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Class 420/481 - Nickel containing


Subclass of Class 420 - Alloys or metallic compositions
Definition: Alloy, or metallic composition which additionally contains nickel.
No. of applications: 17
Last issue date: 07/14/2011


Application No.Application TitleIssue Date
20110171059VARIABLE KARAT GOLD ALLOYS
A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gol...
07/14/2011
20110027122Cu-Ni-Si-Co-Cr System Alloy for Electronic Materials
The problem to be solved by the present invention is to provide a significant improvement in the properties in Cu—Ni—Co—Si alloy by adding Cr, i.e., to provide Corson alloys having high strength and high electrical conductivity. There is provided a copper alloy fo...
02/03/2011
20100135848Lead-free free-cutting silicon brass alloy
The present invention supplies a lead-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected f...
06/03/2010
20100080731Tin-Free Lead-Free Free-Cutting Magnesium Brass Alloy and Its Manufacturing Method
A tin-free lead-free free-cutting magnesium brass alloy comprises 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which comprise at least two elements selected from the group consisting of Al, Si, Sb, rare earth e...
04/01/2010
20100061884WHITE-COLORED COPPER ALLOY WITH REDUCED NICKEL CONTENT
Disclosed is a white-colored copper alloy comprising by weight up to 30% zinc, up to 20% manganese, up to 5% nickel with the balance copper. This alloy may have from 6% to 25% zinc, from 4% to 17% manganese, from 0.1% to 3.5% nickel and the balance copper. The balance c...
03/11/2010
20100047112COPPER ALLOY SHEET EXCELLENT IN STRENGTH AND FORMABILITY FOR ELECTRICAL AND ELECTRONIC COMPONENTS
Disclosed is a Cu—Ni—Si copper alloy sheet that excels in strength and formability and is used in electrical and electronic components. The copper alloy sheet contains, by mass, 1.5% to 4.5% Ni and 0.3% to 1.0% of Si and optionally contains at least one member selec...
02/25/2010
20090317292VARIABLE KARAT GOLD ALLOYS
A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gol...
12/24/2009
20090280026COPPER-ZINC-SILICON ALLOY, PRODUCTS USING THE ALLOY AND PROCESSES FOR PRODUCING THE ALLOY
A Cu—Zn—Si alloy includes, in % by weight, 70 to 80% of copper, 1 to 5% of silicon, to 0.5% of boron, up to 0.2% of phosphorus and/or up to 0.2% of arsenic, a remainder of zinc, plus inevitable impurities. Products using the alloy and processes for producing the all...
11/12/2009
20090263272Lead-free free-machining brass having improved castability
There is provided a brass free from lead (Pb) and possessing excellent machinability, castability, mechanical properties and other properties. A brass consisting of not less than 55% by weight and not more than 75% by weight of copper (Cu), not less than 0.3% by weight ...
10/22/2009
20090239094Cu-Zn Alloy Strip Superior in Thermal Peel Resistance of Sn Plating and Sn Plating Strip Thereof
A Cu—Zn alloy strip and Sn plating strip thereof having improved thermal peel resistance of Sn Plating is provided. In a Cu—Zn alloy strip comprising 15 to 40% by mass of Zn and a balance of Cu and unavoidable impurities, the total concentration of P, As, Sb and Bi ...
09/24/2009
20090224379COPPER ALLOY SHEET AND QFN PACKAGE
A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongatio...
09/10/2009
20090035174Copper Alloy for Electronic Materials
The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about ...
02/05/2009
20080314612Conductor of electric cable for wiring, electric cable for wiring, and methods of producing them
A conductor of an electric cable for wiring, containing a copper alloy material containing 1.0 to 4.5 mass % of Ni, 0.2 to 1.1 mass % of Si, and the balance of Cu and unavoidable impurities, in which the copper alloy material has an average grain diameter of 0.2 to 5.0 ...
12/25/2008
20080298998COPPER ALLOY FOR ELECTRIC AND ELECTRONIC EQUIPMENTS
A copper alloy for electric and electronic equipments, containing from 0.5 to 4.0 mass % of Ni, from 0.5 to 2.0 mass % of Co, and from 0.3 to 1.5 mass % of Si, with the balance of copper and inevitable impurities,
  • 12/04/2008
20080075625Conductive Material Comprising an Me-Dlc Hard Material Coating
The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least ...
03/27/2008
20070131321Copper alloy for electric and electronic instruments
A copper alloy for electric and electronic instruments, containing Ni of 1 to 3 mass %, Ti of 0.2 to 1.2 mass %, any one or both of Mg and Zr of 0.02 to 0.2 mass %, and Zn of 0.1 to 1 mass %, with the balance being Cu and unavoidable impurities, in which the copper allo...
06/14/2007
20050208323Copper alloy material for parts of electronic and electric machinery and tools
A copper alloy material for parts of electronic and electric machinery and tools contains 1.0 to 3.0 mass % of Ni, 0.2 to 0.7 mass % of Si, 0.01 to 0.2 mass % of Mg, 0.05 to 1.5 mass % of Sn, 0.2 to 1.5 mass % of Zn, and less than 0.005 mass % (including 0 mass %) of S,...
09/22/2005
 
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