Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20070064393 | Heat dissipating system A heat dissipating system for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device; a cooling fluid containing a coolant and a particulate material dispersed in the coolant; a d... | 03/22/2007 |
| 20070064392 | Heat dissipating system A heat dissipating system adapted for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device; a driving mechanism; a cooling mechanism; a coolant circulating conduit adapted for receiving a coolant therein, and connected to t... | 03/22/2007 |
| 20070062673 | Flow distributing unit and cooling unit A distributor (1) for distributing a flow of cooling fluid over surface(s) (3) to be cooled. Has a housing (13) manufactured in a single piece with inlet (8) and outlet (9) manifolds and a plurality of flow cells (26, 27, 28, 29... | 03/22/2007 |
| 20070051500 | Magneto-hydrodynamic heat sink A heat sink uses a pump assembly to generate a radial magnetic field. Pipes arranged to house a portion of a first channel and a portion of a second channel are formed in the heat sink. The direction of fluid flow in the first channel and the direction of fluid flow in ... | 03/08/2007 |
| 20070051496 | Cooling device The invention relates to a cooling device, which comprises a cooling fan and a heatsink. The heatsink is directly attached to the heating element to absorb its heat and the cooling fan is disposed on top of the heatsink to dissipate the heat. The heatsink includes a cen... | 03/08/2007 |
| 20070047204 | HEAT SINK ASSEMBLY AND RELATED METHODS FOR SEMICONDUCTOR VACUUM PROCESSING SYSTEMS An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally conductive heat sink carrier in the at least one wafer pocket. The heat sink c... | 03/01/2007 |
| 20070039720 | Radial flow micro-channel heat sink with impingement cooling A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins e... | 02/22/2007 |
| 20070039716 | Heat dissipating unit A heat dissipating unit includes: a housing defining an inner space therein, a fluid inlet in fluid communication with the inner space and adapted to receive a coolant therein, and a fluid outlet in fluid communication with the inner space and adapted to discharge the c... | 02/22/2007 |
| 20070034353 | INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat di... | 02/15/2007 |
| 20070034356 | Cooling systems incorporating heat exchangers and thermoelectric layers A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of th... | 02/15/2007 |
| 20070034355 | HEAT-DISSIPATION STRUCTURE AND METHOD THEREOF A heat-dissipation structure mainly including a heat-absorbing head, a heat pipe, and a tube jacket is provided. The heat pipe includes a heated end and a cooling end, wherein the heated end of the heat pipe is connected to the heat-absorbing head, and a flange is proje... | 02/15/2007 |
| 20070034354 | Heat dissipation system A liquid-cooled heat dissipation system includes a heat absorber; a heat dissipating member; two connecting pipes connecting the heat absorber and the heat dissipating member; and a working fluid filled in the heat absorber, the heat dissipating member, and the connecti... | 02/15/2007 |
| 20070023168 | Apparatus for cooling electronic components An apparatus (1) for cooling electronic components (2, 3, 4) comprises laminated plate-like parts that form a flow duct through which a liquid coolant can flow. At least one plate-like frame element (8) having cutouts (9, 10, 11) is arranged ... | 02/01/2007 |
| 20070023167 | INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in f... | 02/01/2007 |
| 20070017659 | Heat spreader A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic componen... | 01/25/2007 |
| 20070019384 | Cold plate cooling apparatus for a rack mounted electronic module Apparatus which is capable of providing efficient cooling of rack mounted electronic modules while accommodating relatively large tolerances in the mounting of the modules. A plurality of thermally conductive sliding wedge blocks are interposed between the lower surface... | 01/25/2007 |
| 20070017660 | Heatsink with adapted backplate A fluid-cooled heatsink and backplate, for example, for an electronic power module in an automotive application are provided, the backplate formed with a set of grooves, and the heatsink formed with a set of ribs corresponding to the set of grooves and extending into an... | 01/25/2007 |
| 20070012423 | Liquid cooling jacket and liquid cooling device A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up fr... | 01/18/2007 |
| 20070000647 | Systems for integrated cold plate and heat spreader According to some embodiments, systems for an integrated cold plate and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader integral with the cold plate, the heat spreader to accept heat... | 01/04/2007 |
| 20070002539 | Chamber sealing valve According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion... | 01/04/2007 |
| 20070000655 | Heat exchanger for liquid cooling To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the co... | 01/04/2007 |
| 20070000648 | Systems for low cost coaxial liquid cooling According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with ... | 01/04/2007 |
