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| Application No. | Application Title | Issue Date |
| 20120127662 | ELECTRONIC APPARATUS AND KEYBOARD SUPPORTING MODULE THEREOF An electronic apparatus and a keyboard supporting module thereof are provided. The electronic apparatus includes a heat source, the keyboard supporting module and a push-button key module. The keyboard supporting module includes a keyboard supporting structure and an in... | 05/24/2012 |
| 20120069515 | ELECTRONIC DEVICE WITH HEAT DISSIPATION CASING An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer betwe... | 03/22/2012 |
| 20120044648 | FIXING MECHANISM FOR FIXING A THERMAL MODULE ON A BASE AND RELATED ELECTRONIC DEVICE A fixing mechanism for fixing a thermal module on a base includes a U-shaped buckling component disposed on a side of the base for buckling a thermal fin and a heat conducting block of the thermal module, and a fixing component disposed on the other side of the base and... | 02/23/2012 |
| 20120044635 | INTERNAL FRAME OPTIMIZED FOR STIFFNESS AND HEAT TRANSFER A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device.... | 02/23/2012 |
| 20120039043 | IMAGE PICKUP APPARATUS CAPABLE OF EFFICIENTLY DISSIPATING HEAT An image pickup apparatus which is capable of suppressing by efficiently dissipating heat generated by an electronic device through transmission of the heat to a heat dissipating member without adding a new member to the image pickup apparatus. A CPU 2 generates ... | 02/16/2012 |
| 20120020026 | MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectron... | 01/26/2012 |
| 20120014066 | HEAT EXCHANGER, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE HEAT EXCHANGER, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE Disclosed is a heat exchanger wherein warping (bending) of an intervening member and a frame is suppressed when the intervening member and a wall portion of the frame member having different linear expansion coefficients are welded with each other. A method for manufact... | 01/19/2012 |
| 20110310564 | IMAGE PICKUP APPARATUS AND ELECTRONIC DEVICE An image pickup apparatus that does not give a user, who grips an apparatus body with his/her hand when he/she uses the imaging apparatus or the electronic device, a sense of discomfort due to a heat, and that can efficiently diffuse heat generated from a heat source in... | 12/22/2011 |
| 20110299248 | COOLING DEVICE FOR COOLING ELECTRONIC COMPONENTS A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conduct... | 12/08/2011 |
| 20110286184 | THERMAL PACKAGING OF A MOTOR CONTROLLER FOR AN AUXILIARY POWER UNIT A starter motor controller for an auxiliary power unit transfers thermal energy from low thermal capacity electric components to high thermal capacity electric components to control temperature without active cooling systems.... | 11/24/2011 |
| 20110273846 | Substrate For Mounting Device and Package for Housing Device Employing the Same There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. | 11/10/2011 |
| 20110261534 | FIXING MECHANISM AND ELECTRONIC DEVICE UTILIZING THE SAME A fixing mechanism for fixing an object to a base plate is provided. The object defines a hole and includes a ring extending from an edge of the hole. The ring includes a threaded hole. The base plate includes a post on its top surface and respectively opposing to the h... | 10/27/2011 |
| 20110242764 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interfer... | 10/06/2011 |
| 20110205701 | RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a fir... | 08/25/2011 |
| 20110199733 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS An electro-optical device may include: an electro-optical panel, a holding member that includes a main body part arranged to surround the periphery of the electro-optical panel, and a holding part protruded from the main body part and holding the electro-optical panel, ... | 08/18/2011 |
| 20110176277 | SILICON NITRIDE SINTERED BODY, METHOD OF PRODUCING THE SAME, AND SILICON NITRIDE CIRCUIT SUBSTRATE AND SEMICONDUCTOR MODULE USING THE SAME Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silic... | 07/21/2011 |
| 20110170017 | DISPLAY DEVICE AND TELEVISION RECEIVER A display device includes a display panel 11, a holding member 50, a circuit board 18 and a heat-transfer member 60. The display panel 11 is configured to display images. The holding member 50 holds the display panel 11. ... | 07/14/2011 |
| 20110157832 | ELECTRONIC DEVICE According to one embodiment, the electronic device includes: a heating element that has: a first electronic part; and a plurality of connection terminals provided around the first electronic part; a first circuit board that has: a first surface; a second surface opposit... | 06/30/2011 |
| 20110149519 | APPARATUS AND METHOD FOR EMBEDDING COMPONENTS IN SMALL-FORM-FACTOR, SYSTEM-ON-PACKAGES According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer havin... | 06/23/2011 |
| 20110141697 | DISPLAY APPARATUS (amended Provided is a display apparatus including a display panel for displaying an image, a heat source arranged at a side surface of at least one side of the display panel, a heat absorbing section for absorbing heat generated by the heat source, a back surface plate arranged... | 06/16/2011 |
| 20110141696 | THERMAL MATCHING IN SEMICONDUCTOR DEVICES USING HEAT DISTRIBUTION STRUCTURES Embodiments described herein provide a chip, comprising a first device on a substrate and a second device on the substrate. The chip further comprises a heat distribution structure in thermal proximity to the first device and the second device, wherein the heat distribu... | 06/16/2011 |
