Did You Know...
...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Application No. | Application Title | Issue Date |
| 20120108148 | Method of Modifying Flat Glass Surface and Apparatus for Carrying Out the Method The method of modifying the flat glass surface is based on that the surface of a glass is worked by abrasive grains of synthetic diamond which are situated in the mass of plastic threads that are a part of a rotating brush. The glass is first tarnished using brushes wit... | 05/03/2012 |
| 20120040277 | DAMASCENE RETICLE AND METHOD OF MANUFACTURE THEREOF A reticle carrier for a polishing tool capable of accommodating a reticle includes a base plate with an obverse and reverse surfaces, a retaining ring secured to the obverse surface of the base plate forming a recess defined by the obverse surface of the rigid base plat... | 02/16/2012 |
| 20110281509 | HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for pe... | 11/17/2011 |
| 20110256806 | OPHTHALMIC MACHINE AND METHOD FOR MACHINING AND/OR POLISHING A LENS The invention relates to an ophthalmic machining machine comprising machining means and means for supporting a blank. The invention is characterised in that the machine is capable of transferring marks to said blank that can be identified by monitoring means for reposit... | 10/20/2011 |
| 20110237163 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 09/29/2011 |
| 20110159792 | MULTI-FUNCTIONAL GRINDING APPARATUS A multi-functional grinding apparatus includes a fixed barrel, a moving barrel, a cutting device, a grinding plate, and an actuator. The fixed barrel defines a chamber therein and includes a number of inner side surfaces, the inner side surfaces are substantially parall... | 06/30/2011 |
| 20110136414 | POLISHING HEAD AND POLISHING APPARATUS A polishing head for holding a workpiece when a surface of the workpiece is polished and a polishing apparatus provided with the polishing head, and more particularly a polishing head for holding the workpiece on a rubber film and a polishing apparatus provided with the... | 06/09/2011 |
| 20110065367 | ARC SURFACE GRINDING DEVICE A grinding device includes a fixed barrel, a moving barrel, a grinding plate, and an actuator. The fixed barrel defines a chamber and includes a number of inner surfaces substantially parallel to a central axis, each of which defines a holding groove therein for holding... | 03/17/2011 |
| 20110021116 | METHOD FOR PROCESSING AN EDGE OF A GLASS PLATE A method for beveling a thin glass plate by simultaneously grinding an edge of the glass using multiple abrasive cup wheels, wherein the edge of the glass plate is extended from the fixturing device. The extension of the glass plate allows the glass plate to bend in res... | 01/27/2011 |
| 20100291839 | Grinding Method of Strip Glass and a Vacuum Suction Plate Used in the Same A grinding method of a strip glass comprises: the strip glass to be ground is absorbed to a vacuum suction plate, then the strip glass is transferred to the glass edge chamfering apparatus by the vacuum suction plate. Grinding a side of the strip glass forms a predefine... | 11/18/2010 |
| 20100267317 | Substrate holder and substrate holding method A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid suppl... | 10/21/2010 |
| 20100227536 | Glass Polishing System A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit contacting with the glass and capable of being passively rotated due to the rotation of the glass, a moving unit for moving the upper unit in a horizonta... | 09/09/2010 |
| 20100227537 | Glass Polishing System A glass polishing system includes a lower unit capable of rotating a glass placed at a fixed position, an upper unit capable of contacting with the glass and being passively rotated due to the rotation of the glass, and a moving unit for moving the upper unit in a horiz... | 09/09/2010 |
| 20100130105 | Substrate supporting unit, and apparatus and method for polishing substrate using the same Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the subs... | 05/27/2010 |
| 20100112910 | LINEAR PRESSURE FEED GRINDING WITH VOICE COIL The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes a grinding unit configured to remove a predetermined amount of material from the edge when in an aligned position. The grinding uni... | 05/06/2010 |
| 20100112905 | WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD FOR ITS USE The present invention is a planar template for a CMP tool polishing head possessing a means of securing a wafer in CMP polishing where the back surface of the template is held to the polishing head by retaining means and a method for using the planar template.... | 05/06/2010 |
