Celebrity Inventors
Comic actor Danny Kaye received patent D166,807 for the co-design of "Blowout Toy or the Like". It's similar to one of those toys that unravels when you blow into at a birthday party except Kaye's has three blowouts going in different directions, not just one.
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| Application No. | Application Title | Issue Date |
| 20120106085 | VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE A vacuum sealed package includes a package main body portion in which a first main body portion and a second main body portion are bonded via a hollow portion, and a getter material and an electronic device that are provided within the hollow portion, and in the state o... | 05/03/2012 |
| 20110242764 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interfer... | 10/06/2011 |
| 20110228482 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. Dur... | 09/22/2011 |
| 20110228481 | THERMALLY CONDUCTIVE INTERFACE MEANS A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat source... | 09/22/2011 |
| 20110194254 | POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or ure... | 08/11/2011 |
| 20110188206 | THERMAL INTERFACE Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion betwee... | 08/04/2011 |
| 20110176276 | CTE-MATCHED HEAT PIPE Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon s... | 07/21/2011 |
| 20110063801 | ELECTRONIC DEVICE WITH A HEAT INSULATING STRUCTURE An electronic device includes a circuit board and a heat insulating structure. The heat insulating structure includes a heat source, an enclosure for covering the heat source, and a heat insulating plate disposed on a side of the enclosure facing to the heat source for ... | 03/17/2011 |
| 20100320187 | Heat Sink and Thermal Plate Apparatus for Electronic Components An apparatus for dissipating heat from and providing heat to electronic components includes a thermally conductive member having a surface configured to thermally couple with electronic components of an adjacent processing module, and a heating member embedded in the th... | 12/23/2010 |
| 20100309631 | ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interfer... | 12/09/2010 |
| 20100296253 | METHOD OF FORMING CARBON PARTICLE-CONTAINING FILM, HEAT TRANSFER MEMBER, POWER MODULE, AND VEHICLE INVERTER A method of depositing a carbon particle-containing film that contains carbon particles includes: manufacturing film deposition slurry by mixing liquid into film deposition powder that contains carbon powder formed of the carbon particles; and depositing the carbon part... | 11/25/2010 |
| 20100254092 | DEVICE AND METHOD FOR MITIGATING RADIO FREQUENCY INTERFERENCE Embodiments of the present invention describe a device and method of mitigating radio frequency interference (REI) in an electronic device. The electronic device comprises a housing, and a thermal energy storage material is formed in the housing. By increasing the loss ... | 10/07/2010 |
| 20100246133 | METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. Dur... | 09/30/2010 |
| 20100124024 | ELECTRONIC SUBSTRATE DEVICE This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic ... | 05/20/2010 |
| 20100124023 | METHOD FOR PLATING FILM ON A HEAT DISSIPATION MODULE A method for plating film on a heat dissipation module includes the steps of: cleaning the heat dissipation module; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby plati... | 05/20/2010 |
| 20100085713 | LATERAL GRAPHENE HEAT SPREADERS FOR ELECTRONIC AND OPTOELECTRONIC DEVICES AND CIRCUITS A device and associated method of heat removal from electronic optoelectronic and photonic devices via incorporation of extremely high thermally conducting channels or embedded layers made of single-layer graphene (SLG), bi-layer graphene (BLG), or few-layer graphene (F... | 04/08/2010 |
| 20100020497 | SUBSTRATE STRUCTURE It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The su... | 01/28/2010 |
| 20090296349 | COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME According to one embodiment, a component-embedded printed circuit board includes an opening for member fixation provided on part of a peripheral edge of an outer layer side of the first substrate, a metal member for heat radiation laminated to outer layer side, except f... | 12/03/2009 |
| 20090262503 | Control Device A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted ... | 10/22/2009 |
| 20090251866 | ELECTRICAL CONFIGURATION AS HEAT DISSIPATION DESIGN An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically an... | 10/08/2009 |
| 20090213304 | SYSTEM FOR THERMALLY CONTROLLING DISPLAYS Exemplary embodiments provide a system for thermally controlling an electronic display. A glass substrate containing a pyrolytic electrically conductive layer is utilized. The electrically conductive layer may be used as a passive thermal insulator or may be electricall... | 08/27/2009 |
| 20090166854 | Thermal Interface with Non-Tacky Surface A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cro... | 07/02/2009 |
| 20090154106 | DOUBLE BONDED HEAT DISSIPATION Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.... | 06/18/2009 |
| 20090122490 | Heat Sink Having Enhanced Heat Dissipation Capacity A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heat... | 05/14/2009 |
| 20090109629 | HEAT DISSIPATING DEVICE A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is receiv... | 04/30/2009 |
| 20090040727 | Circuit Carrier Structure with Improved Heat Dissipation A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end... | 02/12/2009 |
| 20090009973 | Nanotube-Based Fluid Interface Material and Approach A thermal interface material (130) facilitates heat transfer between an integrated circuit device (120) and a thermally conductive device (140). According to an example embodiment, a thermal interface material (130) includes carbon nanotube m... | 01/08/2009 |
| 20080304238 | ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement... | 12/11/2008 |
| 20080298021 | Notebook computer with hybrid diamond heat spreader Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-cent... | 12/04/2008 |
| 20080225490 | Thermal interface materials In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a lo... | 09/18/2008 |
| 20080198553 | ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE COMPONENT AND MEMBER A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the e... | 08/21/2008 |
| 20080156457 | Thermally coupling an integrated heat spreader to a heat sink base The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire ... | 07/03/2008 |
| 20080128122 | METHOD FOR MAKING A THERMAL INTERFACE MATERIAL A thermal interface material includes a matrix, a plurality of carbon nanotubes, and at least one phase change layer. The matrix includes a first surface and an opposite second surface. The carbon nanotubes are embedded in the matrix uniformly. The carbon nanotubes exte... | 06/05/2008 |
| 20080117599 | PORTABLE ELECTRONIC DEVICE A portable electronic device includes a heat source which generates heat in association with generating, charging, or consuming electric power. A housing base member is disposed in proximity to the heat source, and a radiation film is disposed on at least a portion of a... | 05/22/2008 |
| 20080068803 | Heat dissipating device holder structure with a thin film thermal conducting medium coating In a heat dissipating device holder structure with a thin film thermal conducting medium coating, at least two thermal conducting medium coating blocks are set on attaching surfaces of a heat dissipating device holder and a processor, and a gap is disposed between the c... | 03/20/2008 |
| 20080024992 | Thermal Docking Station For Electronics For transferring heat generated by an electronic device, a component heat exchanger is thermally coupled to the electronic device. A component-side thermal interface is thermally coupled to the component heat exchanger by a heat conductor. A rack-side thermal interface ... | 01/31/2008 |
| 20080019098 | Diamond composite heat spreader and associated methods A diamond composite heat spreader includes a plurality of discrete and packed diamond particles. The heat spreader further includes sintered polycrystalline diamond dispersed throughout the plurality of diamond particles. The sintered polycrystalline diamond at least pa... | 01/24/2008 |
| 20070289730 | Combination heat-transfer plate member A combination heat-transfer plate member for use with a heat sink to dissipate heat from a CPU is disclosed having a flat graphite base member and two metal sheet members respectively bonded to the top and bottom sides of the flat graphite base member.... | 12/20/2007 |
| 20070235177 | Heat conducting medium protection device A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting me... | 10/11/2007 |
| 20070237896 | Recyclable protective cover for a heat-conductive medium A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and a... | 10/11/2007 |
