Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Application No. | Application Title | Issue Date |
| 20120106084 | Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-lik... | 05/03/2012 |
| 20120069522 | THERMAL MODULE AND ELECTRONIC DEVICE INCORPORATING THE SAME An electronic device includes a circuit board and a thermal module mounted thereon. The circuit board has a heat-generating chip and an electromagnetic interference (EMI) source mounted thereon. The thermal module includes a shielding cover and a heat conducting member.... | 03/22/2012 |
| 20120050985 | ELECTRONIC DEVICE HAVING COOLING STRUCTURE An electronic device having a heat dissipating component is provided. The electronic device includes a circuit board, a heat pipe which is disposed on a first side of the circuit board, a heat generating device which is disposed on a second side of the circuit board opp... | 03/01/2012 |
| 20120050993 | Cooling System for Onboard Electrical Power Converter, and Electrical Power Converter for Railway Vehicle A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation s... | 03/01/2012 |
| 20120044641 | ELECTRONIC DEVICE An electronic device includes an enclosure. The enclosure includes a main body and a cover attached to the main body. A first air intake and a second air outlet are defined in the cover. A first heat device and a circuit board are attached to the main body. The first he... | 02/23/2012 |
| 20120026691 | APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT FROM A LIQUID-COOLED ELECTRONICS RACK Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid co... | 02/02/2012 |
| 20110317367 | LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling i... | 12/29/2011 |
| 20110292608 | HEAT DISSIPATION DEVICE An exemplary heat dissipation device includes first and second heat sinks adapted for being thermally attached to first and second electronic components, respectively; and a heat pipe thermally interconnecting the first heat sink with the second heat sink.... | 12/01/2011 |
| 20110286184 | THERMAL PACKAGING OF A MOTOR CONTROLLER FOR AN AUXILIARY POWER UNIT A starter motor controller for an auxiliary power unit transfers thermal energy from low thermal capacity electric components to high thermal capacity electric components to control temperature without active cooling systems.... | 11/24/2011 |
| 20110279978 | COOLING DEVICE A cooling device of the present invention includes: a substrate having a first surface which supports an electronic component and a second surface on an opposite side to the first surface; a container which can form a space between itself and the second surface of the s... | 11/17/2011 |
| 20110261532 | HEAT DISSIPATION DEVICE WITH SELF-LOCKING BASE A heat dissipation device for dissipation of heat from an electronic component includes a base for contacting the electronic component, a shroud connected to the base and multiple fins arranged on the bottom section of the shroud. The shroud comprises a bottom section d... | 10/27/2011 |
| 20110249403 | ELECTRONIC APPARATUS According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plat... | 10/13/2011 |
| 20110235277 | HEAT PIPE CAPABLE OF TRANSFORMING DYNAMIC ENERGY INTO ELECTRIC ENERGY AND RELATED HEAT-DISSIPATING MODULE A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a ... | 09/29/2011 |
| 20110216505 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, <... | 09/08/2011 |
| 20110182033 | DEVICE FOR COOLING AN ELECTRONIC CARD BY CONDUCTION COMPRISING HEAT PIPES, AND CORRESPONDING METHOD OF FABRICATION In a device for cooling an electronic circuit board comprising at least one component covered with an exchanger cover, the device includes a heat sink covering all or some of the electronic circuit board, and at least one heat pipe per component, each heat pipe being ca... | 07/28/2011 |
| 20110170264 | Semiconductor Module Socket Apparatus A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the s... | 07/14/2011 |
| 20110157831 | LOCKING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME AND HEAT DISSIPATION DEVICE USING THE SAME A locking structure for assembling a first component to a second component. The locking structure includes a nut embedded into the first component and a bolt. The nut defines a groove in a circumferential periphery thereof. The first component forms a protrusion engagin... | 06/30/2011 |
| 20110149516 | ELECTRONIC SYSTEM AND HEAT DISSIPATION DEVICE THEREOF A heat dissipation device for an electronic component mounted on a circuit board includes a heat pipe and a fastening assembly. The heat pipe includes an evaporation section and a condensation section. The fastening assembly includes a retention plate and a wire clip. T... | 06/23/2011 |
| 20110149517 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b... | 06/23/2011 |
