Class 361/708 - Specific chemical compound or element

Subclass of Class 361 - Electricity: electrical systems and devices
Definition: Subject matter wherein the support means is composed of
No. of applications: 38
Last issue date: 11/17/2011

Application No.	Application Title	Issue Date
20110279979	Constructions Comprising Rutile-Type Titanium Oxide; And Methods Of Forming And Utilizing Rutile-Type Titanium Oxide Some embodiments include methods of forming rutile-type titanium oxide. A monolayer of titanium nitride may be formed. The monolayer of titanium nitride may then be oxidized at a temperature less than or equal to about 550° C. to convert it into a monolayer of rutile-t...	11/17/2011
20110261535	POWER MODULE A power module includes a power module board including an insulating layer and a conductive circuit formed on the insulating layer, a power device provided on the power module board and electrically connected to the conductive circuit, and a thermal conductive sheet for...	10/27/2011
20110141698	HEAT SPREADING STRUCTURE The disclosed is a thermal interface layer disposed between a heat-generating apparatus and a thermal dissipation component. The thermal interface layer is composed of a mixture of a resin matrix and highly thermal conductive powders, wherein the resin matrix is obtaine...	06/16/2011
20100315783	HEAT SPREADER AND METHOD OF MAKING THE SAME A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z dir...	12/16/2010
20100124025	HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon...	05/20/2010
20100110637	HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES Discontinuous diamond particulate containing metal matrix composites of high thermal conductivity and methods for producing these composites are provided. The manufacturing method includes producing a thin reaction formed and diffusion bonded functionally graded interac...	05/06/2010
20100046170	COMPOSITE AVIONICS CHASSIS An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower ...	02/25/2010
20090279218	THERMAL ISOLATION OF ELECTRONIC DEVICES IN SUBMOUNT USED FOR LEDS LIGHTING APPLICATIONS The present invention relates to an electronic device for providing improved heat transporting capability for protecting heat sensitive electronics and a method for producing the same. The present invention also relates to uses of the electronic device for various appli...	11/12/2009
20090237886	SHEET STRUCTURE AND METHOD OF MANUFACTURING SHEET STRUCTURE The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear str...	09/24/2009
20090213551	INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure...	08/27/2009
20090190312	Heat transfer film, semiconductor device, and electronic apparatus A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent ...	07/30/2009
20090166852	SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the semiconductor die to a heat spreader formed by the slug. The sintering temperature ...	07/02/2009
20090154107	ONE-DIMENSIONAL HIERARCHICAL NESTED CHANNEL DESIGN FOR CONTINUOUS FEED MANUFACTURING PROCESSES A series of hierarchical channels are formed in a first member surface of a first member using a continuous-feed manufacturing process. The channels are configured to control particle stacking. The first member is pressed to a second member with a layer of particle-fill...	06/18/2009
20090122491	UNIVERSAL PATTERNED METAL THERMAL INTERFACE The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a ...	05/14/2009
20090109629	HEAT DISSIPATING DEVICE A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is receiv...	04/30/2009
20090095461	Layered Heat Spreader and Method of Making the Same A heat spreader having at least two adjoining layers each having at least two pyrolytic graphite strips cut from a sheet of pyrolytic graphite along the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z dir...	04/16/2009
20090067132	Heat spreader and method of making the same A heat spreader having at least two adjoining strips of pyrolytic graphite material is made by cutting a strip from a sheet of pyrolytic graphite in the z direction. Thermal conductivity in the xy plane of the graphite sheet is greater than in the z direction. The z dir...	03/12/2009
20090059531	Endotherm Systems and Methods Utilizing Carbohydrate In Non-Oxidizing Environment The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing a carbohydrate endotherm in an amount sufficient to effect the required heat absorption. The carbohydrate endotherm operates...	03/05/2009
20090034203	Cr-Cu ALLOY, METHOD FOR PRODUCING THE SAME, HEAT-RELEASE PLATE FOR SEMICONDUCTOR, AND HEAT-RELEASE COMPONENT FOR SEMICONDUCTOR In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 1...	02/05/2009
20080298021	Notebook computer with hybrid diamond heat spreader Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-cent...	12/04/2008
20080291634	THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification age...	11/27/2008
20080291633	PACKAGE ASSEMBLY WITH HEAT DISSIPATING STRUCTURE A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the ...	11/27/2008
20080137291	Electromagnetic interference shielding for device cooling Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to coo...	06/12/2008
20080101026	Thin, passive cooling system A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the c...	05/01/2008
20080068803	Heat dissipating device holder structure with a thin film thermal conducting medium coating In a heat dissipating device holder structure with a thin film thermal conducting medium coating, at least two thermal conducting medium coating blocks are set on attaching surfaces of a heat dissipating device holder and a processor, and a gap is disposed between the c...	03/20/2008
20070230133	Stress release thermal interfaces A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by usin...	10/04/2007
20070195501	Method of obtaining enhanced localized thermal interface regions by particle stacking Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing...	08/23/2007
20070159799	High Performance Large Tolerance Heat Sink A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil co...	07/12/2007
20070131448	Circuit board structure with heat radiating layer A circuit board structure includes a heat radiating layer that is integrally pressed to bond to a copper foil layer or a substrate for a circuit board and then machined to form a plurality of erect fins or a specific three-dimensional surface profile, so as to provide t...	06/14/2007
20070109737	Computer enclosure A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least tw...	05/17/2007
20070035930	Methods and devices for cooling printed circuit boards Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. The method can include coating a layer of diamond-like carbon (DLC) over at least a portion of the printed circuit board in order to accelerate movement o...	02/15/2007
20060146501	Thermal interface apparatus, systems, and fabrication methods An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material. ...	07/06/2006
20060146504	Method and apparatus of disabling converters in a power module A power module includes a plurality of converters having outputs for coupling to a supply voltage. The power module further includes a connector having a pin to provide a signal indicative of whether the power module is being disconnected from a system. A controller is ...	07/06/2006
20060018098	PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board A circuit board assembly includes a substantially planar shaped printed circuit board (PCB) having a first side and a second side separated by a determined thickness. At least one electrically operable component, typically an LED element, is secured to a selected one of...	01/26/2006
20050270746	Insulating structure having combined insulating and heat spreading capabilities The present invention provides an insulating structure comprising an insulating material and a heat spreading material. The invention further provides a portable electronic device comprising at least one heat generating component, an enclosure, and an insulating structu...	12/08/2005
20050111188	Thermal management device for an integrated circuit Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium. ...	05/26/2005
20050088823	VARIABLE DENSITY GRAPHITE FOAM HEAT SINK A heat sink is disclosed for directing heat away from an electronic component dissipating heat. The heat sink includes a thermally conductive base formed of a variable density graphite foam article. This graphite foam heat sink having variable foam densities provides fo...	04/28/2005
20050073816	Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink A thermal interface assembly and method for forming a thermal interface between a microelectronic component package and a heat sink having a total thermal resistance of no greater than about 0.03° C.-in²/W comprising interposing a thermal interface assembly ...	04/07/2005

PatentStorm

Bizarre Patents

PatentStorm News

Class 361/708 - Specific chemical compound or element