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Apparatus for Simulating a High Five
A self-righting hand-arm configuration which is adapted to pivot when struck by a user, thereby simulating a "high five."
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| Application No. | Application Title | Issue Date |
| 20120048596 | Structure And Process For Electrical Interconnect And Thermal Management A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substr... | 03/01/2012 |
| 20110281419 | METHOD FOR MANUFACTURING DIELECTRIC ISOLATION TYPE SEMICONDUCTOR DEVICE A method for manufacturing a dielectric isolation type semiconductor device comprises: forming a plurality of trenches in a first region on a major surface of a semiconductor substrate; forming a first dielectric layer on the major surface of the semiconductor substrate... | 11/17/2011 |
| 20100193884 | Method of Fabricating High Aspect Ratio Transducer Using Metal Compression Bonding A method and apparatus are described for fabricating a high aspect ratio MEMS device by using metal thermocompression bonding to assemble a reference wafer (100), a bulk MEMS active wafer (200), and a cap wafer (300) to provide a proof mass (200<... | 08/05/2010 |
| 20100181676 | SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL A method that in one embodiment is useful in bonding a first substrate to a second substrate includes forming a layer including metal over the first substrate. The layer including metal in one embodiment surrounds a semiconductor device, which can be a micro electromech... | 07/22/2010 |
| 20090315169 | FRAME AND METHOD OF MANUFACTURING ASSEMBLY The frame (1) comprises an intermediate layer (5) sandwiched between a first layer (3) with a first pattern and a second layer (4) with a second pattern. Adhesion layers (2,12) are present on the first and second layer (3,4) res... | 12/24/2009 |
| 20090305482 | SYSTEMS, DEVICES, AND METHODS FOR SEMICONDUCTOR DEVICE TEMPERATURE MANAGEMENT Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes a semiconductor die formed of integr... | 12/10/2009 |
| 20090220710 | PROCESS OF MAKING A MICROTUBE AND MICROFLUIDIC DEVICES FORMED THEREWITH A process for producing a micromachined tube (microtube) suitable for microfluidic devices. The process entails isotropically etching a surface of a first substrate to define therein a channel having an arcuate cross-sectional profile, and forming a substrate structure ... | 09/03/2009 |
| 20090194787 | VERTICAL OUTGASSING CHANNELS InP epitaxial material is directly bonded onto a Silicon-On-Insulator (SOI) wafer having Vertical Outgassing Channels (VOCs) between the bonding surface and the insulator (buried oxide, or BOX) layer. H2O and other molecules near the bonding surface migrate t... | 08/06/2009 |
| 20090057879 | STRUCTURE AND PROCESS FOR ELECTRICAL INTERCONNECT AND THERMAL MANAGEMENT A structure and method for thermal management of integrated circuits. The structure for thermal management of integrated circuits includes first and second substrates bonded together, at least one of the first and second substrates including at least one circuit element... | 03/05/2009 |
| 20080277258 | MEMS plate switch and method of manufacture Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flex... | 11/13/2008 |
| 20080264471 | Solar cell modules comprising compositionally distinct encapsulant layers The present invention provides a solar cell pre-laminate assembly comprising one or more solar cells laminated between two compositionally distinct encapsulant layers, and the method of preparing a solar cell module from such an assembly.... | 10/30/2008 |
| 20080261377 | METHOD OF FORMING A DEVICE WAFER WITH RECYCLABLE SUPPORT A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material that is suitable for receiving or forming electronic devices thereon, pr... | 10/23/2008 |
| 20080217782 | METHOD FOR PREPARING 2-DIMENSIONAL SEMICONDUCTOR DEVICES FOR INTEGRATION IN A THIRD DIMENSION A method which is intended to facilitate and/or simplify the process of fabricating interlayer vias by selective modification of the FEOL film stack on a transfer wafer is provided. Specifically, the present invention provides a method in which two dimensional devices a... | 09/11/2008 |
| 20080218281 | Anodically Bonded Cell, Method for Making Same and Systems Incorporating Same A cell suitable for use with an atomic clock and a method for making the same, the cell including: a silicon wafer having a recess formed therein; at least one amorphous silicate member having an ion mobility and temperature expansion coefficient approximately that of s... | 09/11/2008 |
| 20080188059 | INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR A micromachined sensor and a process for fabrication and vertical integration of a sensor and circuitry at wafer-level. The process entails processing a first wafer to incompletely define a sensing structure in a first surface thereof, processing a second wafer to defin... | 08/07/2008 |
| 20080164606 | SPACERS FOR WAFER BONDING A deformable spacer for wafer bonding applications is disclosed. The spacer may be used to keep wafers separated until desired conditions are achieved.... | 07/10/2008 |
| 20080128901 | Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structure Semiconductor devices (300, 400, and 500) including an integrated circuit (IC) device (100) coupled to a micro-electro-mechanical systems (MEMS) device (200) and a method (600) for producing same are disclosed. The IC device includes a... | 06/05/2008 |
| 20080124895 | WAFER BONDING METHOD The invention is directed to a wafer bonding method for bonding a first wafer with a second wafer, wherein the first wafer has a first top surface and the second wafer has a second top surface formed thereon and the first wafer bonds with the second wafer in a manner th... | 05/29/2008 |
