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| Application No. | Application Title | Issue Date |
| 20120003904 | METHOD AND APPARATUS FOR GRINDING A WORKPIECE SURFACE OF ROTATION A workpiece having a planar face the workpiece is rotated about a workpiece axis substantially perpendicular to the planar workpiece face, and a grinding disk centered on a disk axis is rotated about the disk axis. The disk has an annular planar disk face perpendicular ... | 01/05/2012 |
| 20110009035 | Polishing machine for lenses and method for polishing a lens using a machine tool A polishing machine for lenses with at least one first polishing spindle having a polishing axis (K) and a tool holder disposed on the first polishing spindle for a first polishing disc designed as a tool, further comprising at least one first workpiece spindle having a... | 01/13/2011 |
| 20110009037 | POLISHING APPARATUS A polishing apparatus for polishing an end edge of a work piece by bringing a bristle tip of a polishing brush into contact with the end edge of the work piece as the bristle tip passes the end edge of the work piece includes a support plate having a through hole into w... | 01/13/2011 |
| 20100323591 | SELF-ALIGNING ROTARY BLADE HOLDER FOR SHARPENER A universal blade sharpening machine is operable to securely hold and sharpen any one of multiple variously sized circular blades. The machine includes a blade-sharpening drive with an adjustable blade sharpener and also includes a universal blade holder that is rotatab... | 12/23/2010 |
| 20100317266 | WORKPIECE HOLDER FOR A SURFACE GRINDING MACHINE The present disclosure relates to a workpiece holder for a surface grinding machine, with a central workpiece holder shaft around which the workpiece holder can be driven in rotation, with at least one workpiece fixture to hold at least one workpiece, and with at least ... | 12/16/2010 |
| 20100190418 | LAPPING PLATE-CONDITIONING GRINDSTONE SEGMENT, LAPPING PLATE-CONDITIONING LAPPING MACHINE, AND METHOD FOR CONDITIONING LAPPING PLATE In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate a... | 07/29/2010 |
| 20100167628 | Method of Grinding Bar-Shaped Workpieces, Grinding Machine for Carrying Out the Method, and Grinding Cell in Twin Arrangement In order to grind bar-shaped workpieces which have a non-circular cross-section and flat faces which are parallel to each other, two partial operations are performed consecutively. First, the bar-shaped workpiece is rough ground and finished on the faces by way of doubl... | 07/01/2010 |
| 20100120335 | Partial Contact Wafer Retaining Ring Apparatus The partial contact wafer retaining ring apparatus is disclosed. For example, one disclosed embodiment provides a wafer retaining ring comprising a ring for retaining the wafer, the ring having an inner diameter surface configured to restrict lateral wafer motion, and a... | 05/13/2010 |
| 20100035523 | SEMICONDUCTOR DEVICE FABRICATING METHOD, AND SEMICONDUCTOR FABRICATING DEVICE A method for fabricating a semiconductor device includes: supporting a semiconductor substrate formed with a polishing target film by a polishing head; and polishing the polishing target film while restricting movement in a radial direction of the semiconductor substrat... | 02/11/2010 |
| 20100003898 | SUBSTRATE RETAINING RING FOR CMP The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center o... | 01/07/2010 |
| 20090203299 | SUBSTRATE FLAT GRINDING DEVICE To provide a high-rigidity flat grinding device, a substrate flat grinding device has three fastening plate lifting-and-lowering mechanisms that have kinematic couplings and a cylinder rod that move the fastening plate upward or downward. Being a high-rigidity grinding ... | 08/13/2009 |
| 20090181475 | DETECTING THE PRESENCE OF A WORKPIECE RELATIVE TO A CARRIER HEAD A carrier head for a workpiece includes a capacitive sensor that is configured to detect the presence of the workpiece during a chemical mechanical planarization/polishing procedure. The sensor subsystem can detect a wafer unloaded condition, a wafer loaded condition, a... | 07/16/2009 |
| 20090176445 | Flexible Membrane Assembly for a CMP System A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall.... | 07/09/2009 |
| 20090130958 | Fixed Abrasive Pad Having Different Real Contact Areas and Fabrication Method Thereof Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press... | 05/21/2009 |
| 20090130955 | Loading Device of Chemical Mechanical Polishing Equipment for Semiconductor Wafers A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for abs... | 05/21/2009 |
| 20090098809 | BOWLING BALL SURFACE TREATMENT DEVICE A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball b... | 04/16/2009 |
| 20090042493 | CHAMFERING APPARATUS FOR CHAMFERING GLASS SUBSTRATES A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end p... | 02/12/2009 |
| 20080318503 | SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the sub... | 12/25/2008 |
