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| Application No. | Application Title | Issue Date |
| 20110267776 | CONDUCTION-COOLED APPARATUS AND METHODS OF FORMING SAID APPARATUS A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an out... | 11/03/2011 |
| 20110188205 | ACTIVE ANTENNA ARRAY HEATSINK An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection ... | 08/04/2011 |
| 20110187188 | REDUNDANT POWER SUPPLY DEVICE A redundant power supply device, particularly the one without installing a heat dissipating fan, includes a chassis having at least one power input accommodating space and a plurality of power output accommodating spaces, a back panel device comprising a back panel, whi... | 08/04/2011 |
| 20110080709 | Digital Signage Player A digital signage player is provided. The digital signage player includes a body having a main board and a hard disk, an outer frame in which the body is framed, and a heat dissipation unit disposed in the body. The digital signage player of the present invention can be... | 04/07/2011 |
| 20110044001 | COOLING DEVICE FOR A PLURALITY OF POWER MODULES The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. Said cooling device comprises external cooling ribs (14) on a first housing shell of the body thro... | 02/24/2011 |
| 20110032676 | POWER INVERTER Water paths for feeding a coolant water through a power converter mounted on an automobile are arranged in parallel, openings are formed on the water paths respectively, heat radiating fins project from the openings, and the openings are closed by a base plate of the po... | 02/10/2011 |
| 20100328893 | COOLING DEVICE FOR SEMICONDUCTOR ELEMENT MODULE AND MAGNETIC PART A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling... | 12/30/2010 |
| 20100182751 | Heat Sink A system for removing heat from an electronic component associated with an information handling system is disclosed. The system may comprise a mass providing a heat sink to the electronic component and a set of extended surfaces for transferring heat from the mass. The ... | 07/22/2010 |
| 20100139997 | ELECTRICAL APPARATUS, COOLING SYSTEM THEREFOR, AND ELECTRIC VEHICLE An inverter apparatus includes a liquid path in which cooling water flows, and in which the cooling water performs cooling at a cooling part located directly underneath the power circuit part of the inverter apparatus. The liquid path includes a first partial structure ... | 06/10/2010 |
| 20100128437 | AUTOMOTIVE INVERTER ASSEMBLY In an embodiment, an automotive inverter assembly has at least one component for cooling. The inverter assembly has a supporting body for supporting the at least one component. The supporting body defines at least part of a volume through which flows a cooling fluid cou... | 05/27/2010 |
| 20100097763 | HEAT DISSIPATION DEVICE A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly... | 04/22/2010 |
| 20100079955 | Microfins for cooling an ultramobile device The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.... | 04/01/2010 |
| 20100079956 | POWER TRANSDUCER A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals... | 04/01/2010 |
| 20100073876 | HEAT DISSIPATION DEVICE A heat dissipation device includes a base, a first fin unit and two second fin units arranged on the base. The base has a substrate and two parallel heat spreaders extending integrally and perpendicularly from the substrate. The first fin unit is arranged on the substra... | 03/25/2010 |
| 20100061060 | HEAT-DISSIPATING DEVICE A heat-dissipating device includes a heat sink, a heat-dissipating fan, and a first air guide hood. The heat sink includes a base, and a plurality of interconnected heat-dissipating fins provided on the base. Each adjacent pair of the heat-dissipating fins defines an ai... | 03/11/2010 |
| 20100002392 | Assembled Heat Sink Structure The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower... | 01/07/2010 |
| 20090316362 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE A heat dissipation device adapted for dissipating heat from a heat-generating electronic element, includes a plurality of fins assembled together. Each of the fins has a rectangular body and four arch-shaped flanges extending from edges of the body to form four round co... | 12/24/2009 |
| 20090316360 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing ... | 12/24/2009 |
| 20090290305 | ENTRAINMENT HEATSINK USING ENGINE BLEED AIR An entrainment heatsink system and method using distributed micro jets. Such a system and/or method utilize a pressurized primary flow through arrays of micro nozzles to entrain a much larger secondary flow to carry heat away from the heatsink. The bleed air from an air... | 11/26/2009 |
| 20090262505 | Heat radiator A heat radiator is in the form of a rectangular body having two opposite longer sides and two opposite shorter sides, and includes a contact section located at an end surface of the heat radiator for contacting with a heat source and having at least one extension wall o... | 10/22/2009 |
| 20090244840 | Electronic device An electronic device is provided that includes a first component generating heat, a second component to be heated, a heating part configured to heat the second component, and a case containing the first component, the second component, and the heating part. The second c... | 10/01/2009 |
