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| Application No. | Application Title | Issue Date |
| 20120127666 | Heat-Radiating Substrate and Method Of Manufacturing The Same Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a c... | 05/24/2012 |
| 20120127667 | HEAT SINK PACKAGE AND METHOD OF MANUFACTURING A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connectio... | 05/24/2012 |
| 20120050996 | SEMICONDUCTOR PACKAGE WITH THERMAL HEAT SPREADER A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so ... | 03/01/2012 |
| 20120044649 | HEAT DISSIPATION DEVICE A heat dissipation device is used for heat dissipating for an electronic element. The heat dissipation device includes a heat sink and a buffer arranged between the heat sink and the electronic element. The buffer is made of elastic and thermally conductive material.... | 02/23/2012 |
| 20120039044 | ELECTRONIC DEVICE AND HEAT DISSIPATION APPARATUS OF THE SAME A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a he... | 02/16/2012 |
| 20120014067 | HEAT SINK FOR POWER CIRCUITS The present invention relates generally to a heat sink comprising a plurality of fins, each fin having two or more prongs extending from a root section of the fin. In certain embodiments, the heat sink may be assembled by aligning the plurality of fins within slots betw... | 01/19/2012 |
| 20120002371 | ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS An electronic device includes an enclosure, a circuit board disposed within the enclosure, a heat sink, and a thermally conductive member. A heat-generating electronic component is fixed to the circuit board. The heat sink is in contact with the heat-generating electron... | 01/05/2012 |
| 20120001809 | RADIO FREQUENCY UNIT AND INTEGRATED ANTENNA A radio frequency unit and an integrated antenna are provided. The radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board. The duplexer connects to the power amplifier circuit board and the transceiver circuit board. T... | 01/05/2012 |
| 20110299248 | COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conduct... | 12/08/2011 |
| 20110299249 | HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm incl... | 12/08/2011 |
| 20110279968 | HEAT SINK HAVING AUTO SWITCHING FUNCTION, HEAT SINK SYSTEM AND HEAT SINKING METHOD FOR THE SAME A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control... | 11/17/2011 |
| 20110267779 | LED LIGHTING SYSTEM WITH A THERMAL CONNECTOR There is described an LED lighting system comprising: at least one light emitting diode (LED); a heat sink thermally connected to the at least one LED for dissipating heat generated by the at least one LED; an electrical connector for electrically connecting the LED lig... | 11/03/2011 |
| 20110267780 | THERMAL DISSIPATOR UTILIZNG LAMINAR THERMAL TRANSFER MEMBER A thermal dissipator includes an elongated laminar thermal transfer member having opposite sides, opposite ends and a longitudinal axis extending between those ends. The member has a thermal conductivity along its axis and in a first plane extending between its sides th... | 11/03/2011 |
| 20110255247 | HEAT SINK ASSEMBLY AND ELECTRONIC DEVICE EMPLOYING THE SAME A heat sink assembly with shielding frame is mounted on a circuit board and includes a heat sink, a shielding frame and a heat transmitting film. The circuit board comprises at least one electronic component and a plurality of latching slots surrounding the electronic c... | 10/20/2011 |
| 20110242765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate coverin... | 10/06/2011 |
| 20110204820 | CONFIGURABLE LED DRIVER/DIMMER FOR SOLID STATE LIGHTING APPLICATIONS The disclosure is directed at a configurable light emitting diode (LED) driver/dimmer for controlling a set of light fixture loads comprising: a power circuit; a primary digital controller for controlling the power circuit; a set of output current drivers, each of the s... | 08/25/2011 |
| 20110205702 | APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF LIGHT EMITTING DIODES An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple ... | 08/25/2011 |
| 20110188207 | MOBILE TERMINAL A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side c... | 08/04/2011 |
| 20110182034 | COMPOSITE COVER WITH INTEGRAL HEAT SINK A composite cover for a portion of a motor vehicle transmission has an integral, internal heat sink to which an electronic controller is attached. The cover, which may be fabricated of any temperature appropriate plastic or composite, closes off and protects that portio... | 07/28/2011 |
| 20110170265 | HEAT DISSIPATING DEVICE AND HEAT DISSIPATING SYSTEM A heat dissipating device includes a supporting component installed on a circuit board. A plurality of openings is formed on the supporting component. The heat dissipating device further includes a plurality of heat dissipating components disposed on a side of the suppo... | 07/14/2011 |
