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| Application No. | Application Title | Issue Date |
| 20110030758 | PHOTOVOLTAIC DEVICE AND MANUFACTURING METHOD THEREOF To manufacture a photovoltaic device through a first step of sequentially stacking a transparent electrode, a photovoltaic layer, and a rear surface electrode to thereby form a structure in which photovoltaic cells are serially connected, a second step of measuring char... | 02/10/2011 |
| 20110005571 | METHOD AND APPARATUS FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL A method for manufacturing a solar cell, includes: forming a photoelectric converter which includes a plurality of compartment elements, and in which the compartment elements adjacent to each other are electrically connected; specifying a first compartment element havin... | 01/13/2011 |
| 20100283126 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF A semiconductor device includes a semiconductor substrate that is made of either of silicon carbide (SiC) and gallium nitride (GaN), and has a defect region containing a crystal defect; a first insulating film that coats the defect region and is arranged on the semicond... | 11/11/2010 |
| 20080311684 | Programmable Chip Enable and Chip Address in Semiconductor Memory Memory die are provided with programmable chip enable circuitry to allow particular memory die to be disabled after packaging and/or programmable chip address circuitry to allow particular memory die to be readdressed after being packaged. In a multi-chip memory package... | 12/18/2008 |
| 20080283878 | Method and Apparatus for Monitoring Endcap Pullback Various apparatus and methods of monitoring endcap pullback are disclosed. In one aspect, an apparatus is provided that includes a substrate that has a plurality of semiconductor regions. Each of the plurality of semiconductor regions has a border with an insulating str... | 11/20/2008 |
| 20070298523 | SILICON WAFERS AND METHOD OF FABRICATING THE SAME By using a two-step RTP (rapid thermal processing) process, the wafer is provided which has an ideal semiconductor device region secured by controlling fine oxygen precipitates and OiSFs (Oxidation Induced Stacking Fault) located on the surface region of the wafer. By p... | 12/27/2007 |
| 20070284578 | ARRAY SUBSTRATE FOR LIQUID CRYSTAL DISPLAY AND METHOD OF TESTING An array substrate including a signal line, a test line to inspect the open of the signal line and fault of the pixels, and a fuse electrically connecting the signal line with the test line. The fuse is opened when a current higher than a reference current is applied th... | 12/13/2007 |
| 20070224710 | Methods to shape the electric field in electron devices, passivate dislocations and point defects, and enhance the luminescence efficiency of optical devices A fluorine treatment that can shape the electric field profile in electronic devices in 1, 2, or 3 dimensions is disclosed. A method to increase the breakdown voltage of AlGaN/GaN high electron mobility transistors, by the introduction of a controlled amount of dispersi... | 09/27/2007 |
| 20070181192 | Method and apparatus for monitoring gas flow amount in semiconductor manufacturing equipment An apparatus for monitoring gas flow in a semiconductor manufacturing equipment, includes an exhaust line, a flow amount measuring unit, and a controller unit having a first input electrically connected to the flow amount measuring unit and a second input having a prede... | 08/09/2007 |
| 20060172440 | Transistor-level signal cutting method and structure A modifiable circuit structure and its method of formation are disclosed. The modifiable circuit structure electrically couples one portion of an interconnect with another portion of the interconnect through vias disposed in a dielectric layer. The combination of the mo... | 08/03/2006 |
| 20060077363 | Correcting device, exposure apparatus, device production method, and device produced by the device production method A correcting device that properly maintains the flatness of a mask, an exposure apparatus in which overlay accuracy is increased by making use of the correcting device, and a device production method. The correcting device includes a gas flow path including a first area... | 04/13/2006 |
| 20060035392 | Application of lignin derivatives to photoelectric transducer and photoelectrochemical cell The invention regards application of lignin derivatives to a photoelectric transducer. The photoelectric transducer of the invention includes a semiconductor film as a thin film electrode, that is photosensitized by one or multiple lignin derivatives selected from the g... | 02/16/2006 |
| 20060024849 | Method and system for characterizing porous materials A method and system for diagnosing the effectiveness of a treatment on a porous material. For example, the porous material can include a porous low dielectric constant material. In particular, the method can utilize FTIR spectroscopy to characterize the porosity of mate... | 02/02/2006 |
| 20050136559 | Quality improvement system A quality improvement system, which automatically performs engineering analysis and problem coping to improve the quality of semiconductor products. The quality improvement system is connected to a plurality of external databases, which store semiconductor product quali... | 06/23/2005 |
| 20050059173 | Test apparatus for a semiconductor package A test apparatus for a semiconductor package which has at least one chip and a plurality of solder balls includes a socket body, a circuit substrate, and a socket lid. The socket body has a plurality of traces electrically connected to an exterior electric test apparatu... | 03/17/2005 |
| 20050054124 | Silicon wafers and method of fabricating the same By using a two-step RTP (rapid thermal processing) process, the wafer is provided which has an ideal semiconductor device region secured by controlling fine oxygen precipitates and OiSFs (Oxidation Induced Stacking Fault) located on the surface region of the wafer. By p... | 03/10/2005 |
