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| Application No. | Application Title | Issue Date |
| 20110032678 | NANO-TUBE THERMAL INTERFACE STRUCTURE A structure, comprising: a semiconductor structure having an electrically and thermally conductive layer disposed on one surface of the semiconductor structure; an electrically and thermally conductive heat sink; a electrically and thermally conductive carrier layer; a ... | 02/10/2011 |
| 20110026226 | VEHICULAR ELECTRONICS ASSEMBLY An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive lay... | 02/03/2011 |
| 20110025329 | SYSTEM AND METHOD FOR THERMO-ELECTRIC COOLING OF RF COILS IN AN MR IMAGING SYSTEM A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about a... | 02/03/2011 |
| 20110007762 | OPTICAL MODULE To constitute an optical module in which a comb-shaped submount is fixed on a heat sink and a device having an optical functioning unit is mounted on the comb-shaped submount, a stress buffering block that relaxes a thermal stress acting between the heat sink and the co... | 01/13/2011 |
| 20110002104 | BRACKET FOR MOUNTING HEAT SINK A bracket is used to mount a heat sink to a printed circuit board (PCB). The heat sink can dissipate heat for an electronic component mounted on the PCB. Cantilevers can be detached from the bracket, and replaced by other cantilevers with different sizes to mount a plur... | 01/06/2011 |
| 20100328897 | HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals... | 12/30/2010 |
| 20100321894 | HEATSINK MOUNTING SYSTEM A heatsink mounting system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) is includes a rectangular integrally formed resilient frame (12) de... | 12/23/2010 |
| 20100315787 | System and Method for Dissipating Heat from Semiconductor Devices A system includes a circuit board, a multi-die package, and a heat dissipator. The circuit board has substantially planar opposing first and second sides. The multi-die package includes a substrate and a first set of one or more semiconductor devices on a first substrat... | 12/16/2010 |
| 20100315786 | SEMICONDUCTOR DEVICE A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a thir... | 12/16/2010 |
| 20100315785 | ELECTRONIC EQUIPMENT An electronic equipment includes: an attachment plate; attachments disposed on the attachment plate and each provided with a female screw; a printed circuit board placed on the attachments; electronic parts mounted on the surface of the printed circuit board opposite to... | 12/16/2010 |
| 20100315784 | FASTENING CLAMP The invention relates to a fixing element (10), in particular in the form of a fixing clamp, for fixing an electronic component (12, 14) to a surface (18) of a cooling body (16). The fixing element (10) has a first free end (44)... | 12/16/2010 |
| 20100309632 | MOTHERBOARD WITH MOUNTING HOLES A motherboard includes a printed circuit board, and a heat generating component mounted on the printed circuit board. A plurality of mounting holes is defined in the printed circuit board for mounting a heat sink apparatus on the heat generating component. At least a gr... | 12/09/2010 |
| 20100309633 | ELECTRONIC CIRCUIT COMPOSED OF SUB-CIRCUITS AND METHOD FOR PRODUCING THE SAME To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.... | 12/09/2010 |
| 20100309634 | Thermal Interface with Non-Tacky Surface A package includes a thermal interface member which includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperatu... | 12/09/2010 |
| 20100302729 | HIGH POWER SOLID STATE POWER CONTROLLER PACKAGING A high power solid state power controller packaging system and power panel are disclosed. The high power solid state power controller packaging system includes a plurality of discrete power devices assembled juxtaposed to one another in a row, a fin style heatsink, an i... | 12/02/2010 |
| 20100302737 | POWER ELECTRONICS POWER MODULE WITH IMBEDDED GATE CIRCUITRY A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the... | 12/02/2010 |
| 20100290490 | HEAT SINK AND ASSEMBLY OR MODULE UNIT A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and... | 11/18/2010 |
| 20100290193 | Stacked-chip packaging structure and fabrication method thereof A stacked-chip packaging structure includes chip sets, a heat sink, a substrate, a circuit board, and solder balls. The chip sets are stacked together, each of which has a heat-dissipation structure and a chip. The heat-dissipation structure has a chip recess, through h... | 11/18/2010 |
| 20100290194 | MOUNTING ASSEMBLY FOR HEAT SINK A mounting assembly includes a circuit board, a chip socket mounted on a topside of the circuit board with a chip attached thereon, a heat sink positioned on a top surface of the chip, and a backplate attached to an underside of the circuit board. The heat sink includes... | 11/18/2010 |
| 20100284151 | Sealed Power Supply and Platform for Military Radio An AC/DC power supply and platform for a military radio has been developed. The apparatus includes a base that supports at least one SINCGARS RT-1523 radio. The base is connected to an AC power supply and at least one DC power supply. The AC supply and DC power supply a... | 11/11/2010 |
