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| Application No. | Application Title | Issue Date |
| 20110221268 | Power Converter and In-Car Electrical System Downsizing, cost reduction, and a low inductance of an input/output circuit are to be achieved with a power converter in which a multilayer board having a power semiconductor module 500 and busbars 11, 12 is modularized. The positive busbar 11 and t... | 09/15/2011 |
| 20100290204 | MOTOR CONTROLLER ASSEMBLY WITH CAPACITOR THERMAL ISOLATION An electrical assembly for a motor controller is disclosed that includes an electrical lead. The electrical lead has a conductive trace within an insulating material and that extends a length between first and second ends. An electrical pad is in electrical continuity w... | 11/18/2010 |
| 20100195301 | Layered Structure Connection and Assembly The present invention relates to a layered structure assembly (1) for a DC to AC inverter comprising: a first layered structure (10) with first (12) and second (13) conductive layers, a second layered structure (14) with third (16 | 08/05/2010 |
| 20090257210 | ELECTRONIC CIRCUIT STRUCTURE, POWER SUPPLY APPARATUS, POWER SUPPLY SYSTEM, AND ELECTRONIC APPARATUS This invention prevents a deterioration of efficiency of a power supply apparatus due to a semiconductor power supply voltage drop, prevents an increase in wasted power, and prevents erroneous operations due to feeder wire voltage drop. In the mounting structure of elec... | 10/15/2009 |
| 20080080154 | Printed board and method for producing the printed board A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, t... | 04/03/2008 |
| 20060126316 | Control circuit board and circuit structural body A control circuit board has an end portion formed with a cut that is opened sideways. The cut is coated with a conductor layer. Upon connecting the control circuit board to a conductor such as a bus bar, solder is supplied so as to bridge the conductor layer and the bus... | 06/15/2006 |
| 20060082983 | Leadframe-based module DC bus design to reduce module inductance A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative lead... | 04/20/2006 |
| 20060028806 | Leadframe-based module DC bus design to reduce module inductance A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative lead... | 02/09/2006 |
