Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Application No. | Application Title | Issue Date |
| 20100227534 | Lower Unit for Glass Polishing System and Glass Polishing Method Using the Same A lower unit for a glass polishing system includes a support installed to a rotatable turntable, and a carrier having a supporting part for supporting a glass to be polished, and a placing part formed in a surface opposite to the supporting part and fixed and placed to ... | 09/09/2010 |
| 20100015894 | CMP by Controlling Polish Temperature A method for manufacturing integrated circuits on a wafer includes providing a facility-supplied room temperature solution; controlling the temperature of the facility-supplied room temperature solution to a desired temperature set point to generate a rinse solution; an... | 01/21/2010 |
| 20090325469 | SUBSTRATE SUPPORTING UNIT AND SINGLE TYPE SUBSTRATE POLISHING APPARATUS USING THE SAME Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-... | 12/31/2009 |
| 20090291624 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 11/26/2009 |
| 20090258583 | DEVICE AND PROCESS FOR APPLYING AND/OR DETACHING A WAFER TO/FROM A CARRIER The invention relates to a device for applying and/or detaching a wafer to/from a carrier with
| 10/15/2009 |
| 20090247057 | Polishing platen and polishing apparatus The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provi... | 10/01/2009 |
| 20090191791 | Polishing method and polishing apparatus A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpi... | 07/30/2009 |
| 20090163120 | WAFER GRINDING MACHINE AND WAFER GRINDING METHOD A wafer grinding machine and a wafer grinding method are disclosed. A barrier (60) is arranged around a holding unit (29) to hold at least a wafer (40) with a film (11) attached on the front surface (41) thereof and with the back surfa... | 06/25/2009 |
| 20090061745 | POLISHING HEAD USING ZONE CONTROL A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two polishin... | 03/05/2009 |
| 20080299879 | POLISHING PAD, THE USE THEREOF AND THE METHOD FOR MANUFACTURING THE SAME The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane... | 12/04/2008 |
| 20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous ... | 11/27/2008 |
| 20080268223 | Composite sheet for mounting a workpiece and the method for making the same The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on th... | 10/30/2008 |
| 20080261497 | Retainer Ring For Cmp Device A two-layer structure retainer ring is capable of giving a uniform pressing force while uniting a first ring and a second ring more securely. A first ring 11 is formed with a pressed-and-fitted portion 11d over the full circumference of a lower surf... | 10/23/2008 |
| 20080146124 | SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD A semiconductor manufacturing apparatus includes a supporting unit for supporting a semiconductor wafer received from a CMP apparatus and a vacuuming system for holding the wafer on the supporting unit. The vacuuming is applied only in a peripheral area of the wafer. In... | 06/19/2008 |
| 20080119119 | Carrier Ring for Carrier Head A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A carrier ring has an annular upper portion and an annular lower portion having a lower surface with a smaller inner diameter than the upper surface... | 05/22/2008 |
| 20080076330 | CHEMICAL MECHANICAL POLISHING WITH NAPPED POROMERIC A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad. ... | 03/27/2008 |
| 20080076336 | Surface plate protecting device in CMP apparatus Damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate, operation of the CMP apparatus, etc. is prevented. In order to solve the problem, the present invention provides a surface plate protecting device ... | 03/27/2008 |
| 20060116056 | Apparatus and methods for polishing a semiconductor wafer An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower... | 06/01/2006 |
| 20050250334 | Polishing method for semiconductor substrate, and polishing jig used therein During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to so... | 11/10/2005 |
| 20050221734 | Carrier head with a non-stick membrane A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion t... | 10/06/2005 |
| 20050153635 | POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucki... | 07/14/2005 |