| 20070000644 | Microchannel cooling device for small heat sources According to the invention, an apparatus for transferring heat with a target is disclosed. The apparatus may include a body which defines a surface, inlet port, inlet manifold passages, heat transfer passages, outlet manifold passages, and outlet port. The surface may c... | 01/04/2007 |
| 20060291164 | Fluid-cooled electronic system A fluid-cooled electronic assembly including a base having a fluid inlet and a fluid outlet therein, a cap attached to the base to form a fluid containment chamber therebetween, wherein the fluid containment chamber is in fluid communication with the fluid inlet and the... | 12/28/2006 |
| 20060291165 | Apparatus for cooling electronic components An apparatus (1) for cooling electronic components comprises plate-shaped elements (2, 8), which enclose between them a cavity in the form of a flow channel, having connections (5, 6) for a liquid coolant flowing through the flow channel. One plate-... | 12/28/2006 |
| 20060289145 | Tube type heat exchanger with motor or generator housing A cooling assembly is provided for an electromechanical device, such as an electromagnetic or generator, including a housing having a wall portion. A magnetic field member is disposed within the housing and is arranged adjacent to the wall portion. A shaft having windin... | 12/28/2006 |
| 20060278373 | Microchannel cooling device with magnetocaloric pumping The invention discloses a microchannel cooling device, adapted for dissipating heat generated from an electronic device, which comprises: a heat sink, being arranged on the electronic device and having an inlet, an outlet and a plurality of microchannels embedded thereo... | 12/14/2006 |
| 20060278372 | HEAT DISSIPATION DEVICE A heat dissipation device includes a liquid cooling system and a heat exchanger. The liquid cooling system includes a cold plate (20) having an inlet (244) and an outlet (246) to permit liquid to flow through the cold plate. The heat exchanger inclu... | 12/14/2006 |
| 20060274561 | Tri-level inverter A tri-level inverter power module has an architecture employing a high degree of modularity that allows a base power module to be quickly, easily, and cost effectively configured to address a large variety of applications. ... | 12/07/2006 |
| 20060272802 | Cooling plate A cooling plate comprises a passage 6 for flowing a coolant by closing a groove 5 formed on a main body 2 with a lid 3. The lid 3 has a width greater than that of the groove 5 and has a convex portion 4 at least on one su... | 12/07/2006 |
| 20060266498 | LIQUID COOLING SYSTEM SUITABLE FOR REMOVING HEAT FROM ELECTRONIC COMPONENTS A liquid cooling system (30) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (50) defining therein a fluid flow channel (54) for passage of a coolant. The fluid flow channel... | 11/30/2006 |
| 20060268519 | Method and stacked memory structure for implementing enhanced cooling of memory devices A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is mounted on each platter. At least one connector is provided with each platter ... | 11/30/2006 |
| 20060266508 | Cold plate assembly A cold plate assembly, which in one embodiment includes a manifold layer comprising one or more input coolant sub-manifold channels and one or more output coolant sub-manifold channels. A metering plate having a plurality of orifices defined there through is disposed ad... | 11/30/2006 |
| 20060266497 | HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substr... | 11/30/2006 |
| 20060262503 | Cooling system for a substrate The present invention relates to a cooling system, the cooling system having a nozzle which receives coolant from a reservoir and which faces a substrate. The nozzle may be opened and closed by a thermally responsive valve allowing the coolant to be automatically metere... | 11/23/2006 |
| 20060262502 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a plura... | 11/23/2006 |
| 20060256526 | Liquid cooling system Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. An embodiment is disclosed for data processing systems and communication systems having rack moun... | 11/16/2006 |
| 20060254762 | 3-Dimensional high performance heat sinks A heat sink having a very high heat transfer capability may be made from a plurality of unit elements. Each unit element includes a series of inlet tubes having a range of diameters and a series of outlet tubes also having a range of diameters. At least one inlet tube h... | 11/16/2006 |
| 20060254752 | Radiator and heatsink apparatus having the radiator A radiator includes: an inlet header having a hollow shape and being provided with an inlet for the coolant to enter; a plurality of flat tubes connecting to the inlet header on one end; and an outlet header having a hollow shape and being provided with an outlet for th... | 11/16/2006 |
| 20060250775 | A method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method A device for cooling electronic components of a control unit in an unmanned flying vehicle comprises a container containing a liquid cooling medium, means adapted to sense the temperature of said electronic components during the flight of said vehicle and means adapted ... | 11/09/2006 |
