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Vehicular Impact Signaling Device
An apparatus for the deployment of a visible plume to alert other motorists that a proximate motor vehicle has been involved in a collision.
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| Application No. | Application Title | Issue Date |
| 20120127665 | HEAT SINK ASSEMBLY FOR A PLUGGABLE MODULE A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder exten... | 05/24/2012 |
| 20120127654 | COMPUTER SYSTEM AND HEAT SINK A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second hea... | 05/24/2012 |
| 20120127669 | DEVICE MOUNTING SYSTEMS AND METHODS A device mounting system is provided. The device 720 can include a plurality of device mounting posts 730, 740. The system can further include a transition member 100 including an transition mounting feature 150 and at least one receiver 1... | 05/24/2012 |
| 20120069523 | SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings... | 03/22/2012 |
| 20120050995 | HEAT DISSIPATION DEVICE AND CIRCUIT BOARD ASSEMBLY A heat dissipation device includes a heat sink, and a mount mounted on a circuit board. The heat sink includes a base, a number of fins and a post extending from opposite sides of the base. The mount includes a number of arc-shaped fixing tabs extending from the circuit... | 03/01/2012 |
| 20120050994 | FLEXIBLE-TO-RIGID TUBING A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic c... | 03/01/2012 |
| 20120045086 | ELECTRONIC DEVICE WITH TOUCH FUNCTION An electronic device with touch function includes a back casing, a front casing, a display panel and a touch panel. The front casing is combined with the back casing so as to form an accommodating space. The display panel is disposed in the accommodating space. The touc... | 02/23/2012 |
| 20120038849 | Expanded Heat Sink for Electronic Displays and Method of Producing the Same An expanded heat sink for transferring heat from an electronic display component to a path of cooling air is disclosed. A continuous sheet may define a series of channels where the cooling air is blown through the channels and along the continuous sheet. When viewed alo... | 02/16/2012 |
| 20120039041 | HEAT MANAGEMENT USING POWER MANAGEMENT INFORMATION A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being p... | 02/16/2012 |
| 20120033384 | GRAPHITE WRAPPED HEAT SPREADING PILLOW A cooling device and method for dissipating heat from a heat-generating component to a surface or object with high heat capacity, thereby reducing the formation of localized temperature buildup, is disclosed. In one embodiment, the cooling device includes a highly condu... | 02/09/2012 |
| 20120026770 | POWER CONVERTER WITH LINEAR DISTRIBUTION OF HEAT SOURCES A power converter design is disclosed with a novel approach to thermal management which enhances the performance and significantly reduces the cost of the converter compared to prior art power converters. The invention minimizes the heating of one power component by ano... | 02/02/2012 |
| 20120020025 | COOLING STRUCTURE OF CAPACITOR AND INVERTER DEVICE A cooling structure of a capacitor includes a snubber capacitor in which lead terminals are joined to external electrodes of a laminated ceramic electronic component; a circuit board which is for mounting the snubber capacitor and semiconductor switching elements; and a... | 01/26/2012 |
| 20110310312 | TELEVISION APPARATUS AND ELECTRONIC DEVICE According to one embodiment, a television apparatus includes a main body, a housing, an exothermic component, and a heat transfer mechanism. The main body has a display screen, and is used in a first orientation where one side of the display screen is positioned on the ... | 12/22/2011 |
| 20110310556 | INTERNAL DEVICE ARRANGEMENT FOR A PASSENGER CABIN An internal device arrangement for a passenger cabin, for example of an aircraft, comprises an internal device element (15) which is selected from a group consisting of wall panelling, window panel, side panel, ceiling panelling and luggage compartment; an electr... | 12/22/2011 |
| 20110310562 | THERMAL INTERFACE MATERIAL ASSEMBLIES, AND RELATED METHODS A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering... | 12/22/2011 |
| 20110310563 | CLAMP-TYPE HEAT SINK FOR MEMORY A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dis... | 12/22/2011 |
| 20110310567 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member conn... | 12/22/2011 |
| 20110304989 | SUBSTRATE UNIT AND ELECTRONIC DEVICE According to one embodiment, a substrate unit includes an electronic circuit substrate which includes a first width dimension portion, and a second width dimension portion continuous with the front direction side of the first width dimension portion. A first concave por... | 12/15/2011 |
| 20110299249 | HEAT SINK MOUNTING FRAME APPLICABLE TO A VARIETY OF CIRCUIT BOARDS An exemplary heat sink mounting frame is for mounting a heat sink onto a circuit board. The heat sink mounting frame includes a circular guide rail, and mounting arms movably connected with and extending radially and outwardly from the guide rail. Each mounting arm incl... | 12/08/2011 |
| 20110299250 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connecti... | 12/08/2011 |
| 20110299251 | LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radi... | 12/08/2011 |
| 20110292605 | HEAT-DISSIPATING HINGE AND A PORTABLE ELECTRONIC DEVICE WITH THE SAME A portable electronic device has a cover, a base and a heat-dissipating hinge. The heat-dissipating hinge has a cam and a foot. The cam is attached to the cover. The foot abuts the cam and protrudes out of the base. When the cover is opened, the cam is rotated to push t... | 12/01/2011 |
