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| Application No. | Application Title | Issue Date |
| 20100099337 | Device For The Double-Sided Processing Of Flat Workpieces and Method For The Simultaneous Double-Sided Material Removal Processing Of A Plurality Of Semiconductor Wafers A device for double-sided processing of flat workpieces has upper and lower working discs forming between them a working gap containing a carrier disc with cutout(s) for workpiece(s), the carrier disc having circumferential teeth by means of which it rolls on an inner a... | 04/22/2010 |
| 20090029634 | Semiconductor wafer polishing machine Embodiments of the invention comprise a machine adapted for polishing work pieces such as large silicon wafers. A wafer polishing machine in accord with the invention comprises a rotatable platen in a table base, above which is mounted a lid having a head moving assembl... | 01/29/2009 |
| 20080305723 | Polishing disc for a tool for the fine machining of optically active surfaces particularly on spectacle lenses and method for its production A polishing disc for a tool for the fine machining of optically active surfaces, particularly on spectacle lenses as workpieces, comprises a main body which has a center axis and on which there is fixed an intermediate layer which is softer than the main body and on whi... | 12/11/2008 |
| 20070010178 | Continuous grinding machine for machining a level workpiece surface The subject matter of the invention is a continuous grinding machine for machining a level workpiece surface with at least two grinding tools (16) rotating about a vertical axis (24), each grinding tool (16) including a spindle (18) rotating ... | 01/11/2007 |
| 20050037695 | Polishing head for a polishing machine A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint... | 02/17/2005 |