| 20080305725 | Chemical mechanical polish system having multiple slurry-dispensing systems A chemical mechanical polish system includes a polishing pad, a platen supporting and rotating the polishing pad, a top slurry dispenser placed over a polishing pad, a bottom slurry dispenser placed through an opening in the polishing pad, and a duct connected to the bo... | 12/11/2008 |
| 20080293339 | Retainer Ring A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a ... | 11/27/2008 |
| 20080293341 | METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous ... | 11/27/2008 |
| 20080293340 | METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerou... | 11/27/2008 |
| 20080287043 | Polishing apparatus A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surf... | 11/20/2008 |
| 20080287044 | Method of transferring a wafer A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, ... | 11/20/2008 |
| 20080268223 | Composite sheet for mounting a workpiece and the method for making the same The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on th... | 10/30/2008 |
| 20080261402 | METHOD OF REMOVING INSULATING LAYER ON SUBSTRATE A method of removing an insulating layer on a substrate is described, including a first CMP process and a second CMP process performed in sequence, wherein the polishing slurry used in the first CMP process and that used in the second CMP process have substantially the ... | 10/23/2008 |
| 20080261497 | Retainer Ring For Cmp Device A two-layer structure retainer ring is capable of giving a uniform pressing force while uniting a first ring and a second ring more securely. A first ring 11 is formed with a pressed-and-fitted portion 11d over the full circumference of a lower surf... | 10/23/2008 |
| 20080207093 | METHODS AND APPARATUS FOR CLEANING A SUBSTRATE EDGE USING CHEMICAL AND MECHANICAL POLISHING Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head includi... | 08/28/2008 |
| 20080176488 | GRINDING METHOD OF A DISK-SHAPED SUBSTRATE AND GRINDING APPARATUS The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an in... | 07/24/2008 |
| 20080160884 | Rotating Polishing Tool The present invention has an object to provide a rotating polishing tool with high durability that can finish a polished surface with desired surface roughness. As means thereof, a substantially cylindrical polishing member 3 is constituted by a pair of polishing... | 07/03/2008 |
| 20080160885 | RETAINING RING FOR A CHEMICAL MECHANICAL POLISHING TOOL A retaining ring for a chemical mechanical polishing tool comprises a pad side surface. The pad side surface has an edge portion adjacent its outer circumference. A surface normal of the edge portion and a surface normal of the pad side surface include an acute angle. A... | 07/03/2008 |
| 20080125021 | DISK HOLDER AND DISK ROTATING DEVICE HAVING THE SAME A disk holder suitable for a disk rotating device of a chemical-mechanical polishing apparatus is provided. The disk holder is provided with a base and a fence. The base has a bearing surface at the bottom for bearing a disk thereon. The fence is connected to the periph... | 05/29/2008 |
| 20080119118 | Retaining Ring, Flexible Membrane for Applying Load to a Retaining Ring, and Retaining Ring Assembly A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A retaining ring assembly has a flexible membrane shaped to provide an annular chamber and an annular retaining ring, wherein annular concentric pro... | 05/22/2008 |
| 20080113593 | Polishing holder for workpiece end surface In a polishing holder for workpiece end surface, a main body and a framework are respectively provided with corresponding fixing portions, at least one of the two fixing portions has at least one set of upper and lower contact portions, the upper and the lower contact p... | 05/15/2008 |
| 20080102732 | CARRIER HEAD FOR WORKPIECE PLANARIZATION/POLISHING An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises f... | 05/01/2008 |
| 20080102734 | POLISHING PAD ASSEMBLY WITH GLASS OR CRYSTALLINE WINDOW Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The ... | 05/01/2008 |
| 20080085665 | APPARATUS FOR POLISHING GEMSTONES Disclosed is an apparatus for working gemstones. The apparatus comprises an abrading article and a rotatable support with a guiding feature for holding and rotating the article. The abrading article has a mounting bore substantially larger than the guiding feature. A ba... | 04/10/2008 |
| 20080076336 | Surface plate protecting device in CMP apparatus Damage of a surface plate used in a CMP apparatus due to troubles generated in repair or replacement of the surface plate, operation of the CMP apparatus, etc. is prevented. In order to solve the problem, the present invention provides a surface plate protecting device ... | 03/27/2008 |
| 20080070479 | Polishing Apparatus A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (4... | 03/20/2008 |
| 20080064308 | Polishing apparatus and manufacturing method of an electronic apparatus A polishing apparatus that polishes a substrate to be processed includes a rotary polishing table carrying a polishing pad on a surface thereof, and a polishing head that urges the substrate to be processed against the polishing pad while rotating the substrate to be pr... | 03/13/2008 |
