Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Application No. | Application Title | Issue Date |
| 20120069537 | INTEGRATED CIRCUIT WITH INTRA-CHIP CLOCK INTERFACE AND METHODS FOR USE THEREWITH An integrated circuit includes a substrate. A first integrated circuit die includes a first circuit and a first intra-chip clock interface that transmits a first clock signal via the substrate. A second integrated circuit die includes a second circuit that operates base... | 03/22/2012 |
| 20120008294 | PRINTED CIRCUIT BOARDS WITH EMBEDDED COMPONENTS Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mount... | 01/12/2012 |
| 20110317384 | PRINTED BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT An IC which includes a first circuit and a plurality of first paired terminals each including a first power supply terminal and a first GND terminal which are connected to the first circuit, and a second circuit and a plurality of second paired terminals each including ... | 12/29/2011 |
| 20110317383 | MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one sti... | 12/29/2011 |
| 20110279989 | PREPARATION OF MOULDED BODY WITH ELECTRIC CIRCUIT The invention is directed to a method for preparing a moulded body comprising an integrated electric circuit, to a body comprising an integrated electric circuit, and to a device comprising the body. The method of the invention comprises—placing one or more electrical... | 11/17/2011 |
| 20110211319 | Electric discharge protection for surface mounted and embedded components Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electr... | 09/01/2011 |
| 20110149539 | BASE PLATE FOR USE IN A MULTI-CHIP MODULE A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and ... | 06/23/2011 |
| 20110085310 | SPACE SAVING CIRCUIT BOARD The present invention is a circuit board with precision clearance holes that accommodate components that are attached to the circuit board. The components are mounted in an inverted position so that the component contacts are still connected to the top side of the circu... | 04/14/2011 |
| 20110051384 | PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT A printed circuit board element (1) comprising at least one component (2) embedded between a base (4) and a cover layer (6), which component (2) is adhered to the base (4) by means of an adhesive film section (3).... | 03/03/2011 |
| 20100328915 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure havin... | 12/30/2010 |
| 20100290191 | SYSTEM-IN PACKAGES System-in packages, or multichip modules, are described which can include multi-layer chips in a multi-layer polymer structure, on-chip metal bumps on the multi-layer chips, intra-chip metal bumps in the multi-layer polymer structure, and patterned metal layers in the m... | 11/18/2010 |
| 20100226108 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternat... | 09/09/2010 |
| 20100177490 | COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF MANUFACTURING Computer modules with small thicknesses and associated methods of manufacturing are disclosed. In one embodiment, the computer modules can include a module substrate having a module material and an aperture extending at least partially into the module material. The comp... | 07/15/2010 |
| 20100134993 | ELECTRONIC COMPONENT, CIRCUIT BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electron... | 06/03/2010 |
| 20100128450 | SOLVENT SOFTENING TO ALLOW DIE PLACEMENT Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, by selectively and seating IC elements onto/into a receiving substrate, such as a chip substrate. Specifically, the assembly of IC chips can inclu... | 05/27/2010 |
| 20100118501 | Integrated inductor An inductor and multiple inductors embedded in a substrate (e.g., IC package substrate, board substrate, and/or other substrate) is provided herein.... | 05/13/2010 |
| 20100103635 | SINGLE-LAYER COMPONENT PACKAGE A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconduct... | 04/29/2010 |
| 20100061070 | FOLDING USB DRIVE Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and... | 03/11/2010 |
| 20100053920 | PACKAGING SUBSTRATE WITH EMBEDDED SEMICONDUCTOR COMPONENT AND METHOD FOR FABRICATING THE SAME A packaging substrate with an embedded semiconductor component and a method of fabricating the same are provided, including: fixing a semiconductor chip with electrode pads to an assisting layer with apertures through an adhesive member, wherein each of the electrode pa... | 03/04/2010 |
| 20100002405 | PACKAGE SUBSTRATE STRUCTURE A package substrate structure includes: a substrate having a first surface and an opposing second surface and characterized by a plurality of wire-bonding pads provided on the first surface of the substrate, a plurality of ball-implanting pads provided on the second sur... | 01/07/2010 |
| 20100002406 | CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN A circuit board having a semiconductor chip embedded therein includes: a core board having opposing first and second surfaces and a through-hole; a semiconductor chip received in the through-hole and having a first active surface and an opposing second active surface, w... | 01/07/2010 |
