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Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Application No. | Application Title | Issue Date |
| 20120104529 | COLORED COMPOSITION FOR LIGHT-SHIELDING FILM, LIGHT-SHIELDING PATTERN, METHOD FOR FORMING THE SAME, SOLID-STATE IMAGE SENSING DEVICE, AND METHOD FOR PRODUCING THE SAME The present invention provides a colored composition for a light-shielding film including at least one selected from titanium atom-containing black titanium pigments and at least one organic pigment selected from the group consisting of a red organic pigment, a yellow o... | 05/03/2012 |
| 20120068291 | IMAGE SENSING DEVICE AND METHOD OF MANUFACTURING THE SAME According to one embodiment, a solid-state image sensing device includes a semiconductor substrate on which a plurality of pixels are arranged, a transparent substrate including a first through via provided in an opening formed in advance to extend through, an adhesive ... | 03/22/2012 |
| 20120044395 | IMAGE SENSORS WITH ANTIREFLECTIVE LAYERS An electronic device may have an image sensor array that captures images. The image sensor array may include antireflective layers that increase the efficiency of the image sensor in gathering incoming light. The image sensor array may include a first antireflective lay... | 02/23/2012 |
| 20120044444 | SENSOR ARRAY SUBSTRATE, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SENSOR ARRAY SUBSTRATE Provided are a sensor array substrate, a display device including the same, and a method of manufacturing the sensor array substrate. The sensor array substrate includes: a substrate; a plurality of pixel regions defined by intersections of gate wirings and data wirings... | 02/23/2012 |
| 20120032066 | Sensing Devices and Manufacturing Methods Therefor A sensing device is provided. The sensing device includes a sensing pixel array and a memory unit. The sensing pixel array is formed in a substrate and includes a plurality of pixels for sensing light. The substrate has a first side and a second side opposite to the fir... | 02/09/2012 |
| 20120034730 | Backside Illuminated Sensor Processing The present disclosure provides methods and apparatus for reducing dark current in a backside illuminated semiconductor device. In one embodiment, a method of fabricating a semiconductor device includes providing a substrate having a frontside surface and a backside sur... | 02/09/2012 |
| 20120025060 | SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC INFORMATION DEVICE A color filter is formed using a simple manufacturing method, and bias application to a pixel separating electrode allows sensitivity in low illumination intensity to be improved. In a solid-state imaging element, in which a plurality of unit pixel sections are disposed... | 02/02/2012 |
| 20120018831 | LIGHT PIPE FABRICATION WITH IMPROVED SENSITIVITY In accordance with at least some embodiments of the present disclosure, a process for fabricating a light pipe (LP) is described. The process may be configured to etch a first portion of a LP funnel in a dielectric layer of a semiconductor structure using a web etching ... | 01/26/2012 |
| 20120012960 | METHOD AND SYSTEM OF EMBEDDED MICROLENS A method of making an embedded microlens includes providing a substrate having a photo-sensing region, forming a dielectric film overlying the substrate, forming a mask having a circular opening over the dielectric film, the opening being center-aligned over the photo-s... | 01/19/2012 |
| 20120012961 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING OF SAME A solid-state imaging device (101) includes an imaging area (1), an optical black area (2) provided at a periphery of the imaging area (1), and a light-absorption unit (21) provided above the optical black area (2). In the imagi... | 01/19/2012 |
| 20120012959 | IMAGE SENSORS AND FABRICATION METHOD THEREOF An image sensor is provided. The image sensor includes a pixel sensor, a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween, and a gapless microlens array comprising a plurali... | 01/19/2012 |
| 20120012962 | ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME An electronic device and a method of fabricating the same are provided. The electronic device includes: a photodiode layer; a wiring layer formed on the first surface of the photodiode layer; a plurality of electrical contact pads formed on the wiring layer; a passivati... | 01/19/2012 |
