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Class 428/457 - Of metal


Subclass of Class 428 - Stock material or miscellaneous articles
Definition: Product in which at least one layer contains metal*.
No. of applications: 1576
Last issue date: 05/03/2012


    3                  
Application No.Application TitleIssue Date
20110293955METHODS OF FORMING A BORON NITRIDE, A METHOD OF CONDITIONING A BALLISTIC WEAPON, AND A METAL ARTICLE COATED WITH A MONOMERIC BORON-NITROGEN COMPOUND
A method of forming a boron nitride. The method comprises contacting a metal article with a monomeric boron-nitrogen compound and converting the monomeric boron-nitrogen compound to a boron nitride. The boron nitride is formed on the same or a different metal article. T...
12/01/2011
20110287271METHOD FOR PRODUCING A COATING POWDER
A method for producing a coating powder is provided, including the steps of providing a powdery basic composition, comprising binders, and mixing at least one powdery aggregate with the powdery basic composition to produce a finished coating powder, wherein, during mixi...
11/24/2011
20110287940OPTICAL ELEMENT AND APPARATUS COMPRISING TRANSPARENT SUPERCONDUCTING MATERIAL
An optical element is disclosed which includes transparent superconductor material....
11/24/2011
20110287238METHODS OF FORMING AT LEAST A PORTION OF EARTH-BORING TOOLS, AND ARTICLES FORMED BY SUCH METHODS
Methods of forming at least a portion of an earth-boring tool include providing at least one insert in a mold cavity, providing particulate matter in the mold cavity, melting a metal and the hard material to form a molten composition, and casting the molten composition....
11/24/2011
20110287270METHOD FOR FORMING A BORON-CONTAINING THIN FILM AND MULTILAYER STRUCTURE
To provide a method for forming a boron-containing thin film, by which a uniform boron thin film with good adhesion can be formed on the surface of a processing object, and also to provide a multilayer structure. An electrolysis apparatus includes an anode 1, a p...
11/24/2011
20110287272POLYMER COMPOSITIONS FOR METAL COATING, ARTICLES MADE THEREFROM AND PROCESS FOR SAME
Metal-coated thermoplastic compositions comprising “flat” fibrous reinforcing filler have improved resistance to repeated thermal shock. Disclosed herein are metal coated compositions useful in automotive parts, toys, appliances, power tools, industrial machinery, a...
11/24/2011
20110281081Metallized Polymeric Film Reflective Insulation Material
A method of thermally insulating an object that requires a Class A standard insulation material, said method comprising suitably locating a metallized polymeric reflective insulation material adjacent said object, wherein said polymeric material is selected from a close...
11/17/2011
20110281108SURFACE COOLING
Exemplary embodiments of a method, system, and apparatus for electro-plating an alloy upon a cathode. For example, a bath which includes disodium tungstate and an iron group substrate in an aqueous solution with a complexant to form complexes which remain in suspension ...
11/17/2011
20110278395STRUCTURAL COMPONENT WITH IMPROVED CONDUCTIVITY AND MECHANICAL STRENGTH, AND A METHOD FOR ITS MANUFACTURE
A structural component includes a fiber composite material structure having an outer surface and an electrically conductive metal profile disposed on the outer surface of the fiber composite material structure. The metal profile provides provide improved electrical cond...
11/17/2011
20110278531Forming Electrodes for Chalcogenide Containing Devices
The electrode of a phase change memory may be formed with a mixture of metal and a non-metal, the electrode having less nitrogen atoms than metal atoms. Thus, in some embodiments, at least a portion of the electrode has less nitrogen than would be the case in a metal ni...
11/17/2011
20110281106GAS BARRIER SHEET AND MANUFACTURING METHOD THEREOF
A gas barrier sheet improved in a gas barrier property and a manufacturing method thereof are provided.

