Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Application No. | Application Title | Issue Date |
| 20120039041 | HEAT MANAGEMENT USING POWER MANAGEMENT INFORMATION A multi-core microprocessor provides an indication of the power management state of each of the cores on output terminals. Cooling of the cores is adjusted responsive to the indication of the power management state of the respective cores with additional cooling being p... | 02/16/2012 |
| 20120033382 | HEAT SINK, LIQUID COOLING UNIT, AND ELECTRONIC APPARATUS A heat sink for absorbing heat which is generated by an electronic module by using a coolant which flows in its internal portion, comprises a housing which is provided with, in its internal portion, a first surface which is located in the vicinity of the electronic modu... | 02/09/2012 |
| 20120020022 | PRINTED CIRCUIT BOARD COOLING ASSEMBLY A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of th... | 01/26/2012 |
| 20110317366 | FIXING STRUCTURE AND FIXING METHOD OF CIRCUIT BOARD WITH EMBEDDED ELECTRONIC PARTS TO COOLER In a fixing structure of a circuit board to a cooler, the circuit board includes a wiring part, electronic parts electrically connected to the wiring part and an insulating base material embedding the wiring part and the electronic parts therein. The insulating base mat... | 12/29/2011 |
| 20110317365 | LIQUID COOLING SYSTEM AND ELECTRONIC DEVICE INCORPORATING THE SAME A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liq... | 12/29/2011 |
| 20110313576 | SYSTEM AND METHOD FOR FLOWING FLUIDS THROUGH ELECTRONIC CHASSIS MODULES An electronic chassis distributes fluids to adjacent chassis and electronic modules housed within the chassis. Provision is made for the detection, containment, and removal of liquid spilled within the chassis. The fluids may be used as coolants, and provision is made f... | 12/22/2011 |
| 20110304987 | DEVICE FOR COOLING INTEGRATED CIRCUITS The present disclosure is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, the cooling device comprising a plurality of channels (3′) which are non-parallel to the surface to be cooled, each channe... | 12/15/2011 |
| 20110286183 | WATER-COOLED COMMUNICATION CHASSIS A water-cooled communication chassis includes a chassis body and a water cooling unit. The chassis body includes at least one heat receiving portion, at least one heat dissipation portion, and at least one first water pipe system. The first water pipe system has a front... | 11/24/2011 |
| 20110273845 | HIGH POWER BAND PASS RF FILTER HAVING A GAS TUBE FOR SURGE SUPPRESSION A high power band pass RF filtering device having a housing for containing a printed circuit board with filtering components for achieving strong attenuation of out-of-band signals. An input port and an output port on the housing electrically connect to a respective inp... | 11/10/2011 |
| 20110267776 | CONDUCTION-COOLED APPARATUS AND METHODS OF FORMING SAID APPARATUS A circuit card enclosure comprises a backplane including a plurality of connectors. First and second conduction rails are thermally coupled to a heat exchanger, the first and second conduction rails each comprising an inner body at least partially encapsulated by an out... | 11/03/2011 |
| 20110249402 | POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT A power converter module includes at least two power semiconductor modules, which are mechanically connected to a liquid-cooled heat sink and electrically connected to terminals of the power converter module by a busbar arrangement having at least two busbars. The busba... | 10/13/2011 |
| 20110242760 | POWER CONVERTER MODULE WITH A COOLED BUSBAR ARRANGEMENT A power converter module has a first liquid-cooled heat sink, a busbar arrangement having at least two busbars which are electrically insulated from one another and at least one power semiconductor module which is mechanically connected to the first liquid-cooled heat s... | 10/06/2011 |
| 20110235271 | MOTHER AND DAUGHTER BOARD CONFIGURATION TO IMPROVE CURRENT AND VOLTAGE CAPABILITIES OF A POWER INSTRUMENT An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother bo... | 09/29/2011 |
| 20110235276 | POWER CONVERTER MODULE WITH COOLED BUSBAR ARRANGEMENT A power converter module with a liquid-cooled heat sink, a busbar arrangement having at least two busbars, at least two power semiconductor modules, which are mechanically connected to the liquid-cooled heat sink for thermal conduction and are electrically connected to ... | 09/29/2011 |
| 20110228478 | AUTOMATIC TRANSMISSION CONTROL UNIT COOLING APPARATUS An automatic transmission control unit cooling apparatus includes a control unit having an electronic component, installed on a substrate, for controlling the automatic transmission; a holder accommodating the substrate and within a case of the automatic transmission di... | 09/22/2011 |
| 20110228479 | Electric Power Conversion Apparatus An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current conn... | 09/22/2011 |
| 20110216505 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b, <... | 09/08/2011 |
| 20110205706 | RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a fir... | 08/25/2011 |
| 20110205707 | COMPONENT CARRIER An extruded aluminum electrical circuit component carrier on which at least one electrical circuit component is to be mounted. A first side portion and a second side portion include areas for mounting at least one first electrical circuit component part and at least one... | 08/25/2011 |
