Celebrity Inventors
Mark Twain (Samuel L. Clemens) received Patent No. 121,992 for "An Improvement in Adjustable and Detachable Straps for Garments." He later received two more patents: one for a self-pasting scrapbook and one for a game to help players remember important historical dates.
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| Application No. | Application Title | Issue Date |
| 20120127668 | POWER MODULE A power module can prevent damages due to cracking or breakage of an insulating substrate when molding even if a heat plate constituting a power module pre-product is made areally smaller than the insulating substrate, and can also sufficiently satisfy demand for minimi... | 05/24/2012 |
| 20120106086 | SEMICONDUCTOR MODULE HAVING AN INSERT AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE HAVING AN INSERT A power semiconductor module includes a module housing with a sealing ring on its top side. The sealing ring, in co-operation with the module housing and a printed circuit board attached to the power semiconductor module, hermetically seals feed-through locations at the... | 05/03/2012 |
| 20120039047 | GUIDE SYSTEM FOR A CARD MODULE A guide system is provided for an electronic device having a card module mated with a header. The guide system includes a guide rail configured to guide the card module for mating with the header of the electronic device. The guide rail includes a main wall extending al... | 02/16/2012 |
| 20120020017 | PRINTED CIRCUIT BOARD MODULE ENCLOSURE AND APPARATUS USING SAME A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially para... | 01/26/2012 |
| 20110310565 | HEAT SINK FOR MEMORY MODULE A heat sink for memory module includes two heat-sink plates and two fastening members. Each heat-sink plate defines two through holes. The through holes of one heat-sink plate are coaxial to the through holes of the other heat-sink plate. Each fastening member includes ... | 12/22/2011 |
| 20110300815 | INTEGRAL LATCH MECHANISMS FOR MOUNTING ELECTRONICS MODULES In one embodiment, a locking mechanism comprises: a lever-arm-component coupled to a first side of an module and a second side of the module that opposes the first side; the lever-arm-component rotates about a first axis; first and second latching-arm-components includi... | 12/08/2011 |
| 20110235278 | CIRCUIT MODULE A circuit module includes a plurality of electronic components including at least one heat-generating electronic component and constituting an electric circuit are spaced from each other on a circuit board. Regions of one or both sides of the circuit board, including re... | 09/29/2011 |
| 20110222245 | ELECTRONIC MODULE WITH CENTER MOUNTING FASTENERS An electronic module is employed with at least one interiorly positioned fastener that at least partially secures a central region of the electronic module to an object to prevent bowing or warping. The module contains a base, at least two peripheral fasteners at oppose... | 09/15/2011 |
| 20110170264 | Semiconductor Module Socket Apparatus A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the s... | 07/14/2011 |
| 20110110047 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the ... | 05/12/2011 |
| 20110069456 | SYSTEM TO IMPROVE AN IN-LINE MEMORY MODULE A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning... | 03/24/2011 |
| 20110044006 | HEAT MANAGEMENT IN AN ELECTRONIC MODULE In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are c... | 02/24/2011 |
| 20110032679 | SEMICONDUCTOR MODULE A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal e... | 02/10/2011 |
| 20100321895 | MEMORY MODULES INCLUDING COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLIES According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may ... | 12/23/2010 |
| 20100302740 | Methods of cooling semiconductor dies The invention includes semiconductor packages having grooves within a semiconductor die backside; and includes semiconductor packages utilizing carbon nanostructures (such as, for example, carbon nanotubes) as thermally conductive interface materials. The invention also... | 12/02/2010 |
| 20100284152 | CARD GUIDE AND HEATSINK ASSEMBLIES FOR PLUGGABLE ELECTRO-OPTIC MODULES In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surf... | 11/11/2010 |
| 20100277872 | INSULATING SHEET AND METHOD FOR PRODUCING IT, AND POWER MODULE COMPRISING THE INSULATING SHEET An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.... | 11/04/2010 |
| 20100265663 | ELECTRONIC COMPONENT MODULE Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module... | 10/21/2010 |
| 20100214742 | Heat-sinking memory module device A memory module has a good heat sinking effect. Each chip on the memory module has a surface exposed in the air. Or, a thermal pad can further adhere to the surface of the chips. Thus, the heat sinking effect of the memory module is improved; and an easy and convenient ... | 08/26/2010 |
