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| Application No. | Application Title | Issue Date |
| 20120127660 | CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrica... | 05/24/2012 |
| 20120127661 | DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the ... | 05/24/2012 |
| 20120069519 | FLUID-COOLED ELECTRICAL EQUIPMENT, AVIONIC RACK TO RECEIVE SUCH EQUIPMENT AND AIRCRAFT EQUIPPED WITH SUCH RACKS This invention relates to a fluid-cooled electronic equipment item, an avionic rack to receive such an equipment item and an aircraft equipped with such racks. The electronic equipment items are connected to the avionic rack on the one hand... | 03/22/2012 |
| 20120068474 | MICROSYSTEMS FOR CONVERTING PRESSURES AND COMPRESSION The invention relates to a microsystem for converting a difference in pressures in a fluid into mechanical movement, this microsystem comprising:—an inlet nozzle (6) for compressed fluid and an outlet nozzle (8) for expanded fluid,—at least two arms (<... | 03/22/2012 |
| 20120039039 | Power Inverter In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passa... | 02/16/2012 |
| 20120026686 | INFORMATION PROCESSING APPARATUS SYSTEM AND METHOD OF CONTROLLING THE SAME An information processing apparatus system includes: an information processing apparatus or apparatuses configured to measure the flow rate of coolant flowing from a coolant inflow surface of its enclosure to a coolant outflow surface of the enclosure; and a cooling app... | 02/02/2012 |
| 20120020023 | HEATING CIRCUIT AND ELECTRONICS ASSEMBLY A heating circuit and an electronics assembly for use in a vehicle includes an external housing having outer walls and an internal wall dividing the external housing into an electronics cavity and a non-electronics cavity. A heat generating electronics assembly is locat... | 01/26/2012 |
| 20120020008 | UNIVERSAL RACK BACKPLANE SYSTEM Disclosed is an embodiment of a rack system including a universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane area on a second side of the rack system opposite to the first side, a power bus, a p... | 01/26/2012 |
| 20120020024 | COOLED UNIVERSAL HARDWARE PLATFORM Disclosed is an embodiment of a rack system including a cooled universal hardware platform having a frame, a module insertion area on a first side of the rack system and a universal backplane mounting area on a second side of the rack system opposite to the first side, ... | 01/26/2012 |
| 20120020020 | OPTICAL INTERCONNECTS IN COOLING SUBSTRATES Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans ... | 01/26/2012 |
| 20120008280 | Electric Circuit Device, Electric Circuit Module, and Power Converter The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-lik... | 01/12/2012 |
| 20120006383 | HEAT EXCHANGER APPARATUS AND METHODS OF MANUFACTURING CROSS REFERENCE The invention provides systems and methods for cooling semiconductor devices, such as those provided in concentrated photovoltaic (CPV) systems using a cold plate. The invention also provides using a material, such as a ceramic, to form that cold plate that matches or n... | 01/12/2012 |
| 20120002370 | COOLING DEVICE AND ELECTRONIC DEVICE A cooling device comprising a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a... | 01/05/2012 |
| 20110313576 | SYSTEM AND METHOD FOR FLOWING FLUIDS THROUGH ELECTRONIC CHASSIS MODULES An electronic chassis distributes fluids to adjacent chassis and electronic modules housed within the chassis. Provision is made for the detection, containment, and removal of liquid spilled within the chassis. The fluids may be used as coolants, and provision is made f... | 12/22/2011 |
| 20110299244 | COOLING MEMBER FOR HEAT CONTAINING DEVICE A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregu... | 12/08/2011 |
| 20110292592 | THERMAL MANAGEMENT SYSTEMS AND METHODS A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between... | 12/01/2011 |
| 20110261531 | SWITCHING POWER SUPPLY A switching power supply has electronic parts that configure a switching circuit. The electronic parts are accommodated in a casing. A seat member is formed unitarily with the casing on which the electronic parts are mounted. A coolant channel is formed through the seat... | 10/27/2011 |
| 20110235270 | Power Converter The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. A ... | 09/29/2011 |
