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| Application No. | Application Title | Issue Date |
| 20100085708 | HIGH-EFFICIENCY, FLUID-COOLED UPS CONVERTER An interruptible power supply (UPS) may include direct cooling for various components of the UPS that generate heat. The direct cooling may be part of a cooling system that directs the generated heat to the ambient environment external to the room or building housing th... | 04/08/2010 |
| 20100085712 | Liquid Cooling System A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the ... | 04/08/2010 |
| 20100073875 | Cooling unit and electronic device A cooling unit includes: a heat-radiating section in which a coolant flows and which radiates heat caught by the coolant; and a path where the coolant flows through the heat-radiating section; a pump on the path to cause the coolant to flow; and heat absorbing sections ... | 03/25/2010 |
| 20100072865 | VEHICLE DRIVE DEVICE A vehicle drive device includes a motor generator (MG2), a power control unit controlling the motor generator (MG2), and a case housing the motor generator (MG2) and the power control unit. The power control unit includes a first inverter driving th... | 03/25/2010 |
| 20100071881 | COOLING SYSTEM FOR AIRCRAFT ELECTRIC OR ELECTRONIC DEVICES A cooling system for cooling the electrical or electronic equipment on board an aircraft is equipped with a main closed circuit. A pump circulates a heat transfer medium through the main closed circuit. A main heat exchanger is thermally coupled with the heat transfer m... | 03/25/2010 |
| 20100061061 | POWER SOURCE APPARATUS A power source apparatus includes a power source module which is formed of a plurality of power source elements, a case which houses the power source module and a cooling liquid, a fan which is placed in the case in a state in which the fan is immersed in the cooling li... | 03/11/2010 |
| 20100046167 | COOLING AN INTEGRATED CIRCUIT DIE WITH COOLANT FLOW IN A MICROCHANNEL AND A THIN FILM THERMOELECTRIC COOLING DEVICE IN THE MICROCHANNEL An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one mic... | 02/25/2010 |
| 20100039773 | Narrow Gap Spray Cooling in a Globally Cooled Enclosure Electronic circuit boards are arranged as respective parallel pairs defining a narrow gap there between. One or more such pairs of boards are supported within a hermitically sealable housing and cooled by way of spraying an atomized liquid coolant from a plurality of no... | 02/18/2010 |
| 20100033932 | ELECTRONIC BOARD AND COLD PLATE FOR SAID BOARD The invention relates to an electronic board that comprises a planar projection plate (42) provided between an intake opening (70) and a discharge opening (72); and a plurality of rectilinear nozzles (86-90) extending through said plat... | 02/11/2010 |
| 20100025126 | Power Conversion Apparatus and Electric Vehicle The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plat... | 02/04/2010 |
| 20100002392 | Assembled Heat Sink Structure The present invention provides an assembled heat sink structure including a base, a plurality of heat dissipating fins mounted on the top of the base, and a capillary device located inside the base, wherein the base is formed and assembled by an upper cover with a lower... | 01/07/2010 |
| 20100002393 | LIQUID COOLING APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold... | 01/07/2010 |
| 20090316361 | Method and apparatus for controlling the output of solar arrays A method to control the temperature of a circulating fluid and thereby control the electrical output of a PV array is provided along with an apparatus for doing so which adds simple mechanical, data measurement and control elements to prior art systems. Given a set amou... | 12/24/2009 |
| 20090316359 | HEAT-TRANSFER MECHANISM INCLUDING A LIQUID-METAL THERMAL COUPLING Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second... | 12/24/2009 |
| 20090316360 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLATE FORMED IN SITU ON A SURFACE TO BE COOLED A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing ... | 12/24/2009 |
| 20090303684 | SYSTEMS AND METHODS FOR COOLING AN ELECTRONIC DEVICE Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated ci... | 12/10/2009 |
| 20090294676 | COOLING DEVICE AND COOLING METHOD The present invention provides a cooling device that can cool an electronic device in a short amount of time. When an electronic cassette has been accommodated in a housing device, the cooling device performs heat absorption by spraying an antiseptic liquid from nozzles... | 12/03/2009 |
| 20090284921 | Apparatus and Methods for High-Performance Liquid Cooling of Multiple Chips with Disparate Cooling Requirements Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses ... | 11/19/2009 |