| 20110141692 | CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY A conduction cooled circuit board assembly may include a frame and at least one circuit board attached to the frame, having at least one area to be cooled. The assembly may also include at least one rail attached to the frame, and at least one heat pipe having a first e... | 06/16/2011 |
| 20110122584 | ELECTRONIC APPARATUS According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first porti... | 05/26/2011 |
| 20110110042 | ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATION DEVICE An exemplary electronic device assembly includes a printed circuit board with an electronic component thereon, and a heat dissipation device. The heat dissipation device includes a heat sink mounted on the printed circuit board and a heat pipe pivotably engaged with the... | 05/12/2011 |
| 20110103018 | INTEGRATED ANTENNA STRUCTURE WITH AN EMBEDDED COOLING CHANNEL According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of... | 05/05/2011 |
| 20110096502 | PRINTED CIRCUIT BOARD ASSEMBLY A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating ... | 04/28/2011 |
| 20110080711 | POWER-ELECTRONIC ARRANGEMENT A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channe... | 04/07/2011 |
| 20110075369 | ELECTRONIC DEVICE An electronic device including a heat generation element, a heat dissipation plate, and a heat pipe is provided. The heat dissipation plate includes a top surface, a bottom surface, a pair of longitudinal side surfaces, and a pair of lateral side surfaces including a th... | 03/31/2011 |
| 20110075360 | ELECTRONIC APPARATUS According to one embodiment, an electronic apparatus includes a housing, a heat dissipating member disposed inside the housing, a first heat generating element mounted on the circuit board, a second heat generating element mounted on the circuit board, a first heat pipe... | 03/31/2011 |
| 20110075370 | PRESSING MEMBER, PRESSING STRUCTURE FOR HEAT RECEIVING BLOCK OF SUBSTRATE, AND ELECTRONIC DEVICE According to one embodiment, a pressing member includes: a band-like pressing portion placed on a heat receiving block arranged on an element mounted on a substrate, the pressing portion configured to press the heat receiving block against the element; a first arm, one ... | 03/31/2011 |
| 20110075372 | EVAPORATORS FOR USE IN HEAT TRANSFER SYSTEMS, APPARATUS INCLUDING SUCH EVAPORATORS AND RELATED METHODS An evaporator includes a liquid barrier wall made of a ceramic material, a vapor barrier wall made of a ceramic material, and a wick made of a ceramic material and being positioned between the liquid barrier wall and the vapor barrier wall.... | 03/31/2011 |
| 20110075371 | ELECTRONIC DEVICE According to one embodiment, an electronic device includes a housing, a circuit board, a thermally radiative section, a first heat generator, a second heat generator, a first heat receiving block, a second heat receiving block, at least one heat pipe including a first e... | 03/31/2011 |
| 20110069453 | APPARATUS AND METHOD WITH FORCED COOLANT VAPOR MOVEMENT FOR FACILITATING TWO-PHASE COOLING OF AN ELECTRONIC DEVICE Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid... | 03/24/2011 |
| 20110069454 | LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending... | 03/24/2011 |
| 20110063798 | HEAT-MANAGEMENT SYSTEM FOR A CABINET CONTAINING ELECTRONIC EQUIPMENT A heat-management system is described for use in a cabinet containing electronic equipment (15) that produces a flow of heated air when in operation. The system comprises: an evaporator (32) positioned in the path of a heated air flow produced by the said ... | 03/17/2011 |
| 20110051449 | Arrangement for Cooling Semiconductor Light Sources and Floodlight Having this Arrangement An arrangement for cooling semiconductor light sources (5), wherein the semiconductor light sources (5) are arranged on a heat-conducting module (11), which is operatively connected to an evaporator zone (27) of a heat pipe (20), where... | 03/03/2011 |
| 20110038122 | Phase Change Heat Spreader Bonded to Power Module by Energetic Multilayer Foil Power electronic devices are solder to a phase change heat spreader using an energetic multilayer foil. This foil may be sandwiched between layers of solder, the first layer in contact with the power electronic devices and the second layer in contact with the phase chan... | 02/17/2011 |
| 20110019359 | ELECTRONIC APPARATUS According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and hel... | 01/27/2011 |
| 20110013364 | MODULAR HIGH-POWER DRIVE STACK COOLED WITH VAPORIZABLE DIELECTRIC FLUID A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The... | 01/20/2011 |
| 20100328890 | CONDENSER STRUCTURES WITH FIN CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from ... | 12/30/2010 |
| 20100328891 | CONDENSER BLOCK STRUCTURES WITH CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities ther... | 12/30/2010 |
| 20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples... | 12/30/2010 |