| 20100002398 | Multimode signaling on decoupled input/output and power channels A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package cou... | 01/07/2010 |
| 20090321921 | EMBEDDED WIRING BOARD, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND METHOD OF FABRICATING THE SAME Provided are an embedded wiring board and a method of manufacturing the same. The embedded wiring board includes: a printed circuit board (PCB) including a first surface and a second surface, the first surface having a concave portion; through electrodes penetrating the... | 12/31/2009 |
| 20090316373 | PCB having chips embedded therein and method of manfacturing the same Provided is a PCB having chips embedded therein, the PCB including a first core substrate that has a first chip embedded therein, the first chip having a plurality of first pads provided on the top surface thereof, and first circuit patterns provided on both surfaces th... | 12/24/2009 |
| 20090268418 | PRINTED CIRCUIT BOARD HAVING EMBEDDED RF MODULE POWER STAGE CIRCUIT Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead... | 10/29/2009 |
| 20090244865 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD A method for manufacturing a multilayer printed wiring board having an electronic component housed therein includes forming a first conductor circuit on a first surface of a substrate. A first alignment mark is formed on the first surface of the substrate separate from ... | 10/01/2009 |
| 20090231820 | CAPACITOR-INCORPORATED PRINTED WIRING BOARD AND ELECTRONIC COMPONENT A printed wiring board includes an insulating layer and a capacitor including a ceramic high dielectric layer, a first electrode and a second electrode, the high dielectric layer being interposed between the first and second electrodes. A plurality of resin insulating l... | 09/17/2009 |
| 20090154124 | MICROWAVE CHIP SUPPORTING STRUCTURE The present invention relates to a microwave chip supporting structure comprising a first microwave laminate layer, with a first side and a second side, and an outer limit. At least one conductor is formed on said first side extending towards said outer limit. The micro... | 06/18/2009 |
| 20090091904 | Circuit Module and Radio Communications Equipment, and Method for Manufacturing Circuit Module An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13, and a semiconductor component 4 are mounted on a wiring board 2, and are covered with an insulating resin po... | 04/09/2009 |
| 20090067143 | ELECTRONIC DEVICE HAVING STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME An electronic device includes a lower electronic part including a lower substrate, a lower chip structure disposed on the lower substrate, and a lower molding layer covering the lower chip structure and having a recessed region in an upper surface of the lower molding l... | 03/12/2009 |
| 20090053852 | MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mou... | 02/26/2009 |
| 20090027863 | Method for making a semiconductor multipackage module including a processor and memory package assemblies A semiconductor multi-package module includes a processor and a plurality of memory packages mounted on a surface of the multi-package module substrate. In some embodiments the memory packages include stacked die packages, and in some embodiments the memory packages inc... | 01/29/2009 |
| 20080273314 | PCB having embedded IC and method for manufacturing the same A multi-layer PCB includes a plurality of insulating layers and a plurality of conductive pattern layers alternatively and repeatedly stacked; contact-hole formed in the insulating layers so as to allow electrical connection through the contact-holes; a first integrated... | 11/06/2008 |
| 20080246140 | SEMICONDUCTOR DEVICE A frame-shaped sidewall is provided on a metallic base plate surrounding a semiconductor element arranged on the metallic base plate, a first dielectric plate is arranged on one side of the semiconductor element and a first circuit pattern is formed on its surface, a se... | 10/09/2008 |
| 20080184550 | METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA CONDUCTORS A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circu... | 08/07/2008 |
| 20080151520 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the mul... | 06/26/2008 |
| 20080151519 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD A multilayer printed circuit board has an IC chip 20 included in a core substrate 30 in advance and a mediate layer 38 provided on a pad 24 of the IC chip 20. Due to this, it is possible to electronically connect the IC chip to the mul... | 06/26/2008 |
| 20080144299 | Systems for and methods of circuit construction A printed circuit board having only one circuit element, said circuit element having one or more leads and each lead being in electrical communication to one end of a trace on the printed circuit board, wherein said trace has a second end terminating at a pad, wherein s... | 06/19/2008 |
| 20080130253 | Sensor node and circuit board arrangement An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receiving a... | 06/05/2008 |
| 20080123309 | SLIM DESIGN MAIN BOARD A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit ... | 05/29/2008 |