| 20110188202 | Algae Oil Based Dielectric Fluid for Electrical Components The disclosure is directed to a dielectric fluid. The dielectric fluid includes an algae oil. The algae oil includes a natural algae antioxidant. The natural algae antioxidant is selected from β-carotene, astaxanthin, tocopherol, polyunsaturated triglycerides, and comb... | 08/04/2011 |
| 20110188203 | PLUG IN LED ARRAY An LED device comprises an LED (16) mounted upon a circuit board (10), an electrical connector (14) carried by the circuit board (10), and a heat sink (20) carried by the circuit board (10) and arranged to conduct heat away from... | 08/04/2011 |
| 20110177954 | SUPERCONDUCTING ELECTRICITY TRANSMISSION SYSTEM The present disclosure generally relates to a superconducting power grid having one or more AC/DC converters. The superconducting grid may further include one or more pairs of superconducting DC cables connecting each AC/DC converter. Each pair of superconducting DC cab... | 07/21/2011 |
| 20110176276 | CTE-MATCHED HEAT PIPE Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon s... | 07/21/2011 |
| 20110164385 | LIQUID COOLER AND METHOD OF ITS MANUFACTURE A liquid cooler including a heat sink. A hollow body is produced by extrusion having at least one flat outer surface between a first and a second end. At least one elongated cavity passes through the body from the first to the second end. The hollow body includes a plur... | 07/07/2011 |
| 20110157827 | MINIATURIZED LIQUID COOLING APPARATUS AND ELECTRONIC DEVICE INCORPORATING THE SAME A liquid cooling apparatus for cooling an inversely mounted electronic component, includes a casing defining a receiving room therein, a diaphragm, a partition plate forming a nozzle thereon, and a piezoelectric element attached to the diaphragm in such a manner that th... | 06/30/2011 |
| 20110157828 | Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressu... | 06/30/2011 |
| 20110149517 | Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system (2), the aircraft electronics cooling system providing a thermal coupling between an electronic device (40a, 40b... | 06/23/2011 |
| 20110122583 | IMMERSION COOLING APPARATUS FOR A POWER SEMICONDUCTOR DEVICE An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolan... | 05/26/2011 |
| 20110116235 | MOTOR DRIVE UNIT AND VEHICLE INCLUDING THE SAME Disclosed is a motor drive unit. The motor drive unit includes a case, a capacitor provided in the case and generating heat, an inverter provided in the case and configured to convert Direct Current (DC) power into Alternating Current (AC) power, and a water cooling jac... | 05/19/2011 |
| 20110075368 | WATER-COOLED REACTOR A liquid-cooled electromagnetic component (reactor, transformer) including a plurality of disc-shaped coils with one or more turns and flat radiators located between them, wherein at least two disc coils are assigned to a flat radiator, and in which all the winding elem... | 03/31/2011 |
| 20110075367 | COMPLIANT CONDUCTION RAIL ASSEMBLY AND METHOD FACILITATING COOLING OF AN ELECTRONICS STRUCTURE Compliant conduction rail assembly and method are provided for facilitating cooling of an electronics structure. The rail assembly includes a first thermally conductive rail mounted to a surface of the electronics structure, a second thermally conductive rail thermally ... | 03/31/2011 |
| 20110069454 | LIQUID-COOLED ELECTRONICS APPARATUS AND METHODS OF FABRICATION Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending... | 03/24/2011 |
| 20110051371 | Semiconductor Device, and Power Conversion Device Using Semiconductor Device The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element ( 03/03/2011 | |
| 20110043999 | APPARATUS AND ARRANGEMENT FOR HOUSING VOLTAGE CONDITIONING AND FILTERING CIRCUITRY COMPONENTS FOR AN ELECTROSTATIC PRECIPITATOR A unitary-enclosure housing apparatus and arrangement for protecting and cooling the high voltage electronic conditioning and filtering circuitry components used for providing a high-voltage waveform to an electrostatic precipitator device includes a hermetically sealed... | 02/24/2011 |
| 20110044000 | TRANSPARENT HEAT-SPREADER FOR OPTOELECTRONIC APPLICATIONS An optoelectronic cooling system is equally applicable to an LED collimator or a photovoltaic solar concentrator. A transparent fluid conveys heat from the optoelectronic chip to a hollow cover over the system aperture. The cooling system can keep a solar concentrator c... | 02/24/2011 |
| 20110026225 | Method and Apparatus for Liquid Cooling Computer Equipment A cooling system for cooling computer component with a liquid provided at atmospheric pressure, or low pressure, that flows through channel defined in the computer component. The liquid is pumped from a reservoir to a discharge port, or weir, that is located above the c... | 02/03/2011 |
| 20110013363 | Housing Used As Heat Collector A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering ... | 01/20/2011 |
| 20110013364 | MODULAR HIGH-POWER DRIVE STACK COOLED WITH VAPORIZABLE DIELECTRIC FLUID A high power drive stack system is provided which includes a cabinet (20) having a vaporizable dielectric fluid cooling system (110) and a plurality of receivers (22) for accepting a plurality of modules (30) containing power electronics. The... | 01/20/2011 |
| 20100328894 | OPTICAL INTERCONNECTION DEVICE Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules (12) are arranged on a periphery of an LSI (11) electrically connected to an electric wir... | 12/30/2010 |
| 20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples... | 12/30/2010 |