| 20100271784 | HEAT SINK ASSEMBLY HAVING A CLIP A heat sink assembly includes a heat sink adapted for thermally contacting an electronic component of a printed circuit board, and a clip pressing the heat sink and engaging with the printed circuit board. The clip includes a pressing portion pressing the heat sink, two... | 10/28/2010 |
| 20100259899 | PASSIVE COOLING SYSTEM AND METHOD FOR ELECTRONICS DEVICES An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat pipe and at least one heat sink thermally coupled to a bridge plate. When a cradle is thermally coupled to the at least one heat pipe, the at least... | 10/14/2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. Dur... | 09/30/2010 |
| 20100248000 | DEVICE FOR STORING ELECTRIC ENERGY A device for storing electrical energy is provided, especially for a motor vehicle. The device includes at least one rechargeable storage cell and a cooling unit which is in thermal contact with the storage cell. The storage cell is accommodated in a retaining element a... | 09/30/2010 |
| 20100238632 | Load driving device A load driving device includes: an output power device for driving a load; a driving IC for controlling the output power device, wherein the driving IC is electrically coupled with the output power device through a wire or a connection member; and a first electrode subs... | 09/23/2010 |
| 20100232105 | System and Method for Supporting a Plurality of Propulsion Energy Storage Cells Within a Vehicle An energy storage cell pack cradle assembly for holding multiple rows of energy storage cells oriented along a dominant axis of vibration includes a first cradle member including a plurality of energy storage cell body supporting structures including respective holes; a... | 09/16/2010 |
| 20100232113 | HEAT DISSIPATION DEVICE WITH FASTENER An electronic device comprises a printed circuit board, an electronic component mounted on the printed circuit board, a heat dissipation device dissipating heat generated by the electronic component and a plurality of wires on the printed circuit board. The heat dissipa... | 09/16/2010 |
| 20100208431 | Patterned Composite Structures and Methods of Making the Same The present disclosure relates to a patterned surface composite structure. The structure includes a first material having a specific coefficient-of-thermal-expansion and a second material having a different coefficient-of-thermal-expansion. The first material can be pat... | 08/19/2010 |
| 20100208430 | HEAT DISSIPATION ARRANGEMENT FOR COMMUNICATION CHASSIS A heat dissipation arrangement for communication chassis includes a chassis body defining an inner receiving space and being divided into at least one heat receiving portion and at least one heat dissipation portion; a first heat pipe set arranged in the receiving space... | 08/19/2010 |
| 20100177482 | MOUNTING SOCKET THAT DISSIPATES HEAT FROM A NETWORK DEVICE A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first side o... | 07/15/2010 |
| 20100172102 | SOLDERLESS HEATSINK ANCHOR A heatsink may be releasably secured to a substructure of an electronic system, such as a circuit board, in engagement with a heat-generating component, such as a processor. One embodiment provides an anchor that includes an anchor body, a hook coupled to the anchor bod... | 07/08/2010 |
| 20100165576 | POWER SYSTEM MODULE AND METHOD OF FABRICATING THE SAME Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control... | 07/01/2010 |
| 20100157527 | High-Power Ultracapacitor Energy Storage Pack and Method of Use In an energy storage cell pack including at least one energy storage cell that radiates heat in a longitudinal axial direction outwards, towards opposite electrically conductive and heat conductive terminals, a terminal heat sink includes a receiving section for structu... | 06/24/2010 |
| 20100157539 | HEATSINK MOUNTING SYSTEM A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cav... | 06/24/2010 |
| 20100142150 | COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing ... | 06/10/2010 |
| 20100134979 | POWER SEMICONDUCTOR APPARATUS A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat... | 06/03/2010 |
| 20100128440 | HEAT SINK ASSEMBLY HAVING A CLIP A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and two first and two second fins mounted on a top surface of the base. The first and second fins are spaced from each other. The first fins are located between the second fins. Each sec... | 05/27/2010 |
| 20100128441 | ARC DISCHARGE DEVICE [Object] To incorporate more semiconductor elements in a small-sized lightweight power semiconductor module provided in an arc discharge device. [Means for Settlement] A power supply unit of an arc discharge device includes a semiconductor ... | 05/27/2010 |
| 20100128439 | THERMAL MANAGEMENT SYSTEM WITH GRAPHENE-BASED THERMAL INTERFACE MATERIAL A thermal management system includes graphene paper disposed between a heat source and a heat sink to transfer heat therebetween. The graphene paper is oriented such that the individual layers are substantially perpendicular to the plane of the heat source and the plane... | 05/27/2010 |
| 20100122795 | HEAT DISSIPATION DEVICE A heat dissipation device includes a heat sink, a plurality of heat pipes extending in the heat sink, a heat-conducting plate attached to the heat pipes, and a mounting member located between the heat sink and the heat-conducting plate and firmly securing the heat pipes... | 05/20/2010 |
