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| Application No. | Application Title | Issue Date |
| 20120045570 | Plating solution for forming tin alloy and method of forming tin alloy film using the same There are provided a plating solution for forming a tin alloy, and a method of forming a tin alloy film by using the same. The plating solution for forming a tin alloy, the plating solution includes a tin salt and one or more metal salts each comprising indium or zinc, ... | 02/23/2012 |
| 20120009350 | Electroless autocatalytic tin plating solution and electroless autocatalytic tin plating method using the same Disclosed are an electroless autocatalytic tin plating solution and an electroless autocatalytic tin plating method using the same. The electroless autocatalytic tin plating solution includes: tin salt formed as a tin ion and a ligand having two or more carboxyl groups ... | 01/12/2012 |
| 20110311729 | METHOD FOR MAKING SURFACE-ENHANCED RAMAN SCATTERING SUBSTRATE A method for making a surface-enhanced Raman scattering (SERS) substrate is introduced. The method includes the following steps. A carbon nanotube film structure and a first solution comprising a number of metallic ions are provided. The carbon nanotube film structure i... | 12/22/2011 |
| 20110287272 | POLYMER COMPOSITIONS FOR METAL COATING, ARTICLES MADE THEREFROM AND PROCESS FOR SAME Metal-coated thermoplastic compositions comprising “flat” fibrous reinforcing filler have improved resistance to repeated thermal shock. Disclosed herein are metal coated compositions useful in automotive parts, toys, appliances, power tools, industrial machinery, a... | 11/24/2011 |
| 20110135824 | Electroless Deposition System An electroless deposition method includes providing a deposition solution, and saturating the deposition solution with an oxygen concentration in a range from about two thousand parts per million to about twenty thousand parts per million, and replenishing deionized wat... | 06/09/2011 |
| 20110123813 | COMPOSITE MATERIAL, METHOD FOR PRODUCING THE SAME, AND APPARATUS FOR PRODUCING THE SAME Disclosed is a composite material wherein adhesion between a silicon surface and a plating material is enhanced. A method and an apparatus for producing the composite material are also disclosed. The method for producing a composite material comprises a dispersion/alloc... | 05/26/2011 |
| 20110111182 | METHOD OF FORMING A MICROSTRUCTURE The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substanti... | 05/12/2011 |
| 20110104380 | METHOD FOR PRODUCING MOLDED ARTICLE The present invention provides a method for producing a molded article which enables dissolution of a desired amount of a subject material in a molten resin without any limitation by the solubility of a high-pressure carbon dioxide in the molten resin and which is there... | 05/05/2011 |
| 20110086165 | METALLIZATION OF A POROUS SILICON ZONE BY IN SITU REDUCTION AND APPLICATION TO A FUEL CELL A porous silicon zone is metallized by performing in situ reduction of metallic ions dissolved in an aqueous solution and fixing of the metallic particles obtained on said zone in a single step. This step consists in particular in bringing the solution containing the me... | 04/14/2011 |
| 20110042050 | Composition Having a Corrosion Protection Layer and Process for the Production Thereof A composite material can include a carrier material that is coated, at least over part of the surface, with a corrosion protection layer made of an aluminum alloy. The composite material can provide a defined, effective, durable corrosion protection and simultaneously h... | 02/24/2011 |
| 20100310781 | MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE In a semiconductor device, a lead frame made of a copper alloy prevents exfoliation occurring near the surface of the lead frame. A copper oxide layer is formed on the base material made of a copper alloy by immersing the base material into a solution of a strong oxidiz... | 12/09/2010 |
| 20100291312 | ELECTROLESS PLATING METHOD FOR ALLOY COATING FILM AND PLATING LIQUID A substrate is immersed in a metal compound solution prepared by dissolving a plurality of metal compounds of metals differing from each other, to thereby form an alloy film having a desired alloy composition on the surface of the substrate.... | 11/18/2010 |
