Did You Know...
...that while attempting to develop a super strong glue, 3M employee Spencer Silver accidentally developed a glue that was so weak it would barely hold two pieces of paper together? However, his colleague Art Fry needed the glue. Fry sang with his church choir and marked the pages of his hymnal with small scraps of paper that often fell out. He used Silver's glue to hold the papers in place. Today we call this invention Post-it Notes.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20050196879 | METHOD OF PLANARIZING SPIN-ON MATERIAL LAYER AND MANUFACTURING PHOTORESIST LAYER A method of planarizing a spin-on material layer is provided. A substrate having a plurality of openings thereon is provided. A spin-on material layer is formed on the substrate such that the openings are completely filled. A plasma etching process is carried out to rem... | 09/08/2005 |
| 20050153464 | Holographically defined surface mask etching method and etched opical structures The invention is directed to a method for etching a solid state material to create a surface relief pattern. A resist layer is formed on the surface of the solid state material. The photoresist layer is holographically patterned to form a patterned mask. The pattern is ... | 07/14/2005 |
| 20050130334 | Self-aligned contact process implementing bias compensation etch endpoint detection and methods for implementing the same A bias compensation self-aligned contact (SAC) etch endpoint detecting system is provided. The system includes an etch reactant chamber, an ESC power supply, and a signal processing computer. The etch reactant chamber includes an electrostatic chuck (ESC), a top electro... | 06/16/2005 |
| 20050084988 | Integrated stepwise statistical process control in a plasma processing system An automated process control system configured for controlling a plasma processing system having a chamber, the chamber being configured for processing a substrate. The automatic process control system includes a first sensor disposed within the chamber, the first senso... | 04/21/2005 |
| 20050074907 | Semi-conductor wafer fabrication A method of planarizing a semiconductor wafer includes applying a CMP process to a layer of dielectric material to planarize the wafer surface, and applying a plasma etching process to the wafer surface until a signal is generated from a detection layer that indicates t... | 04/07/2005 |
| 20050059251 | Constant and reducible hole bottom CD in variable post-CMP thickness and after-development-inspection CD A new method is provided for the creation of a hole through a layer of insulating material. The method provides for combining a feed-forward method with a feed backward method and a high-polymer based hole profile, in order to establish a hole of a constant Critical Dim... | 03/17/2005 |
| 20050019962 | Plasma monitoring method, plasma processing method, method of manufacturing semiconductor device, and plasma processing system Disclosed is a plasma monitoring method for detecting the amount of atomic radicals generated by dissociation of a molecular raw material gas during a plasma processing conducted by introducing the molecular raw material gas and a rare gas into a process atmosphere, whe... | 01/27/2005 |
| 20050019961 | Method for automatic determination of semiconductor plasma chamber matching and source of fault by comprehensive plasma monitoring A method and apparatus for automatic determination of semiconductor plasma chamber matching a source of fault are provided. Correlated plasma attributes are measured for process used for calibration both in a chamber under study and in a reference chamber. Principal com... | 01/27/2005 |
