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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Application No. | Application Title | Issue Date |
| 20120109287 | METHOD OF ELECTROPLATING A CONVERSION ELECTRON EMITTING SOURCE ON IMPLANT Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; ... | 05/03/2012 |
| 20120107228 | HYDROGEN GAS GENERATING MEMBER AND HYDROGEN GAS PRODUCING METHOD THEREFOR There is provided a hydrogen gas generating member which safely facilitates the hydrogen gas generation reaction by bringing an Al alloy which is subjected to rolling treatment or powdering treatment into contact with water. A hydrogen gas ... | 05/03/2012 |
| 20120038042 | LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a ... | 02/16/2012 |
| 20110218109 | CLATHRATE COMPOUNDS A clathrate compound of formula (I): M8AxBy-x (I) wherein: M is an alkaline earth metal, a rare earth metal, an alkali metal, Cd, or a combination thereof, A is Ga, Al, In, Zn or a combination thereof; B is Ge, Si, Sn, Ni or a combinatio... | 09/08/2011 |
| 20110182041 | LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.... | 07/28/2011 |
| 20110115084 | LEAD-FREE SOLDER CONNECTION STRUCTURE AND SOLDER BALL Solder used for flip chip bonding inside a semiconductor package was a Sn—Pb solder such as a Pb-5Sn composition. Lead-free solders which have been studied are hard and easily form intermetallic compounds with Sn, so they were not suitable for a flip chip connection s... | 05/19/2011 |
| 20110110813 | Tin-indium based lead-free solders with zinc addition A new kind of Sn—In based Pb-free solders with Zn addition is disclosed, which includes: 15˜25 wt % In; 0.05˜1.5 wt % Zn; and balance Sn. When the solder of the present invention is used in the assembly of electrical products, the dissolution rates of the substrates... | 05/12/2011 |
| 20110091351 | BONDING COMPOSITION A bonding composition (12) contains 0.01-1 wt % of Ge and 0.01 to 1 wt % of Si, and a balance of a Sn alloy. The bonding composition (12) has excellent bonding strength.... | 04/21/2011 |
| 20110064604 | PARTICULATE TIN POWER AND MANUFACTURING METHOD THEREOF The present invention relates to particulate tin powder and a manufacturing method thereof. More particularly, the present invention relates to a method of manufacturing particulate tin powder including i) preparing tin salt solution, ii) adding chelating agents to the ... | 03/17/2011 |
| 20100290946 | METHODS OF MAKING AN ARTICLE OF SEMICONDUCTING MATERIAL ON A MOLD COMPRISING SEMICONDUCTING MATERIAL The invention relates to methods of making articles of semiconducting material on a mold comprising semiconducting material and semiconducting material articles formed thereby, such as articles of semiconducting material that may be useful in making photovoltaic cells.... | 11/18/2010 |
| 20100255998 | Sn based alloys with fine compound inclusions for Nb3Sn superconducting wires A method for producing a Sn based alloy (15) comprising a metal matrix of a metal matrix material, wherein the metal matrix material comprises Sn, and inclusions of a compound material, further referred to as compound inclusions, wherein the compound material con... | 10/07/2010 |
| 20100202952 | NANOWIRE SYNTHESIS FROM VAPOR AND SOLID SOURCES Methods of the present invention can be used to synthesize nanowires with controllable compositions and/or with multiple elements. The methods can include coating solid powder granules, which comprise a first element, with a catalyst. The catalyst and the first element ... | 08/12/2010 |
| 20100092335 | PB-FREE SOLDER ALLOY The present invention is provided to prevent the generation of whiskers via a lead (Pb)-free solder alloy. To achieve this objective, the present invention provides a Pb-free solder alloy including tin (Sn) as a first element and either boron (B) or beryllium (Be) as a ... | 04/15/2010 |
| 20100031848 | ALLOY NANOPARTICLES OF SN-CU-AG, PREPARATION METHOD THEREOF AND INK OR PASTE USING THE ALLOY NANOPARTICLES The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calci... | 02/11/2010 |
| 20090289102 | SOLDER FREE FROM LEAD FOR ADDITIONAL SUPPLY AND METHOD OF REGULATING Cu CONCENTRATION AND Ni CONCENTRATION IN SOLDER BATH Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass pe... | 11/26/2009 |
| 20090208363 | SOLDER ALLOY FOR OXIDE BONDING A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is compo... | 08/20/2009 |
| 20090197103 | MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS A solder joint comprising a solder capture pad on a substrate having a circuit; and a lead free solder selected from the group comprising Sn—Ag—Cu solder and Sn—Ag solder adhered to the solder capture pad; the solder selected from the group comprising between 0.1 ... | 08/06/2009 |
| 20090196789 | SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile... | 08/06/2009 |
| 20090098012 | High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin Provided is high purity tin or tin alloy wherein the respective contents of U and Th are 5 ppb or less, the respective contents of Pb and Bi are 1 ppm or less, and the purity is 5N or higher (provided that this excludes the gas components of O, C, N, H, S and P). This h... | 04/16/2009 |
| 20090081412 | THIN FILM FORMING METHOD AND TRANSPARENT CONDUCTIVE FILM A method of forming a thin film comprising the steps of: applying an inorganic salt solution for a thin film on a substrate to obtain a coated inorganic salt solution film; and subjecting the coated inorganic salt solution film to a plasma treatment under atmospheric pr... | 03/26/2009 |
| 20090014746 | SOLDER ALLOYS Lead-free solder compositions for bonding and sealing flat panel displays, CCD's, solar cells, light emitting diodes, and other optoelectronic devices are disclosed. The solders are based on alloys of Sn, Au, Ag, and Cu and one or more rare earth metals chosen from the ... | 01/15/2009 |
