|Application No.||Application Title||Issue Date|
|20050122684||Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems|
A cooling system is provided employing at least two modular cooling units (MCUs). Each MCU is capable of providing system coolant to multiple electronics subsystems to be cooled, and each includes a heat exchanger, a first cooling loop with at least one control valve, a...
|20050057900||Heat dissipating circulatory system with sputtering assembly|
A heat dissipating circulatory system (8) includes a pool (7) for receiving an operating fluid, a pump (3), a heat spreader (2) and a condenser (4). A first pipe (51) interconnects an output end (42) of the condenser and ...
|20050030716||ELECTRONIC DEVICE COOLING SYSTEM AND METHOD OF USE|
An electronic device cooling system includes a heat exchange unit; at least one cooling interface disposed at a heat-transfer interface of an electronic device, where the cooling interface is thermally coupled to the heat exchange unit; and a heat exhaust that is therma...