| 20110141692 | CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY A conduction cooled circuit board assembly may include a frame and at least one circuit board attached to the frame, having at least one area to be cooled. The assembly may also include at least one rail attached to the frame, and at least one heat pipe having a first e... | 06/16/2011 |
| 20110141695 | ELECTRONIC DEVICE According to one embodiment, an electronic device includes a circuit board, a heat generating element, a heat dissipater, and a pushing member. The circuit board is housed in a housing. The heat generating element is mounted on the circuit board. The heat dissipator is ... | 06/16/2011 |
| 20110134608 | SEMICONDUCTOR DEVICE A semiconductor apparatus 10 includes a radiator 30 on which plural semiconductor modules 20 that include semiconductor elements 21 are mounted, the semiconductor apparatus 10 characterized by the radiator 30 including a first m... | 06/09/2011 |
| 20110110045 | LIQUID CRYSTAL DISPLAY DEVICE A liquid crystal display device includes a liquid crystal display panel and a backlight disposed at the back of the liquid crystal display panel. The backlight includes a frame, a light source, a reflective sheet, and a heat dissipating plate formed in a rectangular sha... | 05/12/2011 |
| 20110096506 | MULTI-LAYER SOC MODULE STRUCTURE A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically conne... | 04/28/2011 |
| 20110090647 | PRINTED CIRCUIT BOARD ASSEMBLY A printed circuit board assembly includes a printed circuit board, a first heat dissipating module, and a second heat dissipating module. The printed circuit board includes a first heat generating element and a second heat generating element. The first heat dissipating ... | 04/21/2011 |
| 20110090648 | ELECTRONIC PACKAGE STRUCTURE An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead fra... | 04/21/2011 |
| 20110075375 | TUNER MODULE CAPABLE OF PREVENTING A HEAT CONDUCTIVE SHEET FROM ARISING A tuner module includes a circuit board, an electronic component, mounted on the circuit board, for demodulating a high frequency reception signal received from an antenna unit to produce a speech signal, a metal case accommodating the circuit board and the electronic c... | 03/31/2011 |
| 20110075376 | Module substrate radiating heat from electronic component by intermediate heat transfer film and a method for manufacturing the same A module substrate having a heat-generative electronic component mounted thereon includes first and second dielectric substrates and an intermediate heat transfer film. The heat-generative electronic component is flip-chip bonded on a wiring layer formed on the main sur... | 03/31/2011 |
| 20110069503 | Shape Forming Heat Sink With Flexible Heat Rod A conforming heat dissipating structure transfers heat to an irregular surface from a heat source mounted on its bottom surface. The heat dissipating structure includes an open container filled with metal shavings and balls covered by a flexible retainer. The shavings a... | 03/24/2011 |
| 20110032677 | DISTRIBUTED COMPUTING On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between t... | 02/10/2011 |
| 20110013365 | ELECTRONIC CONTROL UNIT An electronic control unit includes a circuit board, multiple circuit patterns, multiple semiconductor devices, multiple leads, and at least one thermal-conduction limiting portion. Each of the semiconductor devices is installed to the corresponding circuit pattern form... | 01/20/2011 |
| 20100321893 | Heat Dissipation Packaging for Electrical Components The emphasis for transporting heat energy to ambient in an efficient manner is critical for many semiconductor components to maintain highest performance. A heat dissipation system with low thermal resistance for the packaging of high power electrical components, and th... | 12/23/2010 |
| 20100321891 | Avionics Chassis An avionics chassis comprises a carbon fiber reinforced housing, a card rail for holding an electronic circuit board mounted to an interior surface of the housing, at least one heat-dissipating fin composed of carbon fiber and extending from the outer surface of the hou... | 12/23/2010 |
| 20100321892 | Avionics Chassis An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprisin... | 12/23/2010 |
| 20100309631 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interfer... | 12/09/2010 |
| 20100290192 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS A COF includes, in at least one embodiment, a heat dissipating material on a back surface of an insulating film. The heat dissipating material has a slit for reducing a degree of thermal expansion. Thus, at least one embodiment of the invention provides the COF in which... | 11/18/2010 |
| 20100271783 | ELECTRO-OPTIC DEVICE AND ELECTRONIC DEVICE An electro-optic device includes an electro-optic panel and a holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered by an adhesive. In the electro-optic device, a groove portion to be filled up... | 10/28/2010 |
| 20100271782 | ELECTRO-OPTIC DEVICE AND ELECTRONIC DEVICE An electro-optic device includes an electro-optic panel, a first holding member that holds the electro-optic panel, and a second holding member provided with a heat emitting portion on the side opposite to a surface to which the electro-optic panel is adhered. In the el... | 10/28/2010 |