| 20120007200 | Image Sensor and Method for Manufacturing the Same Disclosed is an image sensor including a photo-sensing device, a color filter positioned on the photo-sensing device, a microlens positioned on the color filter, and an insulation layer positioned between the photo-sensing device and the color filter, and including a tr... | 01/12/2012 |
| 20120009720 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME A method of manufacturing a backside illuminated image sensor, including forming a first isolation layer in a first semiconductor layer, such that the first isolation layer defines pixels of a pixel array in the first semiconductor layer, forming a second semiconductor ... | 01/12/2012 |
| 20120008024 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREFOR, SOLID-STATE IMAGING APPARATUS, AND IMAGE CAPTURING APPARATUS A solid-state imaging device includes: a semiconductor substrate that has a light sensing portion which photoelectrically converts incident light; an infrared cut filter layer or a light shielding layer that is provided on a surface side opposite to a light receiving su... | 01/12/2012 |
| 20120000518 | PHOTOELECTRIC CONVERSION DEVICE AND METHOD OF MANUFACTURING THE SAME A photoelectric conversion device is provided in which a first photoelectric conversion module having a plurality of first photoelectric conversion elements formed on one surface of a first translucent insulated substrate and a second photoelectric conversion module hav... | 01/05/2012 |
| 20120003778 | MANUFACTURING METHOD FOR SOLID-STATE IMAGING DEVICE A manufacturing method for a solid-state imaging device according to an embodiment of the present invention includes a step of forming a transparent resin layer above a principal surface of a semiconductor substrate, a step of exposing the transparent resin layer to lig... | 01/05/2012 |
| 20110315949 | APPARATUS AND METHOD FOR SENSING PHOTONS In accordance with an example embodiment of the present invention, an apparatus is provided, including a plurality of photon sensing layers arranged on top of each other, and an intermediate layer between each two adjacent sensing layers, the sensing layers being of gra... | 12/29/2011 |
| 20110309460 | SOLID-STATE IMAGING DEVICE INCLUDING A MULTILAYER WIRING LAYER, COLOR FILTERS, AND LENSES, AND MANUFACTURING METHOD FOR THE SAME The present invention provides a solid-state imaging device comprising: a semiconductor substrate having a pixel region and a peripheral circuit region; a multilayer wiring layer including layers of wiring and an interlayer film interposed therebetween, and disposed abo... | 12/22/2011 |
| 20110303282 | SOLAR GLASS AND MANUFACTURING METHOD THEREOF A solar glass is used for building-integrated photovoltaic (BIPV). From a light-incident side to a light-emitting side, the solar glass sequentially includes a front substrate, a first electrode layer, a photoelectric conversion layer, a second electrode layer, a low em... | 12/15/2011 |
| 20110300662 | METHOD OF FORMING PATTERN AND METHOD OF PRODUCING SOLID-STATE IMAGE PICKUP DEVICE Provided is a method of forming a pattern including the steps of forming a first pattern including a depressed or protruding alignment mark on a substrate; forming a flattening layer on the first pattern; removing a part of the flatting layer above the alignment mark; f... | 12/08/2011 |
| 20110298072 | RIDGE STRUCTURE FOR BACK SIDE ILLUMINATED IMAGE SENSOR Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor includes first and second radiation-detection devices that are disposed in the substrate. The first and second radiation-detection devi... | 12/08/2011 |
| 20110291212 | IMAGING APPARATUS HAVING PHOTOSENSOR AND MANUFACTURING METHOD OF THE SAME A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pad via insulating film under the semiconductor substrate, and a columna... | 12/01/2011 |
| 20110294247 | SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING THE SAME A semiconductor element comprises: a semiconductor substrate; and an amorphous metal oxide film as a first film deposited on the semiconductor substrate. By providing the amorphous metal oxide film as the first film, a recess with a large aspect ratio can be filled. As ... | 12/01/2011 |
| 20110278689 | SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF A solid-state imaging device includes an n-type semiconductor substrate 203, a p-type well 204 provided in the substrate 203, photodiodes 201 arranged in a matrix above the substrate 203, and isolation regions 202 corresponding ... | 11/17/2011 |
