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| Application No. | Application Title | Issue Date |
| 20050152114 | System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling syste... | 07/14/2005 |
| 20050141195 | Folded fin microchannel heat exchanger Folded fin microchannel heat exchangers for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. The heat exchangers include a folded fin enclosed within the heat exchanger thereby defining a plurality of microchannels.... | 06/30/2005 |
| 20050141196 | Liquid cooling system and electronic equipment using the same For cooling of an electronic equipment, replacement of the conventional technique such as air cooling or the like by a liquid cooling system, retainment of a cooling capacity irrespective of a direction, in which a housing of the electronic equipment including a liquid ... | 06/30/2005 |
| 20050133212 | Forced fluid heat sink A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a firs... | 06/23/2005 |
| 20050128706 | Power module with heat exchange A power module comprises first and second substrates carrying semiconductor devices and coupled to respective pluralities of heat exchange members without intervening thermally insulative structures. One or more heat exchange loops circulate a heat exchange medium therm... | 06/16/2005 |
| 20050128705 | Composite cold plate assembly A cooling fluid distribution assembly for a plurality of electronic modules, using a composite cold plate structure. One cold plate is associated with each electronic module requiring liquid cooling. Each cold plate includes a high thermal conductivity base sealably fas... | 06/16/2005 |
| 20050122685 | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, an... | 06/09/2005 |
| 20050122686 | Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board A heat-radiating structure of an electronic card unit is compact and reinforces a printed circuit board while improving heat radiation efficiency. Card unit 6 has dual function reinforcing plate-heat dissipaters 17 and 18 at the upper and lower edge... | 06/09/2005 |
| 20050122684 | Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, a... | 06/09/2005 |
| 20050117300 | Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defi... | 06/02/2005 |
| 20050117301 | Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defi... | 06/02/2005 |
| 20050117299 | Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling A channeled heat sink and a device chassis having one or more integral condensing volumes suited for heat rejecters in conduction with two-phase cooling loops. The channeled heat sink includes a base from which a plurality of hollowed fins extend. Each hollowed fin defi... | 06/02/2005 |
| 20050117298 | Cooling device and an electronic apparatus including the same A cooling device for cooling a heat-generating component includes a circulating passage arranged to have coolant circulate therein, a centrifugal pump including a first case made of metallic material, a second case made of resin material, and an impeller accommodated in... | 06/02/2005 |
| 20050117297 | Cooling array A cooling array including a housing accommodating electrical built-in components and an air conditioning device that is connected to a heat source of the electrical built-in components by a coolant-carrying inlet line and a return line. To simply air-condition complex s... | 06/02/2005 |
| 20050111188 | Thermal management device for an integrated circuit Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium. ... | 05/26/2005 |
| 20050105273 | Cooling apparatus for electronic apparatus An electronic component that generates heat is enclosed in a body. A bottom panel forms a part of the body. A heat receiving portion is thermally connected to the electronic component. A heat radiating portion that radiates the heat received by the heat receiving portio... | 05/19/2005 |
| 20050105272 | Micropin heat exchanger An apparatus including a micropin thermal solution is described. The apparatus comprises a substrate and a number of micropins thermally coupled to the substrate. The micropins are arranged in a pixel like pattern over the substrate. ... | 05/19/2005 |
| 20050099773 | Cooling device for a motor vehicle having a cooling duct for a coolant Electronic components are arranged outside of the cooling channel of a motor vehicle's engine. ... | 05/12/2005 |
| 20050092007 | COOLING OF SURFACE TEMPERATURE OF A DEVICE A structure (microduct) for temperature management (e.g., cooling) of the surface temperature of an electronic device (e.g., a microprocessor). In an embodiment of the present invention, the system includes an upper plate, wherein the upper plate has a bottom surface fo... | 05/05/2005 |
| 20050094374 | POWER CONDITIONING MODULE In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The... | 05/05/2005 |