| 20100134981 | Heat sink assembly having interdigitated cooling fins A heat sink assembly including a first heat sink sub-assembly in thermal contact with a first heat source and including spaced apart columns of spaced horizontal fins extending outwardly from the first heat source, and a second heat sink sub-assembly in thermal contact ... | 06/03/2010 |
| 20100134982 | MEMORY HEAT DISSIPATING STRUCTURE AND MEMORY DEVICE HAVING THE SAME A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is a... | 06/03/2010 |
| 20100134983 | ELECTRIC MEMORY MODULE WITH COOLING BODIES An electric memory module is disclosed with at least two capacitors that are interconnected by an electrically conductive connection device. The memory module includes an electric insulation which electrically insulates the memory module, and the memory module includes ... | 06/03/2010 |
| 20100124026 | HEAT DISSIPATING MODULE A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure include... | 05/20/2010 |
| 20100110642 | MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the firs... | 05/06/2010 |
| 20100027222 | Module for an automation device A module for an automation device with a plurality of adjacent modules is provided. The module includes a housing capsule that has at least one rear wall and two side walls and which is provided for housing electric components. Further, an automation device including th... | 02/04/2010 |
| 20090323288 | Heat sink slack storage and adaptive operation Optical Network Terminals (ONTS) receive and transmit fiber optic data signals to a premises, such as a home or office, and generate heat, which must be dissipated. An outdoor installation may introduce additional heat loads over an indoor installation. An ONT designed ... | 12/31/2009 |
| 20090284930 | MODULAR HEATSINK MOUNTING SYSTEM In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably m... | 11/19/2009 |
| 20090135565 | Assembly Device and Assembly Method for a Cooling Element A device can be used for applying a cooling element onto a module. The cooling element has a first side part and a second side part opposite the first side part. The first and second side parts are connected by a region. The device includes a spreader, which is adapted ... | 05/28/2009 |
| 20090129027 | INTEGRATED NON-ISOLATED VRM AND MICROPROCESSOR ASSEMBLY The present invention provides one single chip solution for a non-isolated DC-DC regulator. The advantage is high reliability, lower cost and smaller space on the motherboard. This integrated solution opens the door for a distributed architecture with few millimeter hig... | 05/21/2009 |
| 20090129026 | Heat sink for semiconductor device and semiconductor module assembly including the heat sink Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally expo... | 05/21/2009 |
| 20090129028 | Power module and method of fabricating the same Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a ... | 05/21/2009 |
| 20090091892 | Semiconductor Device A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first ... | 04/09/2009 |
| 20090067135 | Semiconductor Package Having Socket Function, Semiconductor Module, Electronic Circuit Module and Circuit Board with Socket Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling elec... | 03/12/2009 |
| 20090059467 | POWER CAPACITOR A power electronics module includes a capacitor having a trough-shaped housing and at least one capacitor winding. An electronic unit includes a base on which the capacitor is mounted. A cooling plate in thermal contact with a cooling surface of the capacitor is formed ... | 03/05/2009 |
| 20090010653 | Optical module According to an aspect of the embodiment, an optical module includes a case, an optical transceiver part in the case, a radiating part on the case; a thermal conductive sheet having a property of transferring and having a first end and second end; a first fixing part fo... | 01/08/2009 |
| 20090002951 | SYSTEM HAVING A HEAT TRANSFER APPARATUS A system including a heat transfer apparatus is disclosed. One embodiment provides for an electronic device and a heat transfer apparatus including a heat distribution plate with a first surface being at least in part in thermal communication with the electronic device.... | 01/01/2009 |
| 20080298023 | ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THEREOF An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from a... | 12/04/2008 |
| 20080291637 | SMALL-SIZED COMMUNICATION MODULE PACKAGE A small-sized communication module package mountable on a main board is of stacked structure including a carrier with an opening in which a thermal conductive layer in contact with a substrate stacked on the carrier is filled. The communication module package further in... | 11/27/2008 |
| 20080278917 | HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME A heat dissipation module including a substrate, a printed circuit board (PCB), and at least one light emitting diode (LED) chip is provided. A surface of the substrate has at least one positioning portion protruding upward. The PCB has at least one positioning hole cor... | 11/13/2008 |
| 20080192437 | Power Semiconductor Module A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through... | 08/14/2008 |