A gas barrier sheet 1 includes at least a base material 2 and a gas barrier film 3 provided on the base material

11/17/2011
20110281124SOLUTION AND PROCESS FOR INCREASING THE SOLDERABILITY AND CORROSION RESISTANCE OF A METAL OR METAL ALLOY SURFACE
Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface....
11/17/2011
20110281482NOVEL LOWER COST REUSABLE POLYMER BINDER
Exemplary embodiments provide compositions for erasable media and methods of forming polymers for erasable media. The method can include providing a first monomer, the first monomer including one or more alkoxylated bisphenols and adding at least one second monomer and ...
11/17/2011
20110272238COMPOSITE COMPONENTS HAVING VARIABLE SURFACE PROPERTIES
One exemplary embodiment comprises a load transfer device that includes a composite component having a variable and controllable surface roughness. The component may comprise a base substrate, a compliant layer over the base substrate, and a top layer over the compliant...
11/10/2011
20110274918MEDICAL DEVICE HAVING SURFACE LUBRICITY IN WET STATE
A medical device wherein a metal base and a surface lubricating layer are fixed with each other more firmly. The medical device permanently exhibits excellent surface lubricity when in use. A medical device which has a lubricating surface when wet, is characterized by c...
11/10/2011
20110275261FAST FILM FORMATION WATER BASED BARRIER COATING
The invention relates to a composition which, when mixed with a polymer composition, allows for the formation of a continuous and cohesive film. The film is characterized in that it provides water, grease and oil resistance, provides a water vapour barrier and can be us...
11/10/2011
20110274937LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS
[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, an...
11/10/2011
20110272263METAL DOME SHEET COMPRISING CONDUCTIVITY SHEET
The keypad assembly uses a metal dome sheet that shields electromagnetic waves and noise. A metal dome is placed on a base sheet. And a conductive sheet is placed above the base sheet to shield electromagnetic waves and noise....
11/10/2011
20110274796BARRIER FILM WITH RECLAIMED METALIZED POLYESTER
A method reclaims metalized polymer film or mixtures containing metal and/or metal alloys into a metal-containing, polymeric film. The resulting film structure has better oxygen and moisture barrier properties when metalized than plain metalized polymer films. The polym...
11/10/2011
20110274888Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material
The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate....
11/10/2011
20110275033Palladium-Cobalt Based Alloys
A nonmagnetic alloy is provided based on a palladium-cobalt binary system with the addition of gold, has a coefficient of thermal expansion (CTE) of about 13.8 to about 15 and may include one or more of the following additive metals: aluminum, boron, chromium, gallium, ...
11/10/2011
20110268960FIRE-RESTRICTIVE ARRANGEMENT IN REINFORCED PLASTIC SHIPS
Flame-retarding arrangement for reinforced-plastic boats which may be of two kinds: Either a solid laminate arrangement formed by various layers of reinforced plastic with flame-retarding additives, with a coating of intumescent paint or a sandwich-type laminate arrange...
11/03/2011
20110268973NANOTEXTURED SURFACES
The invention describes novel compositions that include a cross linking compound, a polymer and a 1 nm to about a 25 micron sized particle optionally with an oxide layer. In particular, the particle is a silica and one which has been pretreated with a silane....
11/03/2011
20110268977ELECTRONIC COMPONENT DEVICE AND METHOD FOR PRODUCING THE SAME
In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness ...
11/03/2011
20110268920TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME
A tin-plated product formed by electroplating a substrate in a tin plating solution, which contains carbon particles and an aromatic carbonyl compound, to form a coating of a composite material, which contains the carbon particles in a tin layer, on the substrate has a ...
11/03/2011
20110268577METHOD FOR SMOOTHING THE SURFACE OF A PART MADE FROM A CMC MATERIAL
A method of smoothing the surface of a ceramic matrix composite part presenting a surface that is undulating and rough. The method includes forming a ceramic coating on the surface of the part, the coating being made by applying a liquid composition on the surface of th...
11/03/2011
20110263011ANTIFOULING COATING COMPOSITION COMPRISING FUNCTIONALIZED NANOPARTICLES
Method for providing a substrate with an anti-biofouling coating the method comprising: a. obtaining a coating composition comprising nanoparticles being grafted with reactive groups and hydrophilic polymer chains and a solvent; b. applying the coating composition to th...
10/27/2011
20110263433HIGH-TEMPERATURE SUPERCONDUCTIVE LAYER ARRANGEMENT
A high-temperature superconductor layer arrangement includes at least one substrate and one textured buffer layer made of oxidic material. The buffer layer displays at least one further constituent forming a homogeneous mixed-crystal layer. The further constituent is a ...
10/27/2011
20110259848Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the rolled copper foil or the electrolytic copper foil comprises a nickel alloy layer with lower etching rate than copper, which i...
10/27/2011
20110259571HYDROPHILIC COMPOSITION AND HYDROPHILIC MEMBER HAVING ANTIFUNGAL PROPERTY
The invention can provide a hydrophilic composition and a hydrophilic member having high hydrophilic property and excellent durability and high antifungal effect.

