Did You Know...
...that when IBM conducted a market study of Chester Carlson's invention in 1959, the company concluded that it would take only 5000 units of his new product to saturate the market? IBM therefore declined to be part of the new product introduction. Too bad for IBM. Carlson's invention was the xerography process, and his new product was the beginning of the Xerox Corporation. It is estimated that every day, worldwide, 3,000,000,000 copies are made!!
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20120012854 | ACTIVE MATRIX SUBSTRATE, DISPLAY PANEL, DISPLAY DEVICE, AND LASER IRRADIATION METHOD In an active matrix substrate (29), a part of the drain electrode (15) of a TFT (10), which corresponds to an auxiliary capacitor electrode (26), is overlapped with a capacitor signal line (25). The auxiliary capacitor electrode (26... | 01/19/2012 |
| 20110201199 | LASER ANNEALING FOR 3-D CHIP INTEGRATION A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam... | 08/18/2011 |
| 20090233418 | Methods of Processing Semiconductor Wafers Having Silicon Carbide Power Devices Thereon Methods of forming a silicon carbide semiconductor device are disclosed. The methods include forming a semiconductor device at a first surface of a silicon carbide substrate having a first thickness, and mounting a carrier substrate to the first surface of the silicon c... | 09/17/2009 |
| 20080093742 | System For Shielding Integrated Circuits A method for adding an additional layer to an integrated circuit, the method including providing an integrated circuit having an interconnect layer, depositing, over substantially all of an exposed surface of the integrated circuit, an additional layer of material whose... | 04/24/2008 |
| 20070298575 | METHODS FOR CONTACT RESISTANCE REDUCTION OF ADVANCED CMOS DEVICES Methods for reducing contact resistance in semiconductor devices are provided in the present invention. In one embodiment, the method includes providing a substrate having semiconductor device formed thereon, wherein the device has source and drain regions and a gate st... | 12/27/2007 |
| 20070075057 | Method for fine tuning circuit and controlling impedance with laser process A method for actively controlling he fine-tuning and impedance matching using a laser process is provided, including the use of a laser process equipment, a monitor device, and a feedback controller. The laser process equipment is for performing laser soldering or laser... | 04/05/2007 |
| 20070037387 | Method to form an interconnect Embodiments of methods, apparatuses, devices, and/or systems for forming an interconnect are described. ... | 02/15/2007 |
| 20060252261 | Laser irradiation apparatus and method for manufacturing semiconductor device The present invention provides a laser irradiation apparatus which can accurately control positions of beam spots of laser beams emitted from laser oscillators and the distance between the adjacent beam spots. A laser irradiation apparatus of the present invention inclu... | 11/09/2006 |
| 20060246721 | Technique for forming interconnect structures with reduced electro and stress migration and/or resistivity By improving the purity of metal lines and the crystalline structure, the overall performance of metal lines, especially of highly scaled copper-based semiconductor devices, may be enhanced. The modification of the crystalline structure of the metal lines may be perform... | 11/02/2006 |
| 20060079086 | Apparatus and method of forming silicide in a localized manner Localized trenches or access holes are milled in a semiconductor substrate to define access points to structures of an integrated circuit intended for circuit editing. A conductor is deposited, such as with a focused ion beam tool, in the access holes and a localized he... | 04/13/2006 |
| 20050181602 | Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method An alloying method includes the steps of forming a metal layer on a semiconductor having been transferred to a material having a low thermal conductivity, and alloying an interface between the semiconductor and the metal layer by irradiating the interface with a laser b... | 08/18/2005 |
| 20050181601 | Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method An alloying method includes the steps of forming a metal layer on a semiconductor having been transferred to a material having a low thermal conductivity, and alloying an interface between the semiconductor and the metal layer, by irradiating the interface with a laser ... | 08/18/2005 |
| 20050158904 | Device transferring method A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser ... | 07/21/2005 |
| 20050048676 | Method for producing an electronic component, especially a memory chip A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of the ... | 03/03/2005 |
| 20050048770 | Process for manufacturing a wiring board having a via A process for manufacturing a wiring board comprising a substrate made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrat... | 03/03/2005 |
| 20050032262 | Method of manufacturing flat panel displays To enable formation of a pattern of constituent elements, arranged in correspondence with an arrangement of cells in a display region, as desired or required with a minimized quantity of the film material, a method of manufacturing a flat panel display is provided, whic... | 02/10/2005 |