| 20110292609 | LIGHTWEIGHT AUDIO SYSTEM FOR AUTOMOTIVE APPLICATIONS AND METHOD A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radi... | 12/01/2011 |
| 20110273847 | ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to... | 11/10/2011 |
| 20110267778 | Apparatus for Supplying Voltage to a Motor Vehicle Having Optimized Heat Dissipation A voltage supply apparatus for a motor vehicle, especially a passenger car, truck or a motorcycle, includes a storage cell arrangement having one or more electrochemical storage cells and/or double layer capacitors that are mounted on top of each other. The storage cell... | 11/03/2011 |
| 20110261532 | HEAT DISSIPATION DEVICE WITH SELF-LOCKING BASE A heat dissipation device for dissipation of heat from an electronic component includes a base for contacting the electronic component, a shroud connected to the base and multiple fins arranged on the bottom section of the shroud. The shroud comprises a bottom section d... | 10/27/2011 |
| 20110249406 | HEAT DISSIPATION SYSTEM FOR ELECTRICAL COMPONENTS The present invention relates to a system for dissipating heat for one or more electrical components. A first solid heat dissipation structure is connected to a heatsink connection pad of the component while a second heat dissipation structure surrounds the first struct... | 10/13/2011 |
| 20110249404 | MOUNTING APPARATUS AND MOUNTING ASSEMBLY FOR HEAT DISSIPATING COMPONENT A mounting apparatus includes a support, a first lever and a second lever. A first pair and a second pair of positioning portions are located on the support. A first hook portion and a second hook portion are located on the support and bent towards each other. The first... | 10/13/2011 |
| 20110249405 | HEAT DISSIPATING MEMBER, ELECTROOPTIC DEVICE AND ELECTRONIC APPARATUS A heat dissipating member is formed so as to be opposed to a reflection type liquid crystal panel. The heat dissipating member includes a heat receiving portion that is opposed to a reflection type light modulation element and has a heat receiving surface for receiving ... | 10/13/2011 |
| 20110242763 | ELECTRO-OPTICAL DEVICE AND ELECTRONIC APPARATUS An electro-optical device includes: an element substrate and an opposing substrate disposed so as to oppose each other; liquid crystals encapsulated and sealed between the two substrates; a display region that displays an image by modulating incident light based on imag... | 10/06/2011 |
| 20110242762 | ELECTRONIC APPARATUS INCLUDING ELECTRONIC COMPONENT SERVING AS HEAT-GENERATING SOURCE An electronic apparatus having a heat-dissipating structure capable of efficiently releasing heat generated at electronic components to the outside, superior in work efficiency at the time of assembly, and capable of avoiding misalignment in the electronic components. T... | 10/06/2011 |
| 20110228480 | Heat-dissipating apparatus and electronic device having the same A heat-dissipating apparatus is installed on a circuit board which includes a board body formed with a plurality of apertures, a heat-generating element, and a lock member having an engaging hole. The heat-dissipating apparatus includes a base plate and a plurality of f... | 09/22/2011 |
| 20110228474 | ADVANCED MEZZANINE CARD FOR HOSTING A PMC OR XMC A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space the... | 09/22/2011 |
| 20110222244 | POWER CONDITIONER DEVICE AND MODULE SUBSTRATE STRUCTURE USING THE SAME When raising the DC power supplied from a solar cell or a fuel cell by using a DC/DC converter circuit and converting to the AC power by using an inverter circuit, an electronic circuit such as the DC/DC converter circuit and the inverter circuit, and a CPU for controll... | 09/15/2011 |
| 20110216545 | CONNECTING SYSTEM FOR IMPLEMENTING BRANCHES ON CONTINUOUS CONDUCTORS A housing for connecting a plurality of branch lines to the insulated conductors of an intermediate portion of a cable from which the outer sheath layer has been removed, comprising a rectangular base member containing an open-topped base chamber, and a pair of opposed ... | 09/08/2011 |
| 20110216506 | HEAT SINK BUCKLE A heat sink buckle is provided. The heat sink buckle includes a frame and a side plate. The frame includes a plurality of frame sides. The side plate is substantially perpendicular with the frame, and is configured extending from one of the frame sides. A central portio... | 09/08/2011 |
| 20110211313 | CARBON NANOTUBES FOR THE SELECTIVE TRANSFER OF HEAT FROM ELECTRONICS Under one aspect, a method of cooling a circuit element includes providing a thermal reservoir having a temperature lower than an operating temperature of the circuit element; and providing a nanotube article in thermal contact with the circuit element and with the rese... | 09/01/2011 |
| 20110205709 | SANDWICH STRUCTURE WITH DOUBLE-SIDED COOLING AND EMI SHIELDING A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure... | 08/25/2011 |
| 20110205711 | HEAT DISSIPATION FROM A CONTROL UNIT A control unit, in particular for a motor vehicle, the control unit having a housing, which has at least one heat dissipating area in which at least one electrical and/or electronic module having at least one heat dissipating element is situated, it being provided that ... | 08/25/2011 |
| 20110199732 | ELECTRONIC SUBSTRATE DEVICE This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate. An electronic ... | 08/18/2011 |
