Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Application No. | Application Title | Issue Date |
| 20120126378 | SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING A package for a semiconductor device includes shielding from RF interference. The package has a lead frame with a lead and a connecting bar. The lead has an inner end for connecting to the device and an outer end having an exposed surface at the package side face. The c... | 05/24/2012 |
| 20120104584 | SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER AND RELATED METHODS A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configur... | 05/03/2012 |
| 20120104585 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the ... | 05/03/2012 |
| 20120108013 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mech... | 05/03/2012 |
| 20120083072 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Performing electrolysis plating to a wiring is made possible, aiming at the increasing of pin count of a semiconductor device. Package substrate 3 by which ring shape common wiring 3p for electric supply was formed in the inner area of bonding lead ... | 04/05/2012 |
| 20120068318 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADDLE MOLDING AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar wit... | 03/22/2012 |
| 20120068319 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and ... | 03/22/2012 |
| 20120068317 | TSOP WITH IMPEDANCE CONTROL A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial port... | 03/22/2012 |
| 20120052631 | LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding mater... | 03/01/2012 |
| 20120045870 | Method of Manufacturing Leadless Integrated Circuit Packages Having Electrically Routed Contacts A method of manufacturing a leadless integrated circuit (IC) package comprising an IC chip mounted on a metal leadframe and a plurality of electrical contacts electrically coupled to the IC chip. The IC chip, the electrical contacts, and a portion of the metal leadframe... | 02/23/2012 |
| 20120043650 | Packaging Integrated Circuits An integrated circuit 15 is placed onto a lead frame 101 having lead fingers 109 of substantially constant thickness along their length. Wires are formed from the lead fingers 109 to corresponding electrical contacts the integrated circuit. F... | 02/23/2012 |
| 20120038036 | Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using t... | 02/16/2012 |
| 20120032316 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MOLD, AND SEALING DEVICE A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the f... | 02/09/2012 |
| 20120032315 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an... | 02/09/2012 |
| 20120034742 | SEMICONDUCTOR DEVICE To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a sou... | 02/09/2012 |
| 20120025357 | LEADFRAME FOR IC PACKAGE AND METHOD OF MANUFACTURE A leadframe for use in an integrated circuit (IC) package comprising a metal strip partially etched on a first side. In some embodiments, the leadframe may be selectively plated on the first side and/or on a second side. The leadframe may be configured for an IC chip to... | 02/02/2012 |
| 20120025358 | SEMICONDUCTOR ELEMENT WITH SEMICONDUCTOR DIE AND LEAD FRAMES A semiconductor element to be mounted on a circuit carrier includes a semiconductor die and at least one lead frame. In order to reduce the size required for mounting a semiconductor die on a circuit carrier, a semiconductor element includes a semiconductor die and at l... | 02/02/2012 |
| 20120025210 | OPTICAL MODULE ENCLOSING LEAD FRAME AND SEMICONDUCTOR OPTICAL DEVICE MOUNTED ON THE LEAD FRAME WITH TRANSPARAENT MOLD RESIN An optical module with a new arrangement is disclosed. The optical module molds devices with a resin transparent to light subject to the device mounted on the lead frame and electrically connected with the lead frame by the bonding wire. The lead frame provides a screen... | 02/02/2012 |
| 20120028397 | ULTRA-THIN QUAD FLAT NO-LEAD (QFN) PACKAGE An ultra-thin Quad Flat No-Lead (QFN) semiconductor chip package having a leadframe with lead terminals formed by recesses from both the top and bottom surfaces and substantially aligned contact areas formed on either the top or bottom surfaces. A die is electrically co... | 02/02/2012 |
| 20120018859 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME To suppress a short circuit between neighboring wires which is caused when the loop of a wire is formed into multiple stages in a semiconductor device in which a wiring board and one semiconductor chip mounted over a main surface thereof are electrically coupled with th... | 01/26/2012 |
| 20120018866 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package padd... | 01/26/2012 |
| 20120018865 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND EMBEDDED PADDLE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an open... | 01/26/2012 |
| 20120018858 | METHOD OF ASSEMBLING INTEGRATED CIRCUIT DEVICE A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The metho... | 01/26/2012 |