| 20050094373 | METHOD AND APPARATUS FOR COOLING HEAT-GENERATING STRUCTURE An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in it... | 05/05/2005 |
| 20050082037 | Porous media cold plate A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant... | 04/21/2005 |
| 20050083657 | Liquid cooling system Liquid cooling systems and apparatus and data processing systems and communication systems with liquid cooling systems are presented. A number of embodiments are presented. In each embodiment a plurality of heat transfer systems capable of engaging a plurality heat gene... | 04/21/2005 |
| 20050083656 | Liquid cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat tran... | 04/21/2005 |
| 20050083655 | Dielectric thermal stack for the cooling of high power electronics A system for dissipating heat in an electronic power module is provided. The system includes a semiconductor die, a substrate, and a heat sink in which is contained a first fluid, and a conduit through which a second fluid is permitted to flow. The substrate is attached... | 04/21/2005 |
| 20050083654 | Cabinet cooling A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system (10) is achieved by controlling circulation of a cooling medium in a closed system (40) containing an evaporator (13... | 04/21/2005 |
| 20050078450 | Electronic apparatus A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver whic... | 04/14/2005 |
| 20050067147 | Loop thermosyphon for cooling semiconductors during burn-in testing A burn-in testing cooling system including an evaporator comprising an upright tubular body having an interior surface and a central passageway with a wick disposed on the interior surface of the body that defines the central passageway. A base seals off the central pas... | 03/31/2005 |
| 20050063157 | Temperature control system which sprays liquid coolant droplets against an IC-module and directs radiation against the IC-module A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on... | 03/24/2005 |
| 20050051298 | Cooler for cooling both sides of semiconductor device An object of the present invention is to provide a cooler for cooling both sides (top and bottom surfaces) of a semiconductor device, wherein the variation of pressing force on flat cooling tubes holding a semiconductor device is reduced, thereby uniformly dissipating t... | 03/10/2005 |
| 20050052848 | Liquid cooling system Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat tra... | 03/10/2005 |
| 20050052847 | Liquid cooling system A liquid cooling system and apparatus is presented. A two-piece embodiment is presented. The first component is a heat transfer unit capable of engaging a processor and adapted to transfer heat from the processor to a liquid thereby generating heated liquid. The heated ... | 03/10/2005 |
| 20050047090 | Cooling device, electronic equipment device, and method of manufacturing cooling device A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of su... | 03/03/2005 |
| 20050041393 | Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an opn end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on ... | 02/24/2005 |
| 20050039886 | Liquid cooling element and connection arrangement of liquid cooling element The invention relates to a liquid cooling element for cooling heat generating elements of frequency converters, in particular, and an arrangement for connecting the liquid cooling element. The liquid cooling element 2 is provided with two channel systems: horizon... | 02/24/2005 |
| 20050036289 | Heat dissipation device A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan... | 02/17/2005 |
| 20050030717 | Cooler for cooling electric part A cooler cools a plurality of electric parts from both sides thereof. The cooler includes a plurality of cooling units including a pair of cooling tubes for flowing coolant therethrough. A pair of cooling tubes having a flat shape is disposed to sandwich the electric pa... | 02/10/2005 |
| 20050024830 | Liquid-cooled heat sink assembly A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body (20) defining a central chamber (21) therein and having a number of fins (22) on an outside thereof, liquid coolant received in the central chamber, a f... | 02/03/2005 |
| 20050018400 | Cooling system for adjustable electric drive The invention relates to a cooling arrangement for an adjustable electric drive. The arrangement is arranged to conduct heat generated in electric devices by means of a liquid flowing through the cooling element to the surrounding space. The arrangement comprises a cool... | 01/27/2005 |
| 20050007739 | Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components According to one embodiment of the invention, an electronic apparatus comprises a main unit, a display unit and a support unit. The main unit contains a heat-generating component and a heat-receiving portion. The heat-receiving portion is thermally connected to the heat... | 01/13/2005 |