| 20110228474 | ADVANCED MEZZANINE CARD FOR HOSTING A PMC OR XMC A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space the... | 09/22/2011 |
| 20110222239 | COOLING DEVICES, POWER MODULES, AND VEHICLES INCORPORATING THE SAME A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plur... | 09/15/2011 |
| 20110216502 | POWER MODULES, COOLING DEVICES AND METHODS THEREOF A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be ... | 09/08/2011 |
| 20110205506 | Stress-decoupling devices and methods for cooled mirror systems A stress-decoupling device and methods of using same in a cooled grazing-incidence collector (GIC) mirror system are disclosed. A method includes providing a cooled GIC shell, providing input and output primary cooling-fluid manifolds, and fluidly connecting the cooled ... | 08/25/2011 |
| 20110205701 | RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a fir... | 08/25/2011 |
| 20110194247 | POWER CONVERSION APPARATUS In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and incl... | 08/11/2011 |
| 20110194249 | POWER CONVERSION APPARATUS A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic componen... | 08/11/2011 |
| 20110194248 | POWER CONVERSION APPARATUS The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic compo... | 08/11/2011 |
| 20110170264 | Semiconductor Module Socket Apparatus A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the s... | 07/14/2011 |
| 20110170259 | POWER INVERTERS Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first ... | 07/14/2011 |
| 20110141690 | POWER ELECTRONICS SUBSTRATE FOR DIRECT SUBSTRATE COOLING Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical feat... | 06/16/2011 |
| 20110113815 | SYSTEMS AND METHODS FOR PROVIDING AIR CONDITIONING TO AN ELECTRONIC COMPONENT IN A SATELLITE ANTENNA INSTALLATION An air conditioning system provides air to an enclosure associated with a satellite antenna that houses an amplifier or other electronic component. The air conditioning system supplies conditioned air to the bottom of the enclosure and receives return air from the top o... | 05/19/2011 |
| 20110103018 | INTEGRATED ANTENNA STRUCTURE WITH AN EMBEDDED COOLING CHANNEL According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of... | 05/05/2011 |
| 20110096496 | POWER ELECTRONICS ASSEMBLY WITH MULTI-SIDED INDUCTOR COOLING A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at lea... | 04/28/2011 |
| 20110023447 | COOLING SYSTEM FOR ELECTRONIC DEVICE IN A GAS TURBINE ENGINE SYSTEM A cooling system for electronics in a gas turbine engine system comprises an electronic device cooled by a fluid recirculation loop. The fluid recirculation loop comprises a fluid line to carry coolant fluid, a heat pump on the fluid line for removing heat from the cool... | 02/03/2011 |
| 20110002102 | DIRECTLY INJECTED FORCED CONVENTION COOLING FOR ELECTRONICS Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one ap... | 01/06/2011 |
| 20110002101 | ELECTRONIC ASSEMBLY An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat dissipating path along which heat generated by the electronic component is expell... | 01/06/2011 |
| 20100328885 | Rotatable Cooling Module A rotatable cooling module includes a cooling coil. An input line is coupled to the cooling coil via a coupler that allows the cooling coil to rotate independent of the input line. An output line is coupled to the cooling coil via a second coupler that allows the coolin... | 12/30/2010 |
| 20100328882 | DIRECT JET IMPINGEMENT-ASSISTED THERMOSYPHON COOLING APPARATUS AND METHOD Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure direct... | 12/30/2010 |
| 20100320014 | AUTOMOTIVE POWER ELECTRONICS WITH WIDE BAND GAP POWER TRANSISTORS An automotive power electronics system is provided. The automotive power electronics system includes a support member and at least one electronic die mounted to the support member. The at least one electronic die has an integrated circuit formed thereon comprising at le... | 12/23/2010 |
| 20100315776 | 3-LEVEL POWER CONVERTER A 3-level power converter is provided, which is reduced in size of the converter, reduced in floating inductance of each of wirings interconnecting between respective elements, and easily attached with a snubber circuit. The 3-level power converter performs on/off contr... | 12/16/2010 |
| 20100302733 | STACKED BUSBAR ASSEMBLY WITH INTEGRATED COOLING A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system incl... | 12/02/2010 |
