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| Application No. | Application Title | Issue Date |
| 20100195303 | ELECTRONIC APPARATUS An electronic apparatus includes an outer cover member, an internal structure member, first and second external connection connectors, and first and second printed circuit boards. The first printed circuit board has a first surface on which the first external connector ... | 08/05/2010 |
| 20100149777 | ELECTRONIC CIRCUIT CONNECTION STRUCTURE AND ITS MANUFACTURING METHOD First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and m... | 06/17/2010 |
| 20090207577 | Modular Stackable Angled Patch Panel for Enclosure A modular patch panel module is mountable on an electronics enclosure and includes an angled patch face and mounting structure that enables stacking of modular patch panels without interference of patch panel cords with the top of the enclosure or another patch panel st... | 08/20/2009 |
| 20090175016 | CLIP FOR ATTACHING PANELS Clip for attaching two outer panels to an intermediate panel, the clip comprising two arm portions each arm portion being configured to apply pressure to one of the outer panels in order to force the panel against a surface of the intermediate panel, and a bridge portio... | 07/09/2009 |
| 20090168383 | ELECTRONIC APPARATUS AND SYSTEM An electronic apparatus has a first circuit board and a second circuit board. The first circuit board has a first connector mounted thereto. The second circuit board has a second connector which is mounted to a first surface and is mechanically coupled to the first conn... | 07/02/2009 |
| 20090151156 | METHOD OF MANUFACTURING A CIRCUIT BOARD ASSEMBLY FOR A CONTROLLER A method of manufacturing a circuit board assembly for a controller. The method includes providing first and second printed circuit boards wherein the first printed circuit board has a plurality of copper pads containing slots therein that correspond to a plurality of p... | 06/18/2009 |
| 20090067147 | CIRCUIT BOARD CONNECTION STRUCTURE AND CIRCUIT BOARD CONNECTION METHOD A circuit board connection structure and a circuit board connection method, which can extend an area for mounting electronic components and can simplify the manufacturing process, are provided. A circuit board connection structure 30... | 03/12/2009 |
| 20080174977 | ELECTRONIC COMPONENT CONTAINED SUBSTRATE An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic... | 07/24/2008 |
| 20080123312 | MULTIPLE-BOARD POWER CONVERTER The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orient... | 05/29/2008 |
| 20070297158 | Front-to-back stacked device A front-to-back stack device is applied to two or more modularized circuit boards, such as two servo module circuit boards in a blade server. Through the use of the stack device, the two servo module circuit boards can be therefore stacked to each other in a front-to-ba... | 12/27/2007 |
| 20070291458 | STACKED SEMICONDUCTOR PACKAGE HAVING FLEXIBLE CIRCUIT BOARD THEREIN The present invention relates to a stacked semiconductor package having flexible circuit board therein. The semiconductor package comprises a substrate and a chip assembly. The chip assembly comprises at least a first chip, a second chip and a flexible circuit board. Th... | 12/20/2007 |
| 20070153491 | ELECTRONIC CIRCUIT PACKAGE An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The e... | 07/05/2007 |
| 20070125576 | Angular encapsulation of tandem stacked printed circuit boards A method is provided for making an encapsulated stack of circuit boards. The method includes assembling the stack of circuit boards from a plurality of circuit boards, the circuit boards being spaced apart from each other; inserting the stack into an internal volume of ... | 06/07/2007 |
| 20070064402 | High density power connector with impedance control A power connector assembly is provided that has high power density capability and controllable impedance. One embodiment has a multi-layer stack of printed circuit boards that each contain one or more metal layers that function selectively as power and return planes. Th... | 03/22/2007 |
| 20060274514 | Flight state detection apparatus of micro object and flight state detection method of micro object Disclosed herein is a flight state detection apparatus and a flight state detection method that is capable of accurately detecting the flight state of a micro object ejected from a micro object ejection part. The flight state detection apparatus is constructed in a simp... | 12/07/2006 |
| 20060268531 | CIRCUIT BOARDS AND ASSEMBLY METHODS A method of forming a circuit board having first and second conductive layers with a dielectric layer, or of forming a capacitor having a dielectric layer in a circuit board with first and second conducting layers, may include forming a first interstice in the first con... | 11/30/2006 |
| 20060226556 | Semiconductor device and method of manufacturing the same The semiconductor device 1 includes interconnect layers 10, 20, an IC chip 30, via plugs 42, 44, a seal resin 50, and solder balls 60. The interconnect layer 10 includes a via plug 42. An end face of the via plug <... | 10/12/2006 |
| 20060152912 | Electronic unit with EMC shielding To improve EMC shielding for an electronic unit containing at least one electronic power device operated at high frequency and a metal housing thermally coupled to the device to provide heat dissipation, the power device with a device terminal is thermally and electrica... | 07/13/2006 |
| 20060044773 | Methods and apparatuses for transferring heat from stacked microfeature devices Methods and apparatuses for transferring heat from stacked microfeature devices are disclosed herein. In one embodiment, a microfeature device assembly comprises a support member having terminals and a first microelectronic die having first external contacts carried by ... | 03/02/2006 |
| 20050141207 | Interface enhancement for modular platform applications An interface enhancing apparatus is provided for increasing the potential number of interfaces on the interface panel of a modular platform board. The interface enhancing apparatus may include a first component coupled an interface panel of a modular platform board and ... | 06/30/2005 |
| 20050078464 | Portable electronic device with multiple input interfaces An electronic device has a main body, a flip attached to the main body and multiple input interfaces. A first input interface is disposed on the main body of the electronic device. Second and third input interfaces are disposed on apposing sides of the flip. The flip co... | 04/14/2005 |