| 20100247774 | PARTIALLY AROMATIC POLYAMIDE COMPOSITIONS FOR METAL PLATED ARTICLES Partially aromatic polyamide compositions containing an aliphatic polyamide and an alkaline earth metal carbonate have excellent adhesion to metal coatings which are produced by electroless and/or electrolytic plating. Also described is a process for the electroless and... | 09/30/2010 |
| 20100208412 | FERROELECTRIC MATERIAL, METHOD OF PRODUCING FERROELECTRIC MATERIAL, AND FERROELECTRIC DEVICE Provided are a ferroelectric material having good ferroelectricity and good insulation property, and a ferroelectric device using the ferroelectric material. In the present invention, the ferroelectric material includes a metal oxide having a perovskite-type crystal str... | 08/19/2010 |
| 20100068615 | RESIN COMPOSITION FOR METAL PLATING, MOLDED ARTICLE THEREOF, AND METAL-PLATED MOLDED ARTICLE A resin composition for metal plating provides a molded article exhibiting excellent metal plating adhesion strength and chemical resistance, while having excellent productivity. A metal-plated molded article can also be made from such a resin composition. The resin com... | 03/18/2010 |
| 20100020153 | IMAGE DRUM AND METHOD OF MANUFACTURING THE SAME Provided are an image drum and a method of manufacturing the image drum. The image drum includes multiple ring electrodes arranged along a longitudinal direction of a drum body and on an outer circumferential surface of the drum body. The ring electrodes are separated f... | 01/28/2010 |
| 20100009206 | TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, METAL-PLATED TERMINALLY MODIFIED POLYBRANCHED POLYIMIDE, AND METHOD FOR PRODUCING THE SAME A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be c... | 01/14/2010 |
| 20100003399 | ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING THE SAME AND METHOD FOR MANUFACTURING CIRCUIT BOARD Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of μm, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prol... | 01/07/2010 |
| 20090294088 | Forming foam structures with carbon foam substrates The invention provides foams of desired cell sizes formed from metal or ceramic materials that coat the surfaces of carbon foams which are subsequently removed. For example, metal is located over a sol-gel foam monolith. The metal is melted to produce a metal/sol-gel co... | 12/03/2009 |
| 20090274597 | Method and device for catchment of platinum group metals in a gas stream This invention relates to a method and device for catchment of platinum group metals (PGM) in a gaseous stream, where the method comprises using a catalyst comprising a porous ceramic body in which at least a part of the surface area is covered by one or more PGM-catchi... | 11/05/2009 |
| 20090257056 | SURFACE ENHANCED RAMAN DETECTION ON METALIZED NANOSTRUCTURED POLYMER FILMS Disclosed herein is a structure having a spatially organized polymer nanostructured thin film and a metal coating on the film. The thin film is made by directing a monomer vapor or pyrolyzed monomer vapor towards a substrate at an angle other than perpendicular to the s... | 10/15/2009 |
| 20090224422 | Methods of fabricating a composite carbon nanotube thermal interface device Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit d... | 09/10/2009 |
| 20090176028 | MICROWAVE-ATTENUATING COMPOSITE MATERIALS, METHODS FOR PREPARING THE SAME, INTERMEDIATES FOR PREPARING THE SAME, DEVICES CONTAINING THE SAME, METHODS OF PREPARING SUCH A DEVICE, AND METHODS OF ATTENTUATING MICROWAVES The present invention provides microwave attenuating, filled composite materials which contain a polymer or ceramic matrix and metallic tubules and processes for making the same and devices which contain such materials.... | 07/09/2009 |
| 20090130339 | Method for Preparing Electroconductive Particles with Improved Dispersion and Adherence The present invention relates to a method of producing electroconductive electroless plating powder having excellent dispersibility and adherence, and, more particularly, to a method of producing electroconductive electroless plating powder having excellent dispersibili... | 05/21/2009 |
| 20090075095 | METHODS FOR PROCESSING A SUBSTRATE HAVING A BACKSIDE LAYER Methods for processing a substrate utilizing a backside layer are presented including: receiving a substrate, the substrate including a front side and a backside; forming the backside layer on the backside of the substrate; and performing at least one processing operati... | 03/19/2009 |