The hydrophilic composition includes a hydrophilic polymer (I) that includes ...

10/27/2011
20110262667COMPOSITE MATERIAL AND PRODUCTION PROCESSES
The invention relates to a composite material and to processes for producing it. A composite material according to the invention contains at least one reinforcing component with an at least partially crystal-oriented titanium and/or titanium alloy phase. A composite mat...
10/27/2011
20110262768METHOD FOR PRODUCING FITTINGS, LATERAL GRIDS AND SHELVES FOR HIGH TEMPERATURE APPLICATONS AND METAL COMPONENT
A method for producing a component of a pullout guide for high-temperature applications includes the method steps of: producing a metal blank; applying a plasma polymer coating to a surface of the blank; heating the coated blank to a temperature of at least 400° C.; an...
10/27/2011
20110261473Articles Having Improved Corrosion Resistance
The present application relates to a method for enhancing metal corrosion resistance of a metal deposited on a substrate, the method comprises contacting the metal coated substrate with a treating composition comprising metal oxide nano-particles. Furthermore, the prese...
10/27/2011
20110262676STRUCTURE OF COMBINED METAL CASING AND PLASTIC MEMBER
A structure of combined metal casing and plastic member comprises a metal casing, a plastic member and an adhesive tape bonded between the metal casing and the plastic member. The adhesive tape is prepared by applying an adhesive bonding agent to a narrow elongated abso...
10/27/2011
20110262769SURFACE HARDENED SUBSTRATE AND METHOD MAKING SAME
A surface hardened substrate includes a base, a transition layer disposed on a surface of the base, and a hard layer disposed on the transition layer. The transition layer includes at least two kinds of transition metals. The hard layer includes a composite that compris...
10/27/2011
20110256392PROTECTIVE SHEET FOR BACK SURFACE OF SOLAR CELL MODULE
A protective sheet for the back surface of a solar cell module that is lightweight and has excellent water vapor barrier properties. The protective sheet for the back surface of a solar cell module is prepared by laminating a base sheet having excellent electrical insul...
10/20/2011
20110256412Aluminum nitride film and a substance coated with same
There are provided an aluminum nitride film and a substance, coated with such a film; the film is new in that it has a brightness or lightness L* of 60 or lower; preferably the film has a transmittance of 15% or lower for a visible and near infrared radiation having a w...
10/20/2011
20110256389Compressor Anti-Corrosion Protection Coating
A corrosion and abrasion resistant multilayer coating protects a compressor operating in a marine environment. The coating includes a thermal sprayed cermet layer and an organic based sealant layer....
10/20/2011
20110256413Process for coating a surface of a substrate made of nonmetallic material with a metal layer
A process for coating a surface of a substrate made of nonmetallic material with a metal layer consisting of providing a substrate made of nonmetallic material; subjecting a surface of said substrate to a treatment for increasing the specific surface area thereof; subje...
10/20/2011
20110256363SURFACE METAL FILM MATERIAL, METHOD OF PRODUCING SURFACE METAL FILM MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL
A surface metal film material including, in this order, a substrate, a polymer layer that receives a plating catalyst or a precursor thereof, and a metal film formed by plating, wherein, when x μm represents surface roughness (Ra) at the interface between the substrate...
10/20/2011
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