) is maintained between the dressing bar and the substrate. The... | 05/05/2011 |
| 20110097977 | MULTIPLE-SIDED CMP PAD CONDITIONING DISK A conditioning tool for restoring a used CMP polishing pad to an operable condition. The tool includes a base that attaches to a driven machine and has a surface from which a shoulder protrudes that receives a peripheral edge of a disk. The disk has two opposing surface... | 04/28/2011 |
| 20110081848 | GRINDING TOOL AND METHOD OF MANUFACTURING THE GRINDING TOOL A manufacturing method for grinding tool includes following steps. Step 1 is providing a substrate. Step 2 is fixing diamond or abrasive grit in a predetermined position or base by DIAMAP (Diamond Implant Array Mapping & Arrangement Process). The last step is provid... | 04/07/2011 |
| 20110076925 | System for Evaluating and/or Improving Performance of a CMP Pad Dresser Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality... | 03/31/2011 |
| 20110065365 | GRINDING METHOD AND GRINDING APPARATUS FOR POLISHING PAD FOR USE IN DOUBLE-SIDE POLISHING DEVICE The present invention provides an apparatus capable of uniformly grinding an polishing pad. Further, the present invention provides a method of grinding an polishing pad by using the grinding apparatus. Specifically, the present invention provides a method of, in a doub... | 03/17/2011 |
| 20110039479 | DRESSING TOOL A dressing tool (100, 200, 300, 400, 500) for conditioning of grinding bodies, especially ceramically bonded grinding bodies, the dressing tool (100, 200, 300, 400, 500) comprising a base body which bears a self-supporting function coating (120, 220, 32... | 02/17/2011 |
| 20110034112 | POLISHING APPARATUS, POLISHING AUXILIARY APPARATUS AND POLISHING METHOD A polishing apparatus, a polishing method and a polishing auxiliary apparatus which are able to suppress clogging of the rotating grindstone and polish the work while suppressing the damage thereof are provided. A polishing apparatus 1 according to the present in... | 02/10/2011 |
| 20100330886 | Corrosion-Resistant CMP Conditioning Tools and Methods for Making and Using Same An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation... | 12/30/2010 |
| 20100311309 | DRESSING APPARATUS, DRESSING METHOD, AND POLISHING APPARATUS A dressing apparatus for use in a polishing apparatus for polishing a substrate to planarize a surface of the substrate is disclosed. The dressing apparatus includes a dresser disk, a dresser drive shaft coupled to the dresser disk, a pneumatic cylinder configured to pr... | 12/09/2010 |
| 20100304642 | Gear Cutting Machine The invention relates to a gear cutting machine for the grinding of external profiles and/or internal profiles of workpieces having at least one machining head which can be rotated about an axis and which has a grinding tool, and having a dressing unit. In accordance wi... | 12/02/2010 |
| 20100291844 | DRESSER FOR ABRASIVE CLOTH The invention provides a dresser for an abrasive cloth, which has a smaller abrasive grain diameter than the conventional dresser and has an abrasive grain spacing regulated in a predetermined range depending upon the abrasive grain diameter to simultaneously meet a hig... | 11/18/2010 |
| 20100273402 | CMP conditioner and method of manufacturing the same A chemical mechanical polishing (CMP) conditioner has diamond abrasive grits adhered to a conditioning surface which faces and makes contact with an abrasive pad of a CMP machine. The diamond abrasive grit is adhered to the CMP conditioner body by a metal plating layer,... | 10/28/2010 |
| 20100261419 | Superabrasive Tool Having Surface Modified Superabrasive Particles and Associated Methods Superabrasive tools and associated methods of making and using are provided. In one aspect, for example, a superabrasive tool having improved superabrasive particle retention is provided. Such a tool can include a matrix layer and a plurality of superabrasive particles ... | 10/14/2010 |
| 20100248595 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abra... | 09/30/2010 |
| 20100248596 | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP ... | 09/30/2010 |
| 20100240285 | POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME A polishing apparatus includes: a wafer polishing unit including a polishing surface plate, an abrasive supply part supplying an abrasive to a polishing pad placed on the polishing surface plate, and a wafer holding part holding a semiconductor wafer; and a dressing uni... | 09/23/2010 |
| 20100221988 | Superhard Cutters and Associated Methods A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting el... | 09/02/2010 |
| 20100216378 | CHEMICAL MECHANICAL POLISHING APPARATUS Provided is a chemical mechanical polishing (CMP) apparatus. The CMP apparatus may include a polishing pad including a plurality of concave regions. These concave regions may be two-dimensionally arranged in the polishing pad in a first direction and a second direction ... | 08/26/2010 |
| 20100203811 | METHOD AND APPARATUS FOR ACCELERATED WEAR TESTING OF AGGRESSIVE DIAMONDS ON DIAMOND CONDITIONING DISCS IN CMP The present invention is a method and apparatus for accelerated pulling and fracturing of aggressive diamonds on a CMP diamond conditioner disc wherein aggressive diamonds of known position are pulled or fractured by contacting the diamond conditioner disc to a plate or... | 08/12/2010 |
| 20100197204 | APPARATUSES AND METHODS FOR CONDITIONING POLISHING PADS USED IN POLISHING MICRO-DEVICE WORKPIECES Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements proje... | 08/05/2010 |
| 20100190418 | LAPPING PLATE-CONDITIONING GRINDSTONE SEGMENT, LAPPING PLATE-CONDITIONING LAPPING MACHINE, AND METHOD FOR CONDITIONING LAPPING PLATE In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate a... | 07/29/2010 |
| 20100190417 | APPARATUS FOR DRESSING A POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD An apparatus for dressing a polishing pad is described. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing pr... | 07/29/2010 |
