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| Application No. | Application Title | Issue Date |
| 20120105290 | MODULAR MMW POWER SOURCE A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divide... | 05/03/2012 |
| 20120069524 | COOLED ELECTRIC UNIT An electric unit, having at least one cooler structure and at least one electric module with at least one electric element on a metal-ceramic substrate.... | 03/22/2012 |
| 20120002372 | COMPOSITE COMPONENT AND METHOD FOR PRODUCING A COMPOSITE COMPONENT A composite component includes a first joining partner, at least one second joining partner and a first joining layer situated between the first joining partner and the second joining partner. In addition to the first joining layer, at least one second joining layer is ... | 01/05/2012 |
| 20110069457 | Semiconductor Device A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controll... | 03/24/2011 |
| 20100265664 | Semiconductor Device A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controll... | 10/21/2010 |
| 20090284931 | NESTED FIN INTEGRAL HEAT SINK ASSEMBLY FOR MULTIPLE HIGH POWER ELECTONIC CIRCUIT BOARD MODULES A method and apparatus for heat sinking for multiple high power circuit board modules, is provided. One implementation involves providing a compact nested fin integral heat sink assembly for each high power circuit board module, and positioning fin sections on the heat ... | 11/19/2009 |
| 20090251857 | SYSTEM INCLUDING AN ELECTRONIC MODULE WITH A HEAT SPREADER A system including an electronic module with a heat spreader. One embodiment provides a plate including a thermally conductive material and a guiding member arranged along an edge of the plate. The plate and the guiding member of the heat spreader are configured to form... | 10/08/2009 |
| 20090052141 | System and Method for Supporting One or More Heat-Generating Electrical Devices An apparatus and method for supporting a plurality of components, at least one of which is a heat-generating electrical device such as a power semiconductor device, are disclosed. In some embodiments, the apparatus includes a first structure having a first surface on on... | 02/26/2009 |
| 20080158826 | Composite module According to one embodiment, a composite module includes a substrate, a first module mounted on the substrate, a second module mounted on the substrate and provided to be independent from the first module, and a heat radiating plate. The heat radiating plate is thermall... | 07/03/2008 |
| 20080055864 | Module for an automation device There is described a module for an automation device with a plurality of adjacent modules, having a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. There is also described an automation device hav... | 03/06/2008 |
| 20080019100 | Plug module base with heat dissipating element The present invention discloses a plug module base with a heat dissipating element that forms at least one gap by a plurality of plug passages and a heat dissipating element installed in the gap, such that the plug passages and the heat dissipating element can be used t... | 01/24/2008 |
| 20080007912 | Disk array system In a disk array apparatus according to an aspect of the invention, temperatures of disk drives arranged in a casing are equalized to reduce a noise. A disk array apparatus 50 comprises plural disk drives 2, fans 5, and a casing 1. The disk dr... | 01/10/2008 |
| 20060291171 | Optical transponder with active heat transfer According to embodiments of the present invention, an optical transponder module generates heat when operating and a heat pipe disposed in the module body performs active heat transfer from a hot end of the optical transponder module to a cooler end of the optical trans... | 12/28/2006 |
| 20060152906 | Battery storage system The invention includes a storage rack for storing an array of battery cells in an uninterrupted power source (UPS). The rack at least meets the seismic testing requirements of NEBS GR-63-CORE (Issue 2 Apr. 2002). The rack includes a base module having pair of spaced end... | 07/13/2006 |
| 20060133047 | Display device and game machine with the display device A display device includes a fixed first display element and a movable second display element, the first display element and the second display element assume a first state in which the first display element and the second display element are arranged individually and a ... | 06/22/2006 |
| 20060126306 | Multi-power optoelectric packages A cage assembly comprising a mounting rack with a plurality of adjacent openings wherein a width of each opening in the plurality of adjacent openings is capable of receiving a single width transceiver package, wherein each adjacent opening in the plurality of adjacent ... | 06/15/2006 |
| 20050281002 | Battery storage system The invention includes a storage rack for storing an array of battery cells in an uninterrupted power source (UPS). The rack at least meets the seismic testing requirements of NEBS GR-63-CORE (Issue 2, April 2002). The rack includes a pair of spaced end supports. Each e... | 12/22/2005 |
| 20050259402 | Power stack A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are bro... | 11/24/2005 |
| 20050243522 | Combined packaging and storage apparatus having added functionality A multi-purpose product packaging (100, 200) for an electronic host product (250) having its own casing can include an apparatus casing (110, 210) for removably and substantially encasing the electronic host product, circuitry (240) within th... | 11/03/2005 |
| 20050135067 | Semiconductor module with vertically mounted semiconductor chip packages A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may includ... | 06/23/2005 |
| 20050105277 | Power unit comprising a heat sink, and assembly method The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissipate... | 05/19/2005 |