| 20090180256 | HEAT-DISSIPATING MODULE HAVING A DUST REMOVING MECHANISM, AND ASSEMBLY OF AN ELECTRONIC DEVICE AND THE HEAT-DISSIPATING MODULE In an assembly of an electronic device and a heat-dissipating module, the electronic device includes an electronic component disposed within a housing provided with an air outlet port, and the heat-dissipating module includes a heat-dissipating fin base disposed within ... | 07/16/2009 |
| 20090159254 | HEAT SINK ASSEMBLY AND METHOD OF FABRICATING A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the h... | 06/25/2009 |
| 20090154105 | HEAT DISSIPATION DEVICE AND A METHOD FOR MANUFACTURING THE SAME A heat dissipation device and a method for fabrication thereof are disclosed. The heat dissipation device includes a heat sink having a base, and a heat pipe embedded in the base. A groove is defined in the base. The groove is enclosed by a top surface and two sidewalls... | 06/18/2009 |
| 20090109623 | HEAT-RADIATING MODULE WITH COMPOSITE PHASE-CHANGE HEAT-RADIATING EFFICIENCY The present invention provides a heat-radiating module with composite phase-change heat-radiating efficiency. The cooling pad of the heat-radiating module is fitted with a heating portion and radiating portion. The first and second chambers are placed at intervals into ... | 04/30/2009 |
| 20090052138 | Wing-spanning thermal-dissipating device A wing-spanning thermal-dissipating device has a plurality of thermal-dissipating sheets. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions ... | 02/26/2009 |
| 20090040716 | FLUID-TO-FLUID SPOT-TO-SPREADER HEAT MANAGEMENT DEVICES AND SYSTEMS AND METHODS OF MANAGING HEAT Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like.... | 02/12/2009 |
| 20090040726 | Vapor chamber structure and method for manufacturing the same A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum ch... | 02/12/2009 |
| 20090034197 | HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME A heatsink comprises a base (110, 210, 310), a fin (120, 220, 320) attached to the base, and a piezoelectric patch (130, 230, 330) attached to the fin. The piezoelectric patch causes the fin to oscillate, thus generating air circulation near the fin... | 02/05/2009 |
| 20080247137 | Cooling System For Electronic Devices, In Particular, Computers The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator (1), a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a b... | 10/09/2008 |
| 20080197727 | Heat Sink For Electronic Components of a Rotating Electric Machine A dissipator for discharging heat from electronic components, the electronic components being intended for the functioning of a rotary electrical machine, the rotary electrical machine comprising a rear bearing, the dissipator comprising a top face and a bottom face int... | 08/21/2008 |
| 20080192433 | INTERFACE MODULE-MOUNTED LSI PACKAGE An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in co... | 08/14/2008 |
| 20080192435 | IMAGING DEVICE MODULE AND PORTABLE ELECTRONIC APPARATUS UTILIZING THE SAME In an imaging device module according to the invention, an opening is provided in an FPC board accommodated in an apparatus chassis. An insulating sheet of an imaging device is mounted opposite the opening on the FPC board. In a configuration of the imaging device modul... | 08/14/2008 |
| 20080158820 | HEAT DISSIPATION DEVICE FOR COMPUTER ADD-ON CARDS A heat dissipation device (100) is mounted on a heat-generating device (12) of a graphics card (10) and comprises a heat sink (20), a fan (30), a cover (40) and a heat pipe (50). The heat sink (20) has a base (2... | 07/03/2008 |
| 20080130232 | HEAT SINK A heat sink is provided that can prevent the velocity of air flowing between fins in the vicinity of the component mounting space from decreasing. In the heat sink, a plurality of fins and the component mounting space are disposed on a fin unit side of the base. A later... | 06/05/2008 |
| 20080068802 | Heatsink device with vapor chamber A heatsink device with vapor chamber is provided. The heatsink device with vapor chamber has a lid, a heat dissipation base attached to the heat generating component, and a heat conductive powder. The lid is bonded to the heat dissipation base to form an inclosed accomm... | 03/20/2008 |
| 20080055857 | Method for connecting heat pipes and a heat sink A method for connecting heat pipes and a heat sink comprises the steps of drilling a set of through holes through a heat dissipating base slab, implanting heat pipes through the through holes, integrating the heat-dissipating base slab with the heat pipes by punching us... | 03/06/2008 |
| 20080048535 | CONTROLLER FOR A DIRECT CURRENT BRUSHLESS MOTOR Taught herein is a controller for a DC brushless motor comprising a control board (3) and a housing (4); wherein the control board (3) is disposed in the housing (4), and the housing (4) is made of metal materials with good thermal con... | 02/28/2008 |
| 20080030957 | HEATSINK METHOD AND APPARATUS A heatsink having tapered geometry that improves passive cooling efficiency is discussed. A tapered geometry between heatsink heat dissipation elements, as a function of distance along a z-axis opposing gravity, decreases resistance to rarification of passively flowing ... | 02/07/2008 |
| 20070127212 | Mechanical Housing An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and ... | 06/07/2007 |