| 20080096301 | Micro electro mechanical system Embodiments of a micro electro mechanical system are disclosed.... | 04/24/2008 |
| 20080029878 | Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers The invention relates to a process for and an arrangement of the connection of processed semiconductor wafers (1, 2) wherein, in addition to the firm connection, there is an electric connection (5) between the semiconductor wafers and/or the electronic str... | 02/07/2008 |
| 20070284681 | APPARATUS AND METHOD FOR PROTECTIVE COVERING OF MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES A microelectromechanical system (MEMS) assembly includes a MEMS substrate having a plurality of MEMS devices, a plurality of bond pads, and a wafer cap. The wafer cap includes a unitary structure having a plurality of pockets and a plurality of apertures. The wafer cap ... | 12/13/2007 |
| 20070238262 | Wafer bonding material with embedded rigid particles A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be... | 10/11/2007 |
| 20070196998 | System and method for forming moveable features on a composite substrate A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable fea... | 08/23/2007 |
| 20070194663 | Packaging and Integration System for Micro Sensors in the Marine Environment The integrated unmanned, affordable, microsystem in accordance with the present invention is used to deploy physical or chemical sensors for continuous monitoring of sea space over large time periods. The microsystem is capable of measuring ocean physical parameters ove... | 08/23/2007 |
| 20070161149 | METHOD OF FABRICATING ORGANIC ELECTRONIC DEVICE A fabricating method of organic electronic device is provided. The method comprises: providing a flexible substrate; fabricating a plurality of organic elements on the flexible substrate; fabricating a patterned spacing layer on the flexible substrate; and arranging a c... | 07/12/2007 |
| 20070141805 | Method for bonding plastic micro chip Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. A... | 06/21/2007 |
| 20070077676 | METHOD OF FABRICATING PRESSURE SENSOR A method of fabricating a pressure sensor. An SOI wafer having a single crystalline silicon layer, an insulating layer and a silicon substrate is provided. The single crystalline silicon layer has a pressure sensing device. The silicon substrate and the insulating layer... | 04/05/2007 |
| 20070042565 | Fluidic MEMS device A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner ... | 02/22/2007 |
| 20070026636 | Wide and narrow trench formation in high aspect ratio MEMS Methods have been provided for forming both wide and narrow trenches on a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer (126), an active layer (128), and a first sacrificial layer (130) disposed at ... | 02/01/2007 |
| 20070026559 | System and method for direct-bonding of substrates A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port... | 02/01/2007 |
| 20070015341 | METHOD OF MAKING MEMS WAFERS A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. One or more vias filled with conductive or semiconductive material is etched one of the wafers to form one or more rods extending throu... | 01/18/2007 |
| 20070010067 | Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same A transferring method including providing a substrate, forming a transferred layer over the substrate, joining a transfer member to the transferred layer, and removing the transferred layer from the substrate. The transferring method further includes transferring the tr... | 01/11/2007 |
| 20060292823 | Method and apparatus for bonding wafers Embodiments of a method and apparatus for bonding wafers are disclosed. The bonded wafers may include self-passivating interconnects. Other embodiments are described and claimed. ... | 12/28/2006 |
| 20060240582 | Methods relating to the reconstruction of semiconductor wafers for wafer-level processing Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed in contact with liquid, gel or other flowable alignment droplets in a si... | 10/26/2006 |
| 20060176224 | Antenna module fabrication method for a wireless electronic device The antenna module fabrication for a wireless electronic device includes setting up the antenna and the assembly base that is to connect the antenna to the designated circuit board. The antenna and the assembly base are two independent pieces, and the positioning parts ... | 08/10/2006 |
| 20060160274 | Methods relating to forming interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric mater... | 07/20/2006 |
| 20060141745 | Method and system for wafer bonding of structured substrates for electro-mechanical devices A method for forming a composite substrate structure. The method includes providing a first substrate, the first substrate having a surface region and a backside region, providing a handling substrate, the handling substrate having a bonding surface and a handling surfa... | 06/29/2006 |
| 20060110843 | Method of manufacturing an external force detection sensor A method of manufacturing an external force detection sensor in which a sensor element is formed by through-hole dry etching of an element substrate, and an electrically conductive material is used as an etching stop layer during the dry etching. ... | 05/25/2006 |
| 20060068564 | Micromachined electromechanical device A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation.... | 03/30/2006 |
| 20050227400 | ENCAPSULATION WAFER PROCESS A method of processing a wafer, and particularly a cap wafer configured for mating with a device wafer in the production of a die package. Masking layers are deposited on oxide layers present on opposite surfaces of the wafer, after which the masking layers are etched t... | 10/13/2005 |