| 20090284922 | HIGH-POWER THYRISTOR MODULE HAVING COOLING EFFECT A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. E... | 11/19/2009 |
| 20090279257 | SYSTEM AND METHOD FOR A SUBSTRATE WITH INTERNAL PUMPED LIQUID METAL FOR THERMAL SPREADING AND COOLING A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the cha... | 11/12/2009 |
| 20090279259 | System and method for proportional cooling with liquid metal A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions ... | 11/12/2009 |
| 20090279258 | HINGE CONNECTOR WITH LIQUID COOLANT PATH A hinge for moving two parts of an electronic apparatus relative to each other is disclosed. The hinge includes two coolant flow paths helically arranged between inlet and outlet connections as portions of the hinge are rotated relative to each other. Guide plates withi... | 11/12/2009 |
| 20090268404 | ENERGY EFFICIENT APPARATUS AND METHOD FOR COOLING AN ELECTRONICS RACK Apparatus and method are provided for cooling an electronics rack in an energy efficient, dynamic manner. The apparatus includes one or more extraction mechanisms for facilitating cooling of the electronics rack, an enclosure, a heat removal unit, and a control unit. Th... | 10/29/2009 |
| 20090251862 | SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing int... | 10/08/2009 |
| 20090237883 | BOARD UNIT AND ELECTRONIC APPARATUS A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is... | 09/24/2009 |
| 20090237884 | Electromagnetically-actuated micropump for liquid metal alloy The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate... | 09/24/2009 |
| 20090236666 | Integrated Circuitry Some embodiments include formation of at least one cavity in a first semiconductor material, followed by epitaxially growing a second semiconductor material over the first semiconductor material and bridging across the at least one cavity. The cavity may be left open, o... | 09/24/2009 |
| 20090231810 | DIRECT DIPPING COOLED POWER MODULE AND PACKAGING A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enc... | 09/17/2009 |
| 20090231807 | Waterproof Ventilated Display Enclosure A waterproof ventilated enclosure for housing equipment is disclosed having the ability to channel water thru the enclosure without touching the equipment and further with the ability to provide active or passive ventilation to the equipment. In the preferred case, the ... | 09/17/2009 |
| 20090231811 | Electric Power Conversion Apparatus An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current conn... | 09/17/2009 |
| 20090231812 | DIRECT COOLED POWER ELECTRONICS SUBSTRATE The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) m... | 09/17/2009 |
| 20090225512 | Electronic module having thermal cooling insert An electronic module is provided having enhanced thermal cooling of electronics. The module includes a housing, electronic circuitry contained within the housing, and a fluid cooling chamber extending through the housing. The chamber has generally conical shaped portion... | 09/10/2009 |
| 20090219694 | Power Electronics Assembly The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. ... | 09/03/2009 |
| 20090219692 | Rack for housing a liquid-cooled electric unit The present invention provides a rack suitable for housing a liquid-cooled electric unit. A rack 2 comprises an electric connector 12 for supplying electricity to the housed electric unit 50, and a fluid connector 14 for supplying cooling liq... | 09/03/2009 |
| 20090219693 | Cooling system for high voltage systems A cooling system for a high voltage system can include a high voltage supply and an electrical component coupled to the high voltage supply. The electrical component can generate heat that needs to be dissipated. The cooling system can include a cooling mechanism for di... | 09/03/2009 |
| 20090213539 | HEAT DISSSIPATION ASSEMBLY FOR COMPUTING DEVICES An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whe... | 08/27/2009 |
| 20090213541 | Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad th... | 08/27/2009 |
| 20090207568 | METHOD AND APPARATUS FOR COOLING IN MINIATURIZED ELECTRONICS A method and apparatus for cooling in miniaturized electronics are provided including in an electronic circuit board. The electronic circuit includes a substrate and at least one integrated channel within the substrate configured to allow fluid flow therethrough.... | 08/20/2009 |
| 20090201643 | INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.... | 08/13/2009 |
| 20090201644 | SYSTEMS AND ASSOCIATED METHODS FOR COOLING COMPUTER COMPONENTS Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positione... | 08/13/2009 |
