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Microwave Oven With Removable Storage Cassette in Dashboard of Motor Vehicle
A microwave oven adapted for use within a motor vehicle dashboard area. The microwave oven has a removable storage cassette, and slidable platforms for securing and serving containers of beverages and foods.
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| Application No. | Application Title | Issue Date |
| 20110292610 | HEAT SINK AND ELECTRONIC APPARATUS USING THE SAME A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from... | 12/01/2011 |
| 20110286185 | Inverter device and drive unit using the same In two systems of three-phase alternating-current inverter devices that drive a motor, power elements on power supply sides of bridge circuits are mounted on unit bases to constitute upper arm units. Power elements on ground sides of the bridge circuits are mounted on u... | 11/24/2011 |
| 20110279980 | HEAT DISSIPATION STRUCTURE FOR LIQUID CRYSTAL TELEVISION A heat dissipation structure for a liquid crystal television is disclosed. The liquid crystal television includes a front plate and a rear plate. The front plate has a screen and a metal backboard. The heat dissipation structure includes a printed circuit board (PCB) mo... | 11/17/2011 |
| 20110090647 | PRINTED CIRCUIT BOARD ASSEMBLY A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating ... | 04/21/2011 |
| 20110058336 | THERMAL BRIDGE EXTENSIONS FOR A MODULE-CHASSIS INTERFACE A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the sec... | 03/10/2011 |
| 20110026227 | FREQUENCY CONVERTER ON A MOTOR A frequency converter includes a housing, which is designed and envisaged for the peripheral assembly on an electric motor. The base of the housing is provided in the middle region on the outside with longitudinal ribs and is connected to heat-producing components of th... | 02/03/2011 |
| 20110013360 | Quasi-radial heatsink with rectangular form factor and uniform fin length In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally c... | 01/20/2011 |
| 20100320187 | Heat Sink and Thermal Plate Apparatus for Electronic Components An apparatus for dissipating heat from and providing heat to electronic components includes a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module, and a heating member embedded in the th... | 12/23/2010 |
| 20100302738 | VOLTAGE ADJUSTER FOR AC GENERATOR FOR VEHICLE In a voltage adjuster for a vehicle AC generator which has a cooing member for cooling a circuit portion of the voltage adjuster and in which plural fins of the cooling member are disposed so as to face an air suction hole formed in a case, the cooling member is constru... | 12/02/2010 |
| 20100277871 | ELECTRIC POWER CONVERTING APPARATUS A cooling device for cooling a plurality of switching elements included in each of a converter unit and an inverter unit includes a fin base that serves as a switching element attachment plane on which the switching elements are mounted and a plurality of fins arranged ... | 11/04/2010 |
| 20100259900 | HEAT SINK A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member... | 10/14/2010 |
| 20100246136 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is... | 09/30/2010 |
| 20100220447 | HEAT DISSIPATION DEVICE A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and recei... | 09/02/2010 |
| 20100177482 | MOUNTING SOCKET THAT DISSIPATES HEAT FROM A NETWORK DEVICE A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first side o... | 07/15/2010 |
| 20100172103 | HEAT DISSIPATION DEVICE A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base.... | 07/08/2010 |
| 20100165573 | HEAT SINK USED IN INTERFACE CARD A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is cons... | 07/01/2010 |
| 20100165578 | Heat Sink Mount for Providing Non-Rigid Support of Overhanging Portions of Heat Sink A computer adapted for force-air cooling of a processor. The computer includes a board supporting the processor and a heat sink mounted such with its base plate contacting the processor. A primary mount supports the heat sink near the processor, and a portion of the hea... | 07/01/2010 |
| 20100157541 | HEAT SINK AND ELECTRONIC DEVICE USING SAME An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spac... | 06/24/2010 |
| 20100157540 | FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat diss... | 06/24/2010 |
| 20100142152 | FASTENER AND HEAT SINK ASSEMBLY HAVING THE SAME A fastener includes a fastener post, a sleeve, a nut and an elastic element. The fastener post includes a shaft, a tapered portion and a threaded portion. The sleeve includes a smooth portion and a clamp portion having a number of resilient strips. The nut is threaded o... | 06/10/2010 |
