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| Application No. | Application Title | Issue Date |
| 20100028109 | EDGE GRIP END EFFECTOR A robot is provided which comprises a wafer blade (105) having a pocket (109) therein for receiving a semiconductor wafer, and a retractable protrusion (107) which is movable from a first position in which said protrusion prevents the removal of sai... | 02/04/2010 |
| 20080240948 | DEVICE FOR CONTAINING CATASTROPHIC FAILURE OF A TURBOMOLECULAR PUMP A device for containing the catastrophic failure of a vacuum pumping system is described. The vacuum pumping system includes a turbo-molecular pump (TMP) configured to be coupled to a vacuum processing system at an inlet end. The TMP includes a longitudinal axis substan... | 10/02/2008 |
| 20070034479 | Multi-station workpiece processors, methods of processing semiconductor workpieces within multi-station workpiece processors, and methods of moving semiconductor workpieces within multi-station workpiece processors The invention includes multi-station workpiece processors, methods of processing semiconductor workpieces within multi-station workpiece processors, and methods of moving semiconductor workpieces within multi-station workpiece processors. In one implementation, a multi-... | 02/15/2007 |
| 20050100435 | Atmospheric robot handling equipment A semiconductor-manufacturing tool has two load locks, one for semiconductor wafers entering the tool for processing and the other for wafers leaving the tool after being processed. The load locks are of a new generation capable of being evacuated or vented in shorter t... | 05/12/2005 |
| 20050088003 | Bonded structures for use in semiconductor processing environments A structure for use in a semiconductor processing environment is provided, including a first plate a second plate bonded to the first plate. A distal end of the second plate extends beyond a distal end of the first plate. The distal end of the first plate is tapered alo... | 04/28/2005 |
| 20050006916 | Endeffectors for handling semiconductor wafers Various endeffector designs are disclosed for handling semiconductor wafers. For instance, an endeffector for handling wafers at a relatively low temperature is disclosed along with an endeffector for handling wafers at a relatively high temperature. Both endeffectors i... | 01/13/2005 |