| 20080241552 | SOLDER ALLOY AND GLASS BONDED BODY USING THE SAME The invention provides a solder alloy containing, by mass, 2.0 to 15.0% of Ag, 0.1 to 6.0% of Al, 0.01 to 0.50% of Y, the balance being Sn and unavoidable impurities. The solder alloy preferably contains 0.01 to 0.50% of Ge by mass. The solder alloy of the invention is ... | 10/02/2008 |
| 20080152996 | Intermetallic electrodes for lithium batteries This invention relates to intermetallic negative electrode compounds for non-aqueous, electrochemical lithium cells and batteries. More specifically, the invention relates to one or more electrode components or compositions, one of which contains the basic structural un... | 06/26/2008 |
| 20080142124 | Solder alloy, electronic board using the solder alloy, and method of manufacturing the electronic board A solder alloy for flow soldering is disclosed that includes 3.0 wt % to 14.0 wt % Zn, 0.003 wt % to 0.05 wt % Al, and the balance of Sn.... | 06/19/2008 |
| 20070295528 | Pb-free Sn-based material, wiring conductor, terminal connecting assembly, and Pb-free solder alloy A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of a surface the wiring conductor, and the Sn-based material part includes a base metal doped with a transformation retardant element and an oxidation control element. The transformati... | 12/27/2007 |
| 20070286762 | Gold-containing solder deposit, method for production thereof, soldering method and use The present invention relates to a solder deposit which can be produced by alloying at least one gold layer and tin layer on a wetting metal (first substrate). In addition, the present invention relates to a soldering method for soldering at least two substrates using s... | 12/13/2007 |
| 20070190415 | Negative active material for rechargeable lithium battery, method of preparing same, and rechargeable lithium battery including same A negative active material for a rechargeable lithium battery, a method for preparing the same, and a rechargeable lithium battery including the same. The negative active material includes a metal that is liquid at room temperature when alloyed with Sn, and Sn. The nega... | 08/16/2007 |
| 20070178007 | LEAD-FREE SOLDER, SOLDER JOINT PRODUCT AND ELECTRONIC COMPONENT This invention provides lead-free solders that have excellent oxidation resistance and can be plastically worked easily and well. The lead-free solders and molded products of the lead-free solders can provide solder joint products, particularly electronic components, wh... | 08/02/2007 |
| 20070140892 | Clean seas Clean Seas is a non-toxic, submersible, detachable fishing weight ball. It is used to submerge open water fishing tackle. It is a viable alternative to toxic lead exposure to human and marine species and ecosystems. Clean Seas features an engineered amalgam core, weight... | 06/21/2007 |
| 20070122646 | SOLDER COMPOSITION AND SOLDERING STRUCTURE A solder composition for reacting with aluminum is provided. The main alloying components in the solder includes tin (Sn), zinc (Zn) and chromium (Cr) with 0.01 wt % to 20 wt % zinc and 0.01 wt % to 20 wt % chromium. ... | 05/31/2007 |
| 20070092396 | Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with S... | 04/26/2007 |
| 20070048172 | Technique for increasing the compliance of tin-indium solders A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% b... | 03/01/2007 |
| 20070031730 | Electrode material for anode of rechargeable lithium battery, electrode structural body using said electrode material, rechargeable lithium battery using said electrode structural body, process for producing said electrode structural body, and process for producing said rechargeable lithium battery An electrode material for an anode of a rechargeable lithium battery, containing a particulate comprising an amorphous Sn.A.X alloy with a substantially non-stoichiometric ratio composition. For said formula Sn.A.X, A indicates at least one kind of an element selected f... | 02/08/2007 |
| 20060275663 | Negative electrode active material and nonaqueous electrolyte secondary battery A negative electrode active material includes an intermetallic compound. The intermetallic compound has a long period order along each of at least two crystal axes. The intermetallic compound is represented by formula (1) given below: LnM1... | 12/07/2006 |
| 20060263689 | ANODE ACTIVE MATERIAL AND BATTERY An anode active material with a high capacity capable of providing superior cycle characteristics and a battery using it are provided. An anode contains an anode active material capable of reacting with lithium. The anode active material contains at least tin, iron, and... | 11/23/2006 |
| 20060147337 | Solder composition The present invention relates to a lead-free solder composition having a low coefficient of thermal expansion to reduce the likelihood of thermal shock to a glass substrate. The solder composition includes a granular material added to lead-free solder where the granular... | 07/06/2006 |
| 20060115734 | Anode active material and battery using the same A battery with a high capacity and superior cycle characteristics and an anode active material used in the battery are provided. An anode includes an anode active material capable of reacting with lithium. The anode active material includes tin, cobalt and carbon as ele... | 06/01/2006 |
| 20060110659 | Electrode material, method of manufacturing the electrode material, electrode, and nonaqueous electrolyte battery An electrode material includes an alloy having a Gd3Ni8Sn16 type crystal structure. ... | 05/25/2006 |
| 20060104854 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid ... | 05/18/2006 |
| 20060067853 | Lead free solder A lead-free solder comprises tin and zinc at a weight ratio between tin and zinc ranging from about 88:12 to about 80:20 on the basis of total weight of the lead-free solder. ... | 03/30/2006 |