| 20100142153 | HEAT SINK DEVICE WITH A SHIELDING MEMBER A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic comp... | 06/10/2010 |
| 20100128443 | HEAT DISSIPATING MODULE A heat dissipating module is mounted on a circuit board. The circuit board includes at least an insertion hole. The heat dissipating module includes a heat sink and at least a fixing element. The heat sink has at least a guiding track, wherein at least an electronic com... | 05/27/2010 |
| 20100128442 | HEAT SINK ASSEMBLY A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of t... | 05/27/2010 |
| 20100118496 | HEAT SINK FOR MODULAR LED FLOOD LIGHT A heat sink which is adaptable to form a module of a modular luminaire which uses LED light sources. The heat sink may have cooling fins projecting in three directions from a base member and two walls projecting from the base member. Fastener holes are provided as chann... | 05/13/2010 |
| 20100103624 | HEAT DISSIPATING DEVICE WITH TEMPERATURE DETECTING FUNCTION A heat dissipating device with a temperature detecting function includes a heat sink module, a temperature detecting unit, a control unit, and a display unit. The heat sink module is configured for dissipating heat for a heat-generating electrical device. The temperatur... | 04/29/2010 |
| 20100073884 | LIGHT ENGINE, HEAT SINK AND ELECTRICAL PATH ASSEMBLY An assembly includes a conductive heat sink, a heat generating device, such as a light emitting diode, mounted on the heat sink, a pair of pins which extend through channels provided through the heat sink, and a pair of sleeves which at least partially surrounds the pin... | 03/25/2010 |
| 20100061063 | Process for Preparing Conductive Films and Articles Prepared Using the Process A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix... | 03/11/2010 |
| 20100046172 | ELECTRONICS PACKAGE INCLUDING HEAT SINK IN THE HOUSING AND RELATED METHODS An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also inclu... | 02/25/2010 |
| 20100046173 | Method and System for Adapting a Mobile Computing Device with a Grounded Metallic Housing Devices and systems are for adapting a mobile computing device, such as a handheld radio frequency identification (“RFID”) reader, with a grounded metallic housing substrate without impacting the performance of the device. The device includes a heat generating compo... | 02/25/2010 |
| 20100039776 | MOTOR CONTROLLER A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink (1), reducing the number of parts, and reducing the man-hours of assembling is provided. In a motor controller including an extrusion heat sink (1), an... | 02/18/2010 |
| 20100020501 | HEAT DISSIPATION DEVICE A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat ... | 01/28/2010 |
| 20090316362 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round co... | 12/24/2009 |
| 20090303685 | Interface module with high heat-dissipation This invention relates to an interface module with high heat dissipation, comprising a metal base, an electrical insulation layer with high heat-conductivity and a metal circuit. The electrical insulation layer with high heat-conductivity is provided on the heat absorpt... | 12/10/2009 |
| 20090284929 | HEAT DISSIPATION ASSEMBLY A heat dissipation assembly (10) includes a heat sink (20) and a cover (30). The heat sink includes a base (22) and a plurality of fins (24) formed on a bottom surface of the base. A depression (220) is formed in a top surface o... | 11/19/2009 |
| 20090279265 | ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF A heat sink plate is mounted on an electronic device for heat radiation of the electronic device. When the fundamental wave or a harmonic wave of the clock signal of the electronic device is coincide with the size of the heat sink plate, the heat sink plate resonates an... | 11/12/2009 |
| 20090268408 | HEAT SINK ASSEMBLY A heat sink assembly for an add-on card includes a heat sink and a clip received in the heat sink. The heat sink includes a supporting plate and a first and a second heat absorbing plates extending downwardly from the supporting plate. The first and second heat absorbin... | 10/29/2009 |
| 20090268409 | HEAT DISSIPATION ASSEMBLY A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material a... | 10/29/2009 |
| 20090262505 | Heat radiator A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall o... | 10/22/2009 |
| 20090244849 | HEAT DISSIPATION DEVICE A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusi... | 10/01/2009 |
| 20090244847 | MOUNTING DEVICE FOR CHIPS A mounting device for chips has a heat sink and at least one clamp. The heat sink has at least one conductive side, two ends, multiple chip units and two connecting bases. The chip units are arranged on the at least one conductive side. The connecting bases are formed o... | 10/01/2009 |