| 20090325467 | Method of Thinning Wafer and Support plate A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention ... | 12/31/2009 |
| 20090325469 | SUBSTRATE SUPPORTING UNIT AND SINGLE TYPE SUBSTRATE POLISHING APPARATUS USING THE SAME Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-... | 12/31/2009 |
| 20090305617 | Support plate, carrier device, releasing device, and releasing method A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed.... | 12/10/2009 |
| 20090298402 | Surface grinding machine It has special application for preparing surfaces of two pieces of a composite material (fiber and resin) which have to be glued by means of an adhesive, establishing a perfect mutual contact between them. The preparation of the surface needs to be uniformed and without... | 12/03/2009 |
| 20090291624 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 11/26/2009 |
| 20090258583 | DEVICE AND PROCESS FOR APPLYING AND/OR DETACHING A WAFER TO/FROM A CARRIER The invention relates to a device for applying and/or detaching a wafer to/from a carrier with
| 10/15/2009 |
| 20090191791 | Polishing method and polishing apparatus A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpi... | 07/30/2009 |
| 20090186560 | WAFER DE-CHUCKING A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (... | 07/23/2009 |
| 20090081930 | Automatic machine and automatic method for grinding the perimetric edge of glass sheets An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the g... | 03/26/2009 |
| 20090081852 | HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for pe... | 03/26/2009 |
| 20090026676 | Non-Contact Type Suction Holding Apparatus [Problem] A non-contact type suction holding apparatus capable of reliably holding a plate-shaped member without damaging its surface by suction-holding the plate-shaped member with a portion except for its peripheral portion (main portion) in a non-contact state in whi... | 01/29/2009 |
| 20080287044 | Method of transferring a wafer A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, ... | 11/20/2008 |
| 20080227374 | POLISHING HEAD TESTING WITH MOVABLE PEDESTAL A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the... | 09/18/2008 |
| 20080153405 | CONTACT PLANARIZATION APPARATUS A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membr... | 06/26/2008 |
| 20080119118 | Retaining Ring, Flexible Membrane for Applying Load to a Retaining Ring, and Retaining Ring Assembly A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A retaining ring assembly has a flexible membrane shaped to provide an annular chamber and an annular retaining ring, wherein annular concentric pro... | 05/22/2008 |
| 20080051018 | Semiconductor Wafer Handler A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitr... | 02/28/2008 |
| 20070232209 | METHOD FOR POLISHING A SEMICONDUCTOR WAFER An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower... | 10/04/2007 |
| 20070155288 | FIXTURE FOR GRINDING MACHINES A fixture for grinding machines includes a first base (10) and a second base (20). The first base defines a first workpiece holding groove (11 ) therein, a first side surface (12) is formed corresponding to the first workpiece holding groove,... | 07/05/2007 |
| 20070026772 | Apparatus for use in processing a semiconductor workpiece The present invention provides a chuck for receiving and supporting a semiconductor workpiece for processing. The chuck includes a body for supporting the workpiece. The body is porous or has a plurality of openings, apertures or channels. A compressible corrosion resis... | 02/01/2007 |
| 20060135047 | Method and apparatus for clamping a substrate in a high pressure processing system Pressure biased wafer holding of a semiconductor wafer is provided for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is applied to high pressure systems. Adverse effects of high pressure biases are preven... | 06/22/2006 |
| 20060099892 | Substrate holding apparatus and polishing apparatus The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top... | 05/11/2006 |
| 20060084371 | Wafer chuck The influence of the slurry generated when polishing an orientation notch and the like is minimized. The holding members 10, 20 for holding the outer periphery of the wafer W and the driving mechanism 30 for driving the holding members 10, 20 all to... | 04/20/2006 |
| 20050266783 | Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces Retaining rings, planarizing apparatuses including retaining rings, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a carrier head for retaining a micro-device workpiece during mecha... | 12/01/2005 |
| 20050153635 | POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucki... | 07/14/2005 |