| 20110269258 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME A method for manufacturing a solid-state imaging device in which: photo sensor portions are formed in a silicon layer over a substrate, a first conductivity type region being included in the photo sensor portions and a second conductivity type region being formed in the... | 11/03/2011 |
| 20110250717 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be ... | 10/13/2011 |
| 20110242376 | SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS AND CAMERA MODULE A solid-state imaging device includes a photoelectric conversion portion, a charge-receiving portion to which charges are transferred from the photoelectric conversion portion, and a light control film having a reverse tapered opening over the photoelectric conversion p... | 10/06/2011 |
| 20110233702 | SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, METHOD OF DESIGNING SEMICONDUCTOR APPARATUS, AND ELECTRONIC APPARATUS A semiconductor device including a first material layer adjacent to a second material layer, a first via passing through the first material layer and extending into the second material layer, and a second via extending into the first material layer, where along a common... | 09/29/2011 |
| 20110223707 | Backside Illuminated Image Sensor A backside illuminated image sensor includes a substrate, a backside passivation layer disposed on backside of the substrate, and a transparent conductive layer disposed on the backside passivation layer.... | 09/15/2011 |
| 20110220971 | PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager device can include a semiconductor substrate having multiple doped regions forming a least one junction, a textured ... | 09/15/2011 |
| 20110217807 | Image sensor array with conformal color filters An image sensor pixel includes a photo-sensor region, a microlens, a first color filter layer, and a second color filter layer. The photo-sensor region is disposed within a semiconductor die. The microlens is disposed on the semiconductor die in optical alignment with t... | 09/08/2011 |
| 20110212567 | METHOD OF FABRICATING IMAGE SENSOR AND REWORKING METHOD THEREOF A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region ar... | 09/01/2011 |
| 20110207258 | METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STRUCTURE A method for forming a pad in a wafer with a three-dimensional stacking structure includes: (a) a first process of bonding a device wafer and a handling wafer; (b) a second process of thinning a back side of an Si substrate which is formed on the device wafer, after the... | 08/25/2011 |
| 20110198486 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME An image sensor includes a color filter, an over-coating layer formed on the color filter, and a medium layer formed on the over-coating layer, wherein the medium layer is configured with at least two medium layers of which refractive indices are different from each oth... | 08/18/2011 |
| 20110193147 | BACKSIDE ILLUMINATION CMOS IMAGE SENSORS AND METHODS OF MANUFACTURING THE SAME Backside illumination CMOS image sensors having convex light-receiving faces and methods of manufacturing the same. A backside illumination CMOS image sensor includes a metal layer, an insulating layer and a photodiode. The insulating layer is on the metal layer. The ph... | 08/11/2011 |
| 20110186950 | METHOD OF FABRICATING IMAGE SENSOR AND IMAGE SENSOR THEREOF A method of fabricating an image sensor and an image sensor thereof are provided. The method comprises: providing a mask; utilizing the mask at a first position to form a first group of micro-lenses having a first height on a first group of color filters of a color filt... | 08/04/2011 |
| 20110186951 | BACKSIDE ILLUMINATED SENSOR AND MANUFACTURING METHOD THEREOF Disclosed is a backside illuminated image sensor including a light receiving element formed in a first substrate, an interlayer insulation layer formed on the first substrate including the light receiving element, a via hole formed through the interlayer insulation laye... | 08/04/2011 |
| 20110189809 | ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE SAME AND METHOD OF FORMING THE SAME An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including, but not limited to, v-shaped, u-shaped, or other shaped features. Light sensors having such an indentation fea... | 08/04/2011 |
| 20110177646 | IMAGE SENSOR WITH IMPROVED COLOR CROSSTALK An image sensor comprises a substrate of a first conductivity type. First and second pixels are arrayed over the substrate. A potential barrier is formed in a region of the substrate corresponding to the first pixel but not in a region of the substrate corresponding to ... | 07/21/2011 |
