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| Application No. | Application Title | Issue Date |
| 20050121986 | Drive circuit device and motor having the same A heat sink member divides a circuit board into a first circuit part and a second circuit part. The first circuit part includes circuit elements, such as a transistor, an electric current sensing resistor and a choke coil, which generate heat upon operation thereof. The... | 06/09/2005 |
| 20050117296 | Ball grid array package with heat sink device The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly that comprises a heat dissipating element above the heat sink body and is used to increa... | 06/02/2005 |
| 20050117302 | Module structure and module comprising it A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history dur... | 06/02/2005 |
| 20050111196 | Fastening structure of heat sink A fastening structure used for fastening a heat sink to a heat generating device formed on a board is disclosed. The heat sink has a plurality of vertically extending fins spaced by each other by a first gap, and the fastening structure has a pair of blocking members ap... | 05/26/2005 |
| 20050111189 | Thermal solution for electronic devices A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while ... | 05/26/2005 |
| 20050105270 | Electronics apparatus and image forming apparatus In an image forming apparatus including a thermal head attached to a supporting body having a heat release function, a power supply circuit board that is disposed inside a casing and supplies electrical power to the thermal head, and a cooling fan that takes in the outs... | 05/19/2005 |
| 20050099779 | Locking heatsink apparatus A heatsink is provided for cooling power components on a printed circuit board. The heatsink includes a slot so that it is placed over the power device to be cooled. An activating member may be inserted from the opposite side of the printed circuit board and fastened in... | 05/12/2005 |
| 20050094372 | Electronic device and module structure thereof An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a mot... | 05/05/2005 |
| 20050088824 | Heat sink with integrated electronics A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an... | 04/28/2005 |
| 20050088831 | POWER REGULATOR A power regulator has a heat sink, a case and a PCB. The case is mounted on a top of the heat sink, and multiple holes are defined in the case. The PCB is mounted vertically on top of the heat sink and has a fuse bracket, a wire connector, an input terminal, an output t... | 04/28/2005 |
| 20050088827 | Electrical card having heatsink device The present invention is related to an electrical card having a heatsink device, in which the electrical card includes an upper cover, a lower cover, a printed circuit board, and a heatsink device. The upper cover assembles with the lower cover so as to form a housing w... | 04/28/2005 |
| 20050083660 | Power supply without cooling fan The invention provides a power supply for a computer mainframe, which is cooled by a heat conduction method, and more particularly to a power supply without a cooling fan. The present invention features a highly effective heat pipe connecting a plurality of aluminum-ext... | 04/21/2005 |
| 20050078448 | Housing for a passively cooled computer A housing (1) for a passively cooled computer (2), which is to be accommodated in the housing, the housing (1) including:
| |
| 20050079355 | Heat spreader for emissive display device A heat spreader for an emissive display device, such as a plasma display panel or a light emitting diode, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of a discharge cell fa... | 04/14/2005 |
| 20050078453 | Thermal spreader using thermal conduits A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value i... | 04/14/2005 |
| 20050073811 | Heat dissipating device for electronic component A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers ... | 04/07/2005 |
| 20050041397 | Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks A base station for a wireless communications system having a tower-mounted amplifier system with a low-noise amplifier transistor and a thermoelectric cooler that reduces the operating temperature of the low-noise amplifier transistor. The amplifier system has additiona... | 02/24/2005 |
| 20050041394 | Heatsink device A heatsink device includes a heat conducting interface, a press plate mounted on the heat conducting interface, and a plurality of heat conducting metal threads pressed between the heat conducting interface and the press plate. Thus, the heat conducting metal threads ar... | 02/24/2005 |
| 20050018402 | Thermally enhanced electronic module A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and a die. The case includes a pivot area with a first shape formed into the case for receiving a first portion of the heat sink and a first porti... | 01/27/2005 |
