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"Transmission of documents via telephone wires is possible in principle, but the apparatus required is so expensive that it will never become a practical proposition."
Dennis Gabor, British physicist
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| Application No. | Application Title | Issue Date |
| 20110317382 | Insulating resin composition and printed circuit substrate using the same Disclosed herein are an insulating resin composition soluble fluorine-based resin, thermosetting resin; a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin, and a printed circuit substrate using the same.... | 12/29/2011 |
| 20110317318 | CIRCUIT ELEMENTS COMPRISING FERROIC MATERIALS Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various e... | 12/29/2011 |
| 20110216515 | ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a suppor... | 09/08/2011 |
| 20110176284 | MULTILAYER PRINTED CIRCUIT BOARD AND THE MANUFACTURING METHOD THEREOF A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic ... | 07/21/2011 |
| 20110090657 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME A printed wiring board includes a built-in semiconductor element. A protective film is formed on a semiconductor element-mounted surface of a base substrate to which the built-in semiconductor element is connected to protect the semiconductor element-mounted surface exc... | 04/21/2011 |
| 20110051384 | PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT A printed circuit board element (1) comprising at least one component (2) embedded between a base (4) and a cover layer (6), which component (2) is adhered to the base (4) by means of an adhesive film section (3).... | 03/03/2011 |
| 20110032684 | TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF A conductor having a projecting portion is formed which forms a terminal portion. An uncured prepreg including a reinforcing material is closely attached to the conductor and the prepreg is cured to form an insulating film including the reinforcing material. When the pr... | 02/10/2011 |
| 20110002107 | Transponder and Booklet A transponder includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module a... | 01/06/2011 |
| 20100290191 | SYSTEM-IN PACKAGES System-in packages, or multichip modules, are described which can include multi-layer chips in a multi-layer polymer structure, on-chip metal bumps on the multi-layer chips, intra-chip metal bumps in the multi-layer polymer structure, and patterned metal layers in the m... | 11/18/2010 |
| 20100226108 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD A printed circuit board including a core substrate including a first resin substrate, a second resin substrate having an opening and a third resin substrate in a multilayer manner while interposing bonding plates, insulating layers and conductive circuit layers alternat... | 09/09/2010 |
| 20100142170 | Chip embedded printed circuit board and manufacturing method thereof The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the in... | 06/10/2010 |
| 20100134991 | Chip embedded printed circuit board and manufacturing method thereof The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The prevent invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias fo... | 06/03/2010 |
| 20100008055 | METHOD OF FABRICATING ELECTRONIC CARDS INCLUDING AT LEAST ONE PRINTED PATTERN The invention relates to a method for fabricating electronic cards, that comprises the following steps:
| 01/14/2010 |
| 20090231819 | MULTILAYER SUBSTRATE A multilayer substrate has a 1st strip line, a 2nd strip line and the 3rd strip line, and those characteristic impedances are different each other. The third strip line has a strip conductor of which length is equivalent to ΒΌ wavelength of an operating frequency. A str... | 09/17/2009 |
| 20090201654 | METHOD AND SYSTEM FOR IMPROVING ELECTRICAL PERFORMANCE OF VIAS FOR HIGH DATA RATE TRANSMISSION A method and system for reducing via hole parasitic effects on PCB transmission channels. In order to reduce the effects of excess via capacitance in PCB structures, PCB via modeling accuracy for high speed serial data transmissions is improved by utilizing lower permit... | 08/13/2009 |
| 20090201624 | COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT PACKAGE USING COMPONENT-EMBEDDED SUBSTRATE A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plura... | 08/13/2009 |
| 20090185357 | THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH AND RELATED METHODS An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conduc... | 07/23/2009 |
| 20090175012 | PRESS FIT PASSIVE COMPONENT A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the b... | 07/09/2009 |
| 20090103302 | Circuit Board Assembly and Backlight Module Comprising the Same A circuit board assembly and a backlight module comprising the circuit board assembly are provided. The circuit board assembly has a first surface and a second surface opposite to the first surface, and further comprises at least one laminate, a first conductive wiring ... | 04/23/2009 |
| 20090086451 | Printed circuit board with embedded cavity capacitor A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a pow... | 04/02/2009 |
| 20080239622 | WIRING STRUCTURE OF LAMINATED CAPACITORS The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacito... | 10/02/2008 |
| 20080174976 | Electronic Circuit Component Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety ... | 07/24/2008 |
| 20080151518 | CIRCUIT BOARD STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS A circuit board structure with embedded electronic components includes: a carrier board having an adhesive layer with two surfaces formed with first and second metal oxide layers covered by first and second metal layers and having at least one through hole; at least one... | 06/26/2008 |
| 20080123308 | PRINTED CIRCUIT BOARD INCLUDING EMBEDDED PASSIVE COMPONENT AND METHOD OF FABRICATING SAME Disclosed is a PCB including an embedded passive component and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating layer is interposed between the circuit layers. A pair of terminal... | 05/29/2008 |
| 20080106160 | Power Module and Motor Integrated Control Unit A power module comprises a heat radiation layer having the first main surface and the second main surface of reverse side opposed to the first main surface, an insulation layer disposed on the first main surface of a radiation layer, a wiring potion for current circuit ... | 05/08/2008 |
| 20070242440 | Multilayer Wiring Board, Method for Manufacturing Such Multilayer Wiring Board, and Semiconductor Device and Electronic Device Using Multilayer Wiring Board A multilayered substrate includes a plurality of circuit boards including a plurality of wiring layers including a grounding layer and a power layer, a solid electrolytic capacitor having an insulative oxide film layer, an electrolytic layer, and a conductor layer seque... | 10/18/2007 |
| 20070025092 | Embedded actives and discrete passives in a cavity within build-up layers Disclosed are any electronic system or module which includes embedded actives and discrete passives, and methods for use in fabricating packages containing embedded active devices and/or discrete passive devices. Exemplary apparatus comprises a plurality of build-up lay... | 02/01/2007 |
| 20050281008 | Extended thin film capacitor (TFC) Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package. ... | 12/22/2005 |
| 20050219829 | Printed circuit board and electronic apparatus using the same A printed circuit board and an electronic apparatus utilizing the same. The electronic apparatus includes the printed circuit board and a dual-inline-package (DIP) device. The printed circuit board includes a pair of holes. The pair of holes has a geometrical center, an... | 10/06/2005 |
| 20050211465 | Electronic parts packaging structure and method of manufacturing the same An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted... | 09/29/2005 |