| 20110157833 | RETENTION MODULE FOR TOOLLESS HEAT SINK INSTALLATION An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably inst... | 06/30/2011 |
| 20110149520 | HEAT SINK ASSEMBLY An exemplary heat sink assembly includes a heat sink and a clip resiliently clamping the heat sink on a printed circuit board. The heat sink includes a base and a plurality of first fins and two central second fins extending upwardly from the base. The clip includes a l... | 06/23/2011 |
| 20110134608 | SEMICONDUCTOR DEVICE A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first m... | 06/09/2011 |
| 20110134607 | SOLID STATE SWITCH ARRANGEMENT A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the ... | 06/09/2011 |
| 20110128707 | POWER SEMICONDUCTOR MODULE FOR WIDE TEMPERATURE APPLICATIONS A power semiconductor module includes an insulating substrate with a conductive circuit layer attached to one side and a baseplate attached to the other side. A power semiconductor device is attached to the conductive circuit layer. The conductive circuit layer and the ... | 06/02/2011 |
| 20110116237 | RF PACKAGE An RF package includes a substrate mountable on a base plate, a non-conductive cover overlying the substrate, and quasi-serpentine stepped source leads attached to an upper surface of the substrate and extending from at least one of a pair of opposite sides of the upper... | 05/19/2011 |
| 20110116238 | HEAT DISSIPATION MODULE FOR ELECTRONIC APPARATUS A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion a... | 05/19/2011 |
| 20110116267 | HEAT DISSIPATION STRUCTURE OF AN ELECTRONIC ELEMENT A heat dissipation structure of an electronic element includes a cooling fin, an aluminum heat dissipation seat which is provided on the cooling fin and at least one electronic element which is provided on the aluminum heat dissipation seat. At least one heat conducting... | 05/19/2011 |
| 20110110046 | REINFORCEMENT FRAME, COMPONENT UNIT, AND DISPLAY Disclosed is a reinforcement frame (38) fixed to an outer package (37) of a heated component unit in a display (69), wherein a first heat dissipation fin is included in the reinforcement frame (38). With such an arrangement, even when heat ge... | 05/12/2011 |
| 20110103020 | Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially pe... | 05/05/2011 |
| 20110090649 | TILT-TYPE HEAT-DISSIPATING MODULE FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND DECREASING LENGTH OF SOLDER PIN A tilt-type heat-dissipating module for increasing heat-dissipating efficiency and decreasing length of solder pin is disposed on a circuit substrate. The tilt-type heat-dissipating module includes a substrate unit, a heat-dissipating unit and an electronic unit. The su... | 04/21/2011 |
| 20110090647 | PRINTED CIRCUIT BOARD ASSEMBLY A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating ... | 04/21/2011 |
| 20110075377 | Heat Sink Interface Having Three-Dimensional Tolerance Compensation A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink wi... | 03/31/2011 |
| 20110063802 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least ... | 03/17/2011 |
| 20110057713 | POWER MODULE The present invention provides a power module in which a first semiconductor device disposed on a first substrate and a second semiconductor device disposed on a second substrate are disposed at symmetrical positions with a third substrate interposed therebetween.... | 03/10/2011 |
| 20110051373 | CAGE HAVING A HEAT SINK DEVICE SECURED THERETO IN A FLOATING ARRANGEMENT THAT ENSURES THAT CONTINUOUS CONTACT IS MAINTAINED BETWEEN THE HEAT SINK DEVICE AND A PARALLEL OPTICAL COMMUNICATIONS DEVICE SECURED TO THE CAGE A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink dev... | 03/03/2011 |
| 20110051374 | IMAGE CAPTURING DEVICE An image capturing device a circuit base, an image sensor, a cooling member, and an elastic member. The image sensor is disposed on the circuit base. The circuit board defines a first opening covered by the image sensor. The elastic member is interposed between the circ... | 03/03/2011 |
| 20110048675 | HEAT SINK A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first ... | 03/03/2011 |
| 20110044003 | Heatsink structure An improved heatsink structure is disclosed. The present invention provides a type of heatsinks formed by stacking a plurality of particulates, in order to achieve a larger heat-dissipation surface area and higher heat-dissipation efficiency.... | 02/24/2011 |
| 20110044004 | HEAT TRANSFER APPARATUS HAVING A THERMAL INTERFACE MATERIAL A heat-transfer apparatus includes a heat-producing body, a heat sink adjacent to the heat-producing body, and a thermal interface material that includes a plurality of heat-transfer particles bridging the heat-producing body and the heat sink.... | 02/24/2011 |
