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Class 361/312 - Plural dielectrics


Subclass of Class 361 - Electricity: electrical systems and devices
Definition: Subject matter where the solid dielectric is combined with
No. of applications: 26
Last issue date: 08/25/2011


Application No.Application TitleIssue Date
20110205685COMPOSITE DIELECTRIC MATERIAL FOR HIGH-ENERGY-DENSITY CAPACITORS
A composite dielectric material having a plurality of particle cores, each surrounded by polymer strands that are chemically bonded to the surface of the particle core. Each polymer strand includes a linker, through which the polymer strand is attached to the surface, a...
08/25/2011
20110170232ELECTRICAL ENERGY STORAGE UNIT AND METHODS FOR FORMING SAME
An electrical storage unit includes a plurality of sets of layers. Each set of layers includes a first layer, a second layer, a third layer, and a fourth layer. The first layer includes a first electrode and plastic surrounding the first electrode on three sides of the ...
07/14/2011
20110128669THIN-FILM CAPACITOR
A thin-film capacitor that is less prone to generation of internal cracking or peeling is provided.

In a thin-film capacitor 100 according to the present embodiment, because through holes H are formed in internal electrodes 3, 5, ...

06/02/2011
20110032656FILM CAPACITOR AND METHOD OF PRODUCING THE SAME
A film capacitor is provided which has a smaller size and improved capacity while securing a sufficient withstand voltage. The film capacitor comprising a basic element 10 containing a plurality of dielectric layers and at least one vapor-deposited metal film lay...
02/10/2011
20100097740DIELECTRIC CERAMIC AND CAPACITOR
A dielectric ceramic comprising a barium titanate as a main component and a capacitor comprising the dielectric ceramic are disclosed. The dielectric ceramic has a high dielectric constant that is stable over temperature, and has a small spontaneous polarization. The ca...
04/22/2010
20090195963CAPACITOR AND METHOD OF MANUFACTURING THE SAME
A capacitor includes a pair of electrically conductive layers; a plurality of substantially or nearly tubular dielectric materials disposed between the pair of electrically conductive layers formed of anodic oxide of metal; first electrodes which are filled in hollow po...
08/06/2009
20090128993MULTI-TIER CAPACITOR STRUCTURE, FABRICATION METHOD THEREOF AND SEMICONDUCTOR SUBSTRATE EMPLOYING THE SAME
A multi-tier capacitor structure has at least one multi-tier conductive layer. At least one conductive via passes through the multi-tier conductive layer. When currents flow through the conductive via, different current paths are presented in the conductive via in respo...
05/21/2009
20090050356Capacitors with Insulating Layer Having Embedded Dielectric Rods
A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insula...
02/26/2009
20080259524PROCESS FOR MANUFACTURING A HIGH-STABILITY CAPACITOR AND CORRESPONDING CAPACITOR
A dielectric alloy is composed of two dielectric materials that respectively have second-order non-linear dielectric susceptibilities with opposite signs. The composition is adjusted so that the alloy has a second-order non-linear dielectric susceptibility below a chose...
10/23/2008
20080151471High voltage capacitor and method for manufacturing same
A high voltage capacitor includes multiple conductive strips on each side of a dielectric layer. The conductive strips on one side of the dielectric layer partially overlap conductive strips on the opposite side of the dielectric layer, in effect forming a series combin...
06/26/2008
20080049378METAL-INSULATOR-METAL CAPACITOR AND METHOD OF FABRICATING SAME
A metal-insulator-metal (MIM) capacitor including a metal layer, an insulating layer formed on the metal layer, at least a first opening and at least a second opening formed in the first insulating layer, a dielectric layer formed in the first opening, a conductive mate...
02/28/2008
20070206342High Dielectric, Non-Linear Nano-Capacitor
A solid-state, low-voltage, non-linear nano-capacitor is described comprising a self-organized monolayer between two electrodes. The monolayer comprises an electron donor and electron acceptor separated by a conjugated bridge. ...
09/06/2007
20060285273Composite distributed dielectric structure
This invention discloses a composite distributed dielectric structure. It comprises one or more conductor layers, one or more dielectric layers distributed on the conductor layers, and one or more conductor traces distributed on the dielectric layers. One or more dielec...
12/21/2006
20060185140Method of making multilayered construction for use in resistors and capacitors
The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer ...
08/24/2006
20060143886Forming a substrate core with embedded capacitor and structures formed thereby
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first co...
07/06/2006
20060109606PROCESS FOR THE CONSTRAINED SINTERING OF A PSEUDO-SYMMETRICALLY CONFIGURED LOW TEMPERATURE COFIRED CERAMIC STRUCTURE
This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that ar...
05/25/2006
20050152094Capacitor including a dielectric layer having an inhomogeneous crystalline region and method of fabricating the same
In a capacitor, and a method of fabricating the same, the capacitor includes a lower electrode, a dielectric layer on the lower electrode, and an upper electrode on the dielectric layer, wherein the dielectric layer includes a lower dielectric region contacting the lowe...
07/14/2005
20050146840Structure of an interleaving striped capacitor substrate
An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses sev...
07/07/2005
20050146839Forming thin layer structures by ablation
An element having a predetermined thickness, such as a thin dielectric layer for a capacitor, is formed by directing light onto a region of a starting material towards a support structure so that said light ablates the starting material in said region and starting mater...
07/07/2005
20050117273Capacitor structure
A capacitor is configured by a bottom electrode BE, an inter-electrode dielectric D, and a top electrode TE. Directly under the bottom electrode BE, for example, silicon oxide (SiO2) is disposed, and directly above the top electrode TE as well, for example, s...
06/02/2005
20050099761Field converter for thrust generation
An apparatus for generating an inhomogeneous electric field that can produce thrust having a first electrode constructed of a first conducting material, a second electrode constructed of a second conducting material separated from but in proximity of the first electrode...
05/12/2005
20050068713Capacitor, method of manufacture thereof and semiconductor device
A capacitor includes a first electrode and a second electrode, and a dielectric layer sandwiched between the first electrode and the second electrode, wherein the dielectric layer includes Pb(ZrxTiyMz)O3 (where M is at least o...
03/31/2005
20050063141Analog capacitor having at least three high-k dielectric layers, and method of fabricating the same
There are provided an analog capacitor having at least three high-k dielectric layers, and a method of fabricating the same. The analog capacitor includes a lower electrode, an upper electrode, and at least three high-k dielectric layers interposed between the lower ele...
03/24/2005
20050063140MIM multilayer capacitor
Disclosed is a high-performance, RF-capable MIM capacitor structure and process for the manufacture thereof, which are compatible with discrete or integrated processes. The invention is compatible with standard semiconductor processing techniques and provides increased ...
03/24/2005
20050047060Laminated solid electrolytic capacitor and laminated transmission line device increased in element laminating number without deterioration of elements
In a laminated solid electrolytic capacitor comprising a plurality of solid electrolytic capacitor elements, first end regions of anode bodies of the solid electrolytic capacitor elements adjacent to each other are mechanically connected to each other through a spacer. ...
03/03/2005
20050018381Capacitor constructions and methods of forming
A capacitor construction includes a first electrode and a layer between the first electrode and a surface supporting the capacitor construction. The capacitor construction can exhibit a lower RC time constant compared to an otherwise identical capacitor construction lac...
01/27/2005
 
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