| 20090042021 | Metal-Coated Lipid Bilayer Vesicles and Process for Producing Same A metal-coated material comprising a metal-coated lipid bilayer vesicle and a preparation method thereof are provided. A metal-coated material comprising a metal-coated lipid bilayer vesicle having a network of siloxane bonding (Si—O—Si) on its surface. a method for... | 02/12/2009 |
| 20090025966 | Fiber-resin composite, laminate, printed wiring board, and method for manufacturing printed wiring board The present invention provides: a copper-clad laminate, facilitating the formation of highly reliable fine wires, in which copper foil has been formed firmly on a flat and smooth surface; a laminate; an electroless plating material; a fiber-resin composite; and a printe... | 01/29/2009 |
| 20090011136 | COMPOSITE ELECTROLESS PLATING This invention is directed to a process for electrolessly metallizing an article, as well as to a plating bath and the subsequent plated substrate. The process comprises contacting the surface of an article with an electroless metallizing bath which may be essentially f... | 01/08/2009 |
| 20080311400 | NANOTUBE GROWTH AND DEVICE FORMATION An apparatus and method for forming catalyst particles to grow nanotubes is disclosed. In addition, an apparatus and method for forming nanotubes using the catalytic particles is also disclosed. The particles formed may have different diameters depending upon how they a... | 12/18/2008 |
| 20080277140 | ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold platin... | 11/13/2008 |
| 20080274338 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME A method for manufacturing a wiring substrate includes the steps of: (a) forming a sacrificial layer in a first pattern on a substrate; (b) forming a catalyst layer in a second pattern on the substrate; (c) immersing the substrate in an electroless plating liquid, there... | 11/06/2008 |
| 20080233303 | Coatings for metal-metal seal surfaces A method of producing a metal seal ring is provided. The method includes selecting a seal ring substrate material and applying a coating to the seal ring substrate material using an electroless plating process.... | 09/25/2008 |
| 20080214884 | Electroless plating in microchannels Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.... | 09/04/2008 |
| 20080206474 | Stabilization and Performance of Autocatalytic Electroless Processes Disclosed is a method of plating a substrate with a metal using an autocatalytic electroless plating bath wherein the bath is operated above its cloud point temperature such that at least two phases are present in the bath. An autocatalytic electroless plating bath for ... | 08/28/2008 |
| 20080194401 | Nickel and cobalt plated sponge catalysts Novel nickel and/or cobalt plated sponge based catalysts are disclosed. The catalyst have an activity and/or selectivity comparable to conventional nickel and/or cobalt sponge catalysts, e.g., Raney® nickel or Raney® cobalt catalysts, but require a reduced content of ... | 08/14/2008 |
| 20080187675 | Liposomal compositions and methods for use Disclosed herein arc novel liposome compositions generally including a foreign inclusion (e.g., diamond) component, and a liposome (e.g., i paucilamellar liposome) component. Also disclosed are methods of using these composition for plating and plate obtained thereby. N... | 08/07/2008 |
| 20080152823 | Self-limiting plating method A self-limiting electroless plating process is provided to plate thin films with improved uniformity. The process comprises dispensing an electroless plating solution onto a substrate to form a quiescent solution layer from which a conformal plated layer plates onto a s... | 06/26/2008 |
| 20080075958 | Copper(I) complexes and processes for deposition of copper films by atomic layer deposition The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process.... | 03/27/2008 |
| 20080038476 | Process for improving the adhesion of polymeric materials to metal surfaces A process is disclosed for the purpose of increasing the adhesion of a polymeric material to a metal surface. The process comprises plating the metal surface with a layer of electroless nickel, electroless cobalt or electroless (or immersion) tin followed by phosphating... | 02/14/2008 |
| 20080014362 | Pretreating Agent For Electroless Plating, Method Of Electroless Plating Using The Same And Product Of Electroless Plating The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated i... | 01/17/2008 |
