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| Application No. | Application Title | Issue Date |
| 20120040591 | Replaceable cover for membrane carrier A replaceable cover secured to the surface of a membrane positioned on a wafer carrier.... | 02/16/2012 |
| 20110237163 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 09/29/2011 |
| 20110195640 | APPLYING DIFFERENT PRESSURES THROUGH SUB-PAD TO FIXED ABRASIVE CMP PAD A chemical mechanical polishing (CMP) system includes a rotating polishing table including a platen providing at least two pressure zones having different pressures; a sub-pad positioned on the platen, the sub-pad including a plurality of openings allowing for transmiss... | 08/11/2011 |
| 20110130003 | METHOD AND APPARATUS FOR CONFORMABLE POLISHING Methods and apparatus provide for a conformable polishing head for uniformly polishing a workpiece. The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head. The cavity is pressurized to expand the mem... | 06/02/2011 |
| 20110053474 | POLISHING APPARATUS The polishing apparatus is capable of improving accuracy of polishing a work. The work is pressed onto a polishing cloth, with an elastic sheet, by a pressing force generated by second pressing means and applied to a carrier and inner pressure of a first fluid chamber g... | 03/03/2011 |
| 20100314078 | COOLER WITH GROUND HEATED PLANE AND GRINDING METHOD AND APPARATUS THEREOF A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated... | 12/16/2010 |
| 20100311311 | Carrier Head Membrane A flexible membrane includes a horizontal central portion, a vertical portion coupled to the central portion, a thick rim portion coupled to the vertical portion, and an extension coupled to the thick rim portion. An outer surface of the horizontal central portion provi... | 12/09/2010 |
| 20100291838 | POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is... | 11/18/2010 |
| 20100291842 | POLISHING HEAD ZONE BOUNDARY SMOOTHING A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for ... | 11/18/2010 |
| 20100285723 | POLISHING APPARATUS A chemical mechanical polishing (CMP) device for processing a wafer is provided which includes a plate for supporting the wafer to be processed in a face-up orientation, a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad o... | 11/11/2010 |
| 20100273404 | Polishing Pad and Polishing Device A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surfa... | 10/28/2010 |
| 20100273405 | POLISHING APPARATUS A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold ... | 10/28/2010 |
| 20100203807 | Pressure control system of wafer polishing apparatus A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure contr... | 08/12/2010 |
| 20100197207 | CHEMICAL MECHANICAL POLISHING APPARATUS A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is s... | 08/05/2010 |
| 20100190417 | APPARATUS FOR DRESSING A POLISHING PAD, CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD An apparatus for dressing a polishing pad is described. The apparatus includes a dresser drive shaft which is rotatable and vertically movable, a dresser flange coupled to the dresser drive shaft and configured to secure a dressing member thereto, a spherical bearing pr... | 07/29/2010 |
| 20100173566 | Carrier Head Membrane Roughness to Control Polishing Rate An apparatus comprises a flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus. The membrane comprises an outer surface providing a substrate receiving surface, wherein the outer surface has a central portion and an edge po... | 07/08/2010 |
| 20100130105 | Substrate supporting unit, and apparatus and method for polishing substrate using the same Provided are a substrate supporting unit and an apparatus and method for polishing a substrate using the same. The substrate supporting unit vacuum-absorbs a bottom surface of the substrate during a polishing process, and supports the substrate in a state where the subs... | 05/27/2010 |
| 20100087124 | CD REPAIR APPARATUS An apparatus for repairing a surface of a media storage disc is disclosed. The apparatus comprises an exterior housing having an upper lid rendered with an upper lid shaft and a base portion that includes a platform for holding the media storage disc. The disc is placed... | 04/08/2010 |
| 20090291624 | SUBSTRATE POLISHING APPARATUS AND METHOD A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the... | 11/26/2009 |
| 20090264054 | POLISHING MACHINE, WORKPIECE SUPPORTING TABLE PAD, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the p... | 10/22/2009 |
| 20090264052 | Polishing method and polishing apparatus, and program for controlling polishing apparatus A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method comprises: carrying out a stand-by ... | 10/22/2009 |
| 20090239446 | Polishing Apparatus and Polishing Method A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer W by applying a pressure between a polishing member (polishing pad) 201 and the wafer W held by a holding member (top rin... | 09/24/2009 |
| 20090233532 | Substrate holding apparatus and polishing apparatus A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a cham... | 09/17/2009 |
| 20090209176 | Method and apparatus for polishing object A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comp... | 08/20/2009 |
| 20090191797 | Polishing apparatus A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (4... | 07/30/2009 |
| 20090170404 | APPARATUS AND METHOD FOR POLISHING MEDIA DISCS Disclosed is an apparatus for polishing media discs by removing or reducing scratches or substances from the surface of damaged discs, including computer data CDs, DVDs, gaming discs and other media discs. The apparatus enables removal or reduction of scratches and mate... | 07/02/2009 |
| 20090149118 | Silicon Wafer Grinding Apparatus, Retaining Assembly Used for the Same and Silicon Wafer Flatness Correcting Method A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided. More particularly, a silicon wafer grinding apparatus, a retaining assembly used for the same, and a si... | 06/11/2009 |
| 20090130956 | Polishing apparatus and polishing method A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holdin... | 05/21/2009 |
| 20090068934 | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own... | 03/12/2009 |
| 20090061744 | POLISHING PAD AND METHOD OF USE A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater ... | 03/05/2009 |
| 20090050897 | Substrate, method of polishing the same, and polishing apparatus A polishing method and a polishing apparatus capable of polishing a surface of a substrate made of SiC or diamond extremely smoothly and efficiently without causing subsurface damage are provided. A polishing platen 1 can rotate around a rotating shaft 4, ... | 02/26/2009 |
| 20090053978 | Double-Disc Grinding Machine, Static Pressure Pad, and Double-Disc Grinding Method Using the Same for Semiconductor Wafer The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands ... | 02/26/2009 |
| 20090036028 | Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof A chemical mechanical polishing apparatus and a chemical mechanical polishing method thereof are provided. The chemical mechanical polishing method at least includes the following steps. In step a, a positive pressure is formed between a polishing pad and a wafer. In st... | 02/05/2009 |
| 20090023368 | POLISHING HEAD AND EDGE CONTROL RING THEREOF, AND METHOD OF INCREASING POLISHING RATE AT WAFER EDGE A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge contr... | 01/22/2009 |
| 20090021024 | Retaining Ring with Shaped Profile Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter a... | 01/22/2009 |
| 20090011690 | Polishing apparatus and polishing method A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechan... | 01/08/2009 |
| 20080318499 | Substrate holding apparatus, polishing apparatus, and polishing method A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing th... | 12/25/2008 |
| 20080299878 | SYSTEMS AND METHODS FOR REDUCING ELECTROSTATIC CHARGE OF SEMICONDUCTOR WAFERS A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to th... | 12/04/2008 |
| 20080293342 | CMP HEAD AND METHOD OF MAKING THE SAME A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (2/3) R, and at least a diversion... | 11/27/2008 |
| 20080254720 | Polishing Head, Polishing Apparatus and Polishing Method for Semiconductor Wafer The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the ... | 10/16/2008 |