| 20120012879 | LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES AND METHODS OF FORMING LEADFRAME-BASED PACKAGES FOR SOLID STATE LIGHT EMITTING DEVICES A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickne... | 01/19/2012 |
| 20120015479 | Semiconductor Package with a Mold Material Encapsulating a Chip and a Portion of a Lead Frame Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connecte... | 01/19/2012 |
| 20120009739 | Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhesion to Polymeric Compounds A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include two-di... | 01/12/2012 |
| 20120009737 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE When chip-scale molding system is employed for QFP, the number of semiconductor devices available from a leadframe decreases because cavities each requires a runner portion. This problem can be overcome by employing MAP system, but use of a laminate tape increases the p... | 01/12/2012 |
| 20120001308 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME In a semiconductor module, a first heat sink is disposed on a rear surface of a first semiconductor chip constituting an upper arm, and a second heat sink is disposed on a front surface of the first semiconductor chip through a first terminal. A third heat sink is dispo... | 01/05/2012 |
| 20120001311 | PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE In a package for a semiconductor device according to the present invention, steps 10 are provided at least on the sides of lead frames 1 and 2 at exposed portions in the opening of a resin part 3, thereby increasing adhesion between the lead ... | 01/05/2012 |
| 20120001306 | SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which ... | 01/05/2012 |
| 20120001310 | PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE A package for a semiconductor device according to the present invention includes at least one through hole 6 provided on at least one of lead frames 1 and 2. Thus when resin is injected to form a mounting region 4 of a semiconductor element w... | 01/05/2012 |
| 20120001312 | PACKAGE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE In a package for a semiconductor device according to the present invention, coating resin 10 covers the boundaries between lead frames 1 and 2 and holding resin 6, at exposed portions in the opening of a resin part 3, thereby closing g... | 01/05/2012 |
| 20110316135 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME When a metal ribbon is ultrasonic-bonded, a peripheral area of an island and hanging pins provided in the periphery of the island need to be clamped by use of clampers of a bonder to prevent the island from being lifted up. However, if no sufficiently-wide peripheral ar... | 12/29/2011 |
| 20110316132 | Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe A semiconductor device has a vertically offset BOT interconnect structure. The vertical offset is achieved with a leadframe having a plurality of lead fingers around a die paddle. A first conductive layer is formed over the lead fingers. A second conductive layer is for... | 12/29/2011 |
| 20110316130 | THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads t... | 12/29/2011 |
| 20110312134 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES The reliability of a semiconductor device is enhanced. A first lead frame, a first semiconductor chip, a second lead frame, and a second semiconductor chip are stacked over an assembly jig in this order with solder in between and solder reflow processing is carried out ... | 12/22/2011 |
| 20110304031 | SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE EQUIPPED WITH BONDING WIRES Disclosed is a semiconductor device including a printed-circuit board which includes a plurality of first electrodes, a plurality of second electrodes and a semiconductor chip on which a plurality of first connection pads are aligned in a first line being disposed along... | 12/15/2011 |
| 20110304033 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE STORAGE METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR MANUFACTURING APPARATUS A semiconductor package has a semiconductor chip, a lead frame in which a semiconductor chip is mounted on a die pad, and a resin sealing the semiconductor chip and the die pad from an upper surface and a lower surface, the resin has a concave portion disposed at the su... | 12/15/2011 |
| 20110298113 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the conne... | 12/08/2011 |
| 20110300668 | USE OF DEVICE ASSEMBLY FOR A GENERALIZATION OF THREE-DIMENSIONAL METAL INTERCONNECT TECHNOLOGIES An assembly process properly positions and align a plurality of first die within a carrier substrate. The first die are positioned within cavities formed in the carrier substrate. The carrier substrate is then aligned with a second substrate having a plurality of second... | 12/08/2011 